HK1064804A1 - Electric device producing method - Google Patents

Electric device producing method

Info

Publication number
HK1064804A1
HK1064804A1 HK04107600.3A HK04107600A HK1064804A1 HK 1064804 A1 HK1064804 A1 HK 1064804A1 HK 04107600 A HK04107600 A HK 04107600A HK 1064804 A1 HK1064804 A1 HK 1064804A1
Authority
HK
Hong Kong
Prior art keywords
electric device
producing method
device producing
electric
producing
Prior art date
Application number
HK04107600.3A
Other languages
English (en)
Inventor
Hiroyuki Kumakura
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1064804A1 publication Critical patent/HK1064804A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
HK04107600.3A 2001-02-26 2004-10-04 Electric device producing method HK1064804A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001049615A JP3665579B2 (ja) 2001-02-26 2001-02-26 電気装置製造方法
PCT/JP2002/001284 WO2002071469A1 (fr) 2001-02-26 2002-02-15 Procede de production de dispositifs electriques

Publications (1)

Publication Number Publication Date
HK1064804A1 true HK1064804A1 (en) 2005-02-04

Family

ID=18910693

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04107600.3A HK1064804A1 (en) 2001-02-26 2004-10-04 Electric device producing method

Country Status (7)

Country Link
US (1) US7341642B2 (ja)
JP (1) JP3665579B2 (ja)
KR (1) KR100790671B1 (ja)
CN (1) CN100392832C (ja)
HK (1) HK1064804A1 (ja)
TW (1) TW523885B (ja)
WO (1) WO2002071469A1 (ja)

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US20080055581A1 (en) * 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7943491B2 (en) * 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US7799699B2 (en) * 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
JP2008502151A (ja) 2004-06-04 2008-01-24 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 印刷可能半導体素子を製造して組み立てるための方法及びデバイス
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JP5020629B2 (ja) * 2006-12-28 2012-09-05 パナソニック株式会社 電子部品の接続方法
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WO2009001605A1 (ja) * 2007-06-26 2008-12-31 Sony Chemical & Information Device Corporation 異方性導電材料、接続構造体及びその製造方法
JP5093482B2 (ja) * 2007-06-26 2012-12-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電材料、接続構造体及びその製造方法
JP4998732B2 (ja) 2007-10-22 2012-08-15 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤
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US20040079464A1 (en) 2004-04-29
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