HK1064324A1 - Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner - Google Patents
Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditionerInfo
- Publication number
- HK1064324A1 HK1064324A1 HK04107147A HK04107147A HK1064324A1 HK 1064324 A1 HK1064324 A1 HK 1064324A1 HK 04107147 A HK04107147 A HK 04107147A HK 04107147 A HK04107147 A HK 04107147A HK 1064324 A1 HK1064324 A1 HK 1064324A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- cmp conditioner
- abrasive grains
- support member
- hard abrasive
- cmp
- Prior art date
Links
- 239000006061 abrasive grain Substances 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000388994A JP3598062B2 (ja) | 2000-12-21 | 2000-12-21 | Cmpドレッサー、cmpドレッサーに使用する硬質砥粒の配列方法、及びcmpドレッサーの製造方法 |
JP2001262167A JP2003071718A (ja) | 2001-08-30 | 2001-08-30 | Cmpコンディショナー、cmpコンディショナーに使用する硬質砥粒の配列方法、及びcmpコンディショナー製造方法 |
PCT/JP2001/011209 WO2002049807A1 (fr) | 2000-12-21 | 2001-12-20 | Conditionneur pour polissage chimico-mecanique, procede pour agencer des grains rigides utilises dans un conditionneur pour polissage chimico-mecanique, et procede pour produire un conditionneur pour polissage chimico-mecanique |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1064324A1 true HK1064324A1 (en) | 2005-01-28 |
Family
ID=26606289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04107147A HK1064324A1 (en) | 2000-12-21 | 2004-09-17 | Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner |
Country Status (8)
Country | Link |
---|---|
US (2) | US20040072510A1 (fr) |
EP (1) | EP1346797B1 (fr) |
KR (1) | KR100552391B1 (fr) |
CN (1) | CN100361786C (fr) |
DE (1) | DE60124424T2 (fr) |
HK (1) | HK1064324A1 (fr) |
TW (1) | TW575477B (fr) |
WO (1) | WO2002049807A1 (fr) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
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US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
TWI238753B (en) | 2002-12-19 | 2005-09-01 | Miyanaga Kk | Diamond disk for grinding |
JP2005313310A (ja) * | 2004-03-31 | 2005-11-10 | Mitsubishi Materials Corp | Cmpコンディショナ |
US20060258276A1 (en) * | 2005-05-16 | 2006-11-16 | Chien-Min Sung | Superhard cutters and associated methods |
US7658666B2 (en) * | 2004-08-24 | 2010-02-09 | Chien-Min Sung | Superhard cutters and associated methods |
US7762872B2 (en) * | 2004-08-24 | 2010-07-27 | Chien-Min Sung | Superhard cutters and associated methods |
US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US8622787B2 (en) | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US8678878B2 (en) * | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
KR100723436B1 (ko) * | 2005-12-29 | 2007-05-30 | 삼성전자주식회사 | 연마패드의 컨디셔너 및 이를 구비하는 화학기계적연마장치 |
US20080271384A1 (en) * | 2006-09-22 | 2008-11-06 | Saint-Gobain Ceramics & Plastics, Inc. | Conditioning tools and techniques for chemical mechanical planarization |
US7959694B2 (en) * | 2007-03-05 | 2011-06-14 | 3M Innovative Properties Company | Laser cut abrasive article, and methods |
US8080072B2 (en) | 2007-03-05 | 2011-12-20 | 3M Innovative Properties Company | Abrasive article with supersize coating, and methods |
TW200906546A (en) * | 2007-08-07 | 2009-02-16 | Tian-Yuan Yan | Adjusting device for resin-bonded polishing pad and manufacturing method thereof |
CN104708539A (zh) * | 2007-09-28 | 2015-06-17 | 宋健民 | 具有镶嵌研磨块的cmp衬垫修整器和相关方法 |
KR20100106328A (ko) | 2007-11-13 | 2010-10-01 | 치엔 민 성 | Cmp 패드 드레서 |
TWI388402B (en) | 2007-12-06 | 2013-03-11 | Methods for orienting superabrasive particles on a surface and associated tools | |
JP5255860B2 (ja) * | 2008-02-20 | 2013-08-07 | 新日鉄住金マテリアルズ株式会社 | 研磨布用ドレッサー |
JP2009302136A (ja) * | 2008-06-10 | 2009-12-24 | Panasonic Corp | 半導体集積回路 |
WO2009158507A2 (fr) * | 2008-06-26 | 2009-12-30 | Saint-Gobain Abrasives, Inc. | Conditionneur pour tampon de planarisation chimico-mécanique et procédé de formation correspondant |
EP2411181A1 (fr) | 2009-03-24 | 2012-02-01 | Saint-Gobain Abrasives, Inc. | Outil abrasif à utiliser comme conditionneur de tampon pour polissage mécano-chimique |
US20110104989A1 (en) * | 2009-04-30 | 2011-05-05 | First Principles LLC | Dressing bar for embedding abrasive particles into substrates |
US8801497B2 (en) * | 2009-04-30 | 2014-08-12 | Rdc Holdings, Llc | Array of abrasive members with resilient support |
US9221148B2 (en) | 2009-04-30 | 2015-12-29 | Rdc Holdings, Llc | Method and apparatus for processing sliders for disk drives, and to various processing media for the same |
WO2010141464A2 (fr) | 2009-06-02 | 2010-12-09 | Saint-Gobain Abrasives, Inc. | Outils de conditionnement cmp résistants à la corrosion et leurs procédés de fabrication et d'utilisation |
US20100330890A1 (en) * | 2009-06-30 | 2010-12-30 | Zine-Eddine Boutaghou | Polishing pad with array of fluidized gimballed abrasive members |
CN102612734A (zh) | 2009-09-01 | 2012-07-25 | 圣戈班磨料磨具有限公司 | 化学机械抛光修整器 |
KR101091030B1 (ko) * | 2010-04-08 | 2011-12-09 | 이화다이아몬드공업 주식회사 | 감소된 마찰력을 갖는 패드 컨디셔너 제조방법 |
TWI464839B (zh) | 2010-09-21 | 2014-12-11 | Ritedia Corp | 單層鑽石顆粒散熱器及其相關方法 |
EP4086043A1 (fr) * | 2011-02-16 | 2022-11-09 | 3M Innovative Properties Company | Procédé de fabrication d'un article revêtu abrasif doté de particules abrasives de céramique alignées en rotation et formées |
CN103329253B (zh) | 2011-05-23 | 2016-03-30 | 宋健民 | 具有平坦化尖端的化学机械研磨垫修整器 |
USD686255S1 (en) * | 2011-05-25 | 2013-07-16 | Saint-Gobain Abrasives, Inc. | Abrasive disc with a distribution of holes |
USD687471S1 (en) * | 2011-05-25 | 2013-08-06 | Saint-Gobain Abrasives, Inc. | Abrasive disc with a distribution of holes |
USD689913S1 (en) * | 2011-05-25 | 2013-09-17 | Saint-Gobain Abrasives, Inc. | Abrasive disc with a distribution of holes |
USD689912S1 (en) * | 2011-05-25 | 2013-09-17 | Saint-Gobain Abrasives, Inc. | Abrasive disc with a distribution of holes |
KR101413530B1 (ko) * | 2012-07-02 | 2014-08-06 | 신한다이아몬드공업(주) | Cmp 패드 컨디셔너 및 그 제조방법 |
US9204693B2 (en) | 2012-08-20 | 2015-12-08 | Forever Mount, LLC | Brazed joint for attachment of gemstones to each other and/or a metallic mount |
KR102008782B1 (ko) * | 2013-01-30 | 2019-08-08 | 새솔다이아몬드공업 주식회사 | 패드 컨디셔너 및 그의 제조방법 |
USD748352S1 (en) * | 2013-12-12 | 2016-01-26 | Whirlpool Corporation | Sprayer for dishwasher |
JP6602540B2 (ja) * | 2015-02-10 | 2019-11-06 | 日鉄ケミカル&マテリアル株式会社 | 板ガラス用工具 |
GB201504759D0 (en) | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
TWI616279B (zh) | 2016-08-01 | 2018-03-01 | 中國砂輪企業股份有限公司 | Chemical mechanical polishing dresser and manufacturing method thereof |
USD816132S1 (en) * | 2016-09-08 | 2018-04-24 | Mirka Ltd | Abrasive disc |
USD816131S1 (en) * | 2016-09-08 | 2018-04-24 | Mirka Ltd | Abrasive disc |
JP1624794S (fr) * | 2018-07-24 | 2019-02-18 | ||
JP1624793S (fr) | 2018-07-24 | 2019-02-18 | ||
JP1624795S (fr) | 2018-07-24 | 2019-02-18 | ||
DK180350B1 (da) * | 2019-09-18 | 2021-01-22 | Flex Trim As | Slibeelement til brug i roterende slibe- eller pudseværktøj |
Family Cites Families (15)
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JPS6076965A (ja) * | 1983-09-30 | 1985-05-01 | Komatsu Ltd | 砥石の製造法 |
DE3435595A1 (de) * | 1983-09-30 | 1985-04-18 | Kabushiki Kaisha Komatsu Seisakusho, Tokio/Tokyo | Verfahren zur herstellung von schleifsteinen |
JPH04250978A (ja) * | 1990-12-28 | 1992-09-07 | Toyoda Mach Works Ltd | 電着砥石の製造方法 |
US6371838B1 (en) * | 1996-07-15 | 2002-04-16 | Speedfam-Ipec Corporation | Polishing pad conditioning device with cutting elements |
KR100328108B1 (ko) * | 1996-10-15 | 2002-03-09 | 아사무라 타카싯 | 반도체 기판용 연마패드의 드레서, 그 제조방법 및 그것을 사용한 화학적 기계적 연마방법 |
JPH10193269A (ja) * | 1996-12-27 | 1998-07-28 | Asahi Diamond Ind Co Ltd | 電着工具及びその製造方法 |
US6368198B1 (en) * | 1999-11-22 | 2002-04-09 | Kinik Company | Diamond grid CMP pad dresser |
US6537140B1 (en) * | 1997-05-14 | 2003-03-25 | Saint-Gobain Abrasives Technology Company | Patterned abrasive tools |
US6093280A (en) * | 1997-08-18 | 2000-07-25 | Lsi Logic Corporation | Chemical-mechanical polishing pad conditioning systems |
JPH1177535A (ja) * | 1997-09-09 | 1999-03-23 | Asahi Diamond Ind Co Ltd | コンディショナ及びその製造方法 |
KR19990081117A (ko) * | 1998-04-25 | 1999-11-15 | 윤종용 | 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법 |
JP2000106353A (ja) * | 1998-07-31 | 2000-04-11 | Nippon Steel Corp | 半導体基板用研磨布のドレッサ― |
JP2000052254A (ja) * | 1998-08-07 | 2000-02-22 | Mitsubishi Heavy Ind Ltd | 超薄膜砥石及び超薄膜砥石の製造方法及び超薄膜砥石による切断方法 |
US6439986B1 (en) * | 1999-10-12 | 2002-08-27 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
US6517424B2 (en) * | 2000-03-10 | 2003-02-11 | Abrasive Technology, Inc. | Protective coatings for CMP conditioning disk |
-
2001
- 2001-12-20 US US10/451,644 patent/US20040072510A1/en not_active Abandoned
- 2001-12-20 CN CNB018210228A patent/CN100361786C/zh not_active Expired - Fee Related
- 2001-12-20 KR KR1020037007698A patent/KR100552391B1/ko not_active IP Right Cessation
- 2001-12-20 EP EP01271276A patent/EP1346797B1/fr not_active Expired - Lifetime
- 2001-12-20 WO PCT/JP2001/011209 patent/WO2002049807A1/fr active IP Right Grant
- 2001-12-20 DE DE60124424T patent/DE60124424T2/de not_active Expired - Lifetime
- 2001-12-21 TW TW090131889A patent/TW575477B/zh not_active IP Right Cessation
-
2004
- 2004-09-17 HK HK04107147A patent/HK1064324A1/xx not_active IP Right Cessation
-
2006
- 2006-03-20 US US11/385,297 patent/US7465217B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1346797B1 (fr) | 2006-11-08 |
WO2002049807A1 (fr) | 2002-06-27 |
CN100361786C (zh) | 2008-01-16 |
US20040072510A1 (en) | 2004-04-15 |
KR100552391B1 (ko) | 2006-02-20 |
US20060160477A1 (en) | 2006-07-20 |
DE60124424D1 (de) | 2006-12-21 |
DE60124424T2 (de) | 2007-10-04 |
EP1346797A1 (fr) | 2003-09-24 |
TW575477B (en) | 2004-02-11 |
US7465217B2 (en) | 2008-12-16 |
KR20030063408A (ko) | 2003-07-28 |
CN1482959A (zh) | 2004-03-17 |
EP1346797A4 (fr) | 2004-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20131220 |