HK1071272A1 - A wiring board - Google Patents

A wiring board

Info

Publication number
HK1071272A1
HK1071272A1 HK05103833A HK05103833A HK1071272A1 HK 1071272 A1 HK1071272 A1 HK 1071272A1 HK 05103833 A HK05103833 A HK 05103833A HK 05103833 A HK05103833 A HK 05103833A HK 1071272 A1 HK1071272 A1 HK 1071272A1
Authority
HK
Hong Kong
Prior art keywords
wiring board
wiring
board
Prior art date
Application number
HK05103833A
Other languages
English (en)
Inventor
Akira Tsutsumi
Hideyuki Kurita
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1071272A1 publication Critical patent/HK1071272A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Magnetic Heads (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Insulated Conductors (AREA)
HK05103833A 1999-07-12 2005-05-06 A wiring board HK1071272A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19783499A JP4222690B2 (ja) 1999-07-12 1999-07-12 フレキシブル配線基板素片及び配線シート

Publications (1)

Publication Number Publication Date
HK1071272A1 true HK1071272A1 (en) 2005-07-08

Family

ID=16381131

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05103833A HK1071272A1 (en) 1999-07-12 2005-05-06 A wiring board

Country Status (6)

Country Link
US (1) US6420659B1 (zh)
JP (1) JP4222690B2 (zh)
KR (1) KR100503977B1 (zh)
CN (2) CN1291628C (zh)
HK (1) HK1071272A1 (zh)
TW (1) TW451225B (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4277455B2 (ja) * 2001-02-27 2009-06-10 Ｔｄｋ株式会社 ヘッドジンバルアセンブリ
JP4605945B2 (ja) * 2001-06-28 2011-01-05 京セラ株式会社 多数個取り配線基板、電子装置の製造方法
US6924496B2 (en) * 2002-05-31 2005-08-02 Fujitsu Limited Fingerprint sensor and interconnect
US7035050B1 (en) * 2002-06-03 2006-04-25 Magnecomp Corporation Flexible circuit laminate shunt for disk drive suspensions
US7220920B1 (en) * 2004-01-23 2007-05-22 Hutchinson Technology Incorporated Flexible electrical circuit with slotted coverlay
JP2006049751A (ja) * 2004-08-09 2006-02-16 Hitachi Global Storage Technologies Netherlands Bv 磁気ディスク装置と、その配線接続構造及び端子構造
JP4260098B2 (ja) * 2004-11-04 2009-04-30 三井金属鉱業株式会社 プラズマディスプレイ用プリント配線基板およびその製造方法
US8085507B2 (en) * 2005-01-13 2011-12-27 Hitachi Global Storage Technologies, Netherlands, B.V. Method and apparatus for forming an opening in a base-metal layer of an electrical lead suspension (ELS) to increase the impedance
US7433157B2 (en) * 2005-01-13 2008-10-07 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for reducing solder pad size in an electrical lead suspension (ELS) to decrease signal path capacitive discontinuities
US7450346B2 (en) * 2005-01-18 2008-11-11 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension
US20060158784A1 (en) * 2005-01-18 2006-07-20 Arya Satya P Method and apparatus for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension
JP4799902B2 (ja) * 2005-04-27 2011-10-26 日東電工株式会社 配線回路基板および配線回路基板の製造方法
US7646567B2 (en) * 2005-06-28 2010-01-12 Seagate Technology Llc Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects
JP4549939B2 (ja) * 2005-06-28 2010-09-22 日東電工株式会社 配線回路基板保持シート
JP4640815B2 (ja) * 2005-10-11 2011-03-02 日東電工株式会社 配線回路基板集合体シートおよびその製造方法
CN100379321C (zh) * 2005-12-27 2008-04-02 友达光电股份有限公司 阵列基板及其制造方法
KR100676082B1 (ko) * 2005-12-29 2007-02-01 디케이 유아이엘 주식회사 연성회로기판 제조방법
KR100809218B1 (ko) 2006-08-16 2008-02-29 삼성전기주식회사 절단이 용이한 브리지를 갖는 어레이 기판
JP5227531B2 (ja) * 2007-03-30 2013-07-03 日本発條株式会社 ディスク装置用サスペンション
JP2009129490A (ja) * 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP5345023B2 (ja) * 2009-08-28 2013-11-20 日東電工株式会社 配線回路基板およびその製造方法
JP5672911B2 (ja) * 2010-01-25 2015-02-18 大日本印刷株式会社 サスペンション用基板、外枠付サスペンション用基板、サスペンション用基板の製造方法、外枠付サスペンション用基板の製造方法、サスペンション、素子付サスペンションおよびハードディスクドライブ
GB2482860A (en) * 2010-07-28 2012-02-22 In2Tec Ltd Flexible twisted-pair wiring system
JP5075970B2 (ja) * 2010-11-30 2012-11-21 株式会社東芝 ヘッドジンバルアッセンブリおよびこれを備えたディスク装置
JP6125145B2 (ja) * 2011-07-04 2017-05-10 日本発條株式会社 配線回路基板
CN104078055B (zh) * 2013-03-29 2018-10-26 东莞新科技术研究开发有限公司 挠性件及其制造方法、磁头折片组合以及磁盘驱动器
JP6573215B2 (ja) * 2016-01-27 2019-09-11 株式会社オートネットワーク技術研究所 回路構成体
US9807872B2 (en) * 2016-03-09 2017-10-31 Panasonic Liquid Crystal Display Co., Ltd. Circuit board and display device
JP2019169215A (ja) * 2018-03-22 2019-10-03 株式会社東芝 ディスク装置のフレキシブル配線基板およびこれを備えるディスク装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685341B2 (ja) * 1991-09-27 1994-10-26 帝国通信工業株式会社 フレキシブル基板の端子構造
JP2855414B2 (ja) * 1995-04-13 1999-02-10 日本メクトロン株式会社 磁気ヘッド用中継基板及びその製造法
JP3015712B2 (ja) * 1995-06-30 2000-03-06 日東電工株式会社 フィルムキャリアおよびそれを用いてなる半導体装置
JP3206428B2 (ja) * 1996-04-09 2001-09-10 ティーディーケイ株式会社 ヘッドジンバルアセンブリを具備するハードディスク装置

Also Published As

Publication number Publication date
TW451225B (en) 2001-08-21
KR20010015295A (ko) 2001-02-26
US6420659B1 (en) 2002-07-16
CN1280370A (zh) 2001-01-17
JP2001024291A (ja) 2001-01-26
CN1545374A (zh) 2004-11-10
CN1179355C (zh) 2004-12-08
JP4222690B2 (ja) 2009-02-12
CN1291628C (zh) 2006-12-20
KR100503977B1 (ko) 2005-07-27

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150711