HK1064324A1 - Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner - Google Patents

Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner

Info

Publication number
HK1064324A1
HK1064324A1 HK04107147A HK04107147A HK1064324A1 HK 1064324 A1 HK1064324 A1 HK 1064324A1 HK 04107147 A HK04107147 A HK 04107147A HK 04107147 A HK04107147 A HK 04107147A HK 1064324 A1 HK1064324 A1 HK 1064324A1
Authority
HK
Hong Kong
Prior art keywords
cmp conditioner
abrasive grains
support member
hard abrasive
cmp
Prior art date
Application number
HK04107147A
Other languages
English (en)
Inventor
Toshiya Kinoshita
Eiji Hashino
Setsuo Sato
Ryuichi Araki
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000388994A external-priority patent/JP3598062B2/ja
Priority claimed from JP2001262167A external-priority patent/JP2003071718A/ja
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of HK1064324A1 publication Critical patent/HK1064324A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
HK04107147A 2000-12-21 2004-09-17 Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner HK1064324A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000388994A JP3598062B2 (ja) 2000-12-21 2000-12-21 Ｃｍｐドレッサー、ｃｍｐドレッサーに使用する硬質砥粒の配列方法、及びｃｍｐドレッサーの製造方法
JP2001262167A JP2003071718A (ja) 2001-08-30 2001-08-30 Ｃｍｐコンディショナー、ｃｍｐコンディショナーに使用する硬質砥粒の配列方法、及びｃｍｐコンディショナー製造方法
PCT/JP2001/011209 WO2002049807A1 (fr) 2000-12-21 2001-12-20 Conditionneur pour polissage chimico-mecanique, procede pour agencer des grains rigides utilises dans un conditionneur pour polissage chimico-mecanique, et procede pour produire un conditionneur pour polissage chimico-mecanique

Publications (1)

Publication Number Publication Date
HK1064324A1 true HK1064324A1 (en) 2005-01-28

Family

ID=26606289

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04107147A HK1064324A1 (en) 2000-12-21 2004-09-17 Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner

Country Status (8)

Country Link
US (2) US20040072510A1 (xx)
EP (1) EP1346797B1 (xx)
KR (1) KR100552391B1 (xx)
CN (1) CN100361786C (xx)
DE (1) DE60124424T2 (xx)
HK (1) HK1064324A1 (xx)
TW (1) TW575477B (xx)
WO (1) WO2002049807A1 (xx)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
TWI238753B (en) 2002-12-19 2005-09-01 Miyanaga Kk Diamond disk for grinding
JP2005313310A (ja) * 2004-03-31 2005-11-10 Mitsubishi Materials Corp Ｃｍｐコンディショナ
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7658666B2 (en) * 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8678878B2 (en) * 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
KR100723436B1 (ko) 2005-12-29 2007-05-30 삼성전자주식회사 연마패드의 컨디셔너 및 이를 구비하는 화학기계적연마장치
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US8080072B2 (en) 2007-03-05 2011-12-20 3M Innovative Properties Company Abrasive article with supersize coating, and methods
US7959694B2 (en) * 2007-03-05 2011-06-14 3M Innovative Properties Company Laser cut abrasive article, and methods
TW200906546A (en) * 2007-08-07 2009-02-16 Tian-Yuan Yan Adjusting device for resin-bonded polishing pad and manufacturing method thereof
WO2009043058A2 (en) * 2007-09-28 2009-04-02 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
CN101903131B (zh) 2007-11-13 2013-01-02 宋健民 Cmp垫修整器
TWI388402B (en) 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
JP5255860B2 (ja) * 2008-02-20 2013-08-07 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
JP2009302136A (ja) * 2008-06-10 2009-12-24 Panasonic Corp 半導体集積回路
WO2009158507A2 (en) * 2008-06-26 2009-12-30 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and method of forming
KR101293517B1 (ko) 2009-03-24 2013-08-07 생-고벵 아브라시프 화학적 기계적 평탄화 패드 컨디셔너로 사용되는 연마 공구
US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US20110104989A1 (en) * 2009-04-30 2011-05-05 First Principles LLC Dressing bar for embedding abrasive particles into substrates
US8801497B2 (en) 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
MY155563A (en) 2009-06-02 2015-10-30 Saint Gobain Abrasives Inc Corrosion-resistant cmp conditioning tools and methods for making and using same
US20100330890A1 (en) * 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
CN102612734A (zh) 2009-09-01 2012-07-25 圣戈班磨料磨具有限公司 化学机械抛光修整器
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
TWI464839B (zh) 2010-09-21 2014-12-11 Ritedia Corp 單層鑽石顆粒散熱器及其相關方法
CA2827223C (en) 2011-02-16 2020-01-07 3M Innovative Properties Company Coated abrasive article having rotationally aligned formed ceramic abrasive particles and method of making
TWI487019B (en) 2011-05-23 2015-06-01 Cmp pad dresser having leveled tips and associated methods
USD686255S1 (en) * 2011-05-25 2013-07-16 Saint-Gobain Abrasives, Inc. Abrasive disc with a distribution of holes
USD687471S1 (en) * 2011-05-25 2013-08-06 Saint-Gobain Abrasives, Inc. Abrasive disc with a distribution of holes
USD689913S1 (en) * 2011-05-25 2013-09-17 Saint-Gobain Abrasives, Inc. Abrasive disc with a distribution of holes
USD689912S1 (en) * 2011-05-25 2013-09-17 Saint-Gobain Abrasives, Inc. Abrasive disc with a distribution of holes
KR101413530B1 (ko) * 2012-07-02 2014-08-06 신한다이아몬드공업(주) Ｃｍｐ 패드 컨디셔너 및 그 제조방법
EP2884865B1 (en) 2012-08-20 2017-12-27 Forever Mount, LLC A brazed joint for attachment of gemstones
KR102008782B1 (ko) * 2013-01-30 2019-08-08 새솔다이아몬드공업 주식회사 패드 컨디셔너 및 그의 제조방법
USD748352S1 (en) * 2013-12-12 2016-01-26 Whirlpool Corporation Sprayer for dishwasher
JP6602540B2 (ja) * 2015-02-10 2019-11-06 日鉄ケミカル＆マテリアル株式会社 板ガラス用工具
GB201504759D0 (en) 2015-03-20 2015-05-06 Rolls Royce Plc Abrading tool for a rotary dresser
TWI616279B (zh) 2016-08-01 2018-03-01 中國砂輪企業股份有限公司 Chemical mechanical polishing dresser and manufacturing method thereof
USD816131S1 (en) * 2016-09-08 2018-04-24 Mirka Ltd Abrasive disc
USD816132S1 (en) * 2016-09-08 2018-04-24 Mirka Ltd Abrasive disc
JP1624795S (xx) 2018-07-24 2019-02-18
JP1624793S (xx) 2018-07-24 2019-02-18
JP1624794S (xx) * 2018-07-24 2019-02-18
DK180350B1 (da) * 2019-09-18 2021-01-22 Flex Trim As Slibeelement til brug i roterende slibe- eller pudseværktøj

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435595A1 (de) * 1983-09-30 1985-04-18 Kabushiki Kaisha Komatsu Seisakusho, Tokio/Tokyo Verfahren zur herstellung von schleifsteinen
JPS6076965A (ja) * 1983-09-30 1985-05-01 Komatsu Ltd 砥石の製造法
JPH04250978A (ja) * 1990-12-28 1992-09-07 Toyoda Mach Works Ltd 電着砥石の製造方法
US6371838B1 (en) * 1996-07-15 2002-04-16 Speedfam-Ipec Corporation Polishing pad conditioning device with cutting elements
KR100328108B1 (ko) * 1996-10-15 2002-03-09 아사무라 타카싯 반도체 기판용 연마패드의 드레서, 그 제조방법 및 그것을 사용한 화학적 기계적 연마방법
JPH10193269A (ja) * 1996-12-27 1998-07-28 Asahi Diamond Ind Co Ltd 電着工具及びその製造方法
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US6537140B1 (en) * 1997-05-14 2003-03-25 Saint-Gobain Abrasives Technology Company Patterned abrasive tools
US6093280A (en) * 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
JPH1177535A (ja) * 1997-09-09 1999-03-23 Asahi Diamond Ind Co Ltd コンディショナ及びその製造方法
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
JP2000106353A (ja) * 1998-07-31 2000-04-11 Nippon Steel Corp 半導体基板用研磨布のドレッサ―
JP2000052254A (ja) * 1998-08-07 2000-02-22 Mitsubishi Heavy Ind Ltd 超薄膜砥石及び超薄膜砥石の製造方法及び超薄膜砥石による切断方法
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
US6517424B2 (en) * 2000-03-10 2003-02-11 Abrasive Technology, Inc. Protective coatings for CMP conditioning disk

Also Published As

Publication number Publication date
EP1346797B1 (en) 2006-11-08
KR20030063408A (ko) 2003-07-28
WO2002049807A1 (fr) 2002-06-27
US7465217B2 (en) 2008-12-16
DE60124424T2 (de) 2007-10-04
KR100552391B1 (ko) 2006-02-20
EP1346797A1 (en) 2003-09-24
US20040072510A1 (en) 2004-04-15
TW575477B (en) 2004-02-11
CN1482959A (zh) 2004-03-17
EP1346797A4 (en) 2004-08-11
CN100361786C (zh) 2008-01-16
DE60124424D1 (de) 2006-12-21
US20060160477A1 (en) 2006-07-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20131220