HK1017228A1 - Device and method for mounting electronic parts - Google Patents

Device and method for mounting electronic parts

Info

Publication number
HK1017228A1
HK1017228A1 HK99102132A HK99102132A HK1017228A1 HK 1017228 A1 HK1017228 A1 HK 1017228A1 HK 99102132 A HK99102132 A HK 99102132A HK 99102132 A HK99102132 A HK 99102132A HK 1017228 A1 HK1017228 A1 HK 1017228A1
Authority
HK
Hong Kong
Prior art keywords
electronic parts
mounting electronic
mounting
parts
electronic
Prior art date
Application number
HK99102132A
Other languages
English (en)
Inventor
Yasuhiro Kashiwagi
Kazuhide Nagao
Jun Yamauti
Takeshi Morita
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07307084A external-priority patent/JP3139349B2/ja
Priority claimed from JP00707496A external-priority patent/JP3171088B2/ja
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of HK1017228A1 publication Critical patent/HK1017228A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
HK99102132A 1995-11-27 1999-05-12 Device and method for mounting electronic parts HK1017228A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP07307084A JP3139349B2 (ja) 1995-11-27 1995-11-27 電子部品供給装置、電子部品実装装置及び電子部品供給方法
JP00707496A JP3171088B2 (ja) 1996-01-19 1996-01-19 電子部品実装装置及び電子部品実装方法
PCT/JP1996/003411 WO1997020455A1 (fr) 1995-11-27 1996-11-21 Dispositif et procede de montage de composants electroniques

Publications (1)

Publication Number Publication Date
HK1017228A1 true HK1017228A1 (en) 1999-11-12

Family

ID=26341326

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99102132A HK1017228A1 (en) 1995-11-27 1999-05-12 Device and method for mounting electronic parts

Country Status (6)

Country Link
US (1) US6176007B1 (ko)
KR (1) KR100391534B1 (ko)
CN (1) CN1096224C (ko)
HK (1) HK1017228A1 (ko)
TW (1) TW443701U (ko)
WO (1) WO1997020455A1 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065392A (ja) * 1996-08-19 1998-03-06 Matsushita Electric Ind Co Ltd 電子部品供給装置及び電子部品実装方法
JP3459534B2 (ja) * 1997-03-27 2003-10-20 株式会社日立ハイテクインスツルメンツ 電子部品装着装置における部品供給装置
JP4145489B2 (ja) * 1997-08-29 2008-09-03 松下電器産業株式会社 部品装着方法及び部品装着装置
JP3659003B2 (ja) 1998-07-03 2005-06-15 松下電器産業株式会社 電子部品実装方法
US6701610B1 (en) 1998-07-28 2004-03-09 Koninklijke Philips Electronics N.V. Pick and place machine with varied nozzle lengths
KR100445530B1 (ko) * 1999-05-10 2004-08-21 미래산업 주식회사 반도체장치
DE60139801D1 (de) * 2000-02-17 2009-10-15 Panasonic Corp Vorrichtung und verfahren zur elektrischen bauteilbestückung
EP1253817A3 (en) * 2001-04-23 2003-07-09 Liconic Ag Apparatus for picking and placing small objects
DE10225430A1 (de) * 2002-06-07 2003-12-24 Siemens Ag Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen
DE10303261A1 (de) * 2003-01-28 2004-08-12 Siemens Ag Bestückkopf mit Greifern für elektrische Bauelemente
JP4390503B2 (ja) * 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
KR100555579B1 (ko) * 2003-11-17 2006-03-03 주식회사 프로텍 트레이 피더
NL1028824C2 (nl) * 2005-04-20 2006-10-23 Fico Bv Werkwijze en inrichting voor het verplaatsen van in een rechthoekige structuur gerangschikte elektronische componenten.
CN101589658B (zh) * 2007-01-25 2012-06-13 松下电器产业株式会社 堆垛托盘供给装置及供给方法、以及部件安装装置及方法
JP5685496B2 (ja) * 2011-06-28 2015-03-18 富士機械製造株式会社 電子回路部品装着システム
US10143119B2 (en) * 2013-06-03 2018-11-27 Fuji Corporation Nozzle management system
EP3136832B1 (en) * 2014-04-22 2020-11-18 FUJI Corporation Load measurement method and recovery method
JP6491515B2 (ja) 2015-03-31 2019-03-27 キヤノン株式会社 自動組立装置及び自動組立方法
CN106393087A (zh) * 2016-06-30 2017-02-15 泰马克精密铸造（苏州）有限公司 机械手的翻转机构
JP6833977B2 (ja) * 2017-03-30 2021-02-24 株式会社Ｆｕｊｉ 実装システム
US11363748B2 (en) 2017-08-22 2022-06-14 Universal Instruments Corporation Printed circuit board transport
JP2019075466A (ja) * 2017-10-16 2019-05-16 パナソニックＩｐマネジメント株式会社 製造作業装置
CN107790847B (zh) * 2017-12-01 2024-09-10 苏州慧捷自动化科技有限公司 一种全自动双拾取模组高速填盘机
CN114130695B (zh) * 2021-11-29 2023-12-22 苏州乾鸣半导体设备有限公司 一种检测芯片表面的检测设备
KR102488818B1 (ko) 2022-04-25 2023-01-17 (주)제이앤씨 다차종 차체 용접용 지그장치
KR102488819B1 (ko) 2022-05-03 2023-01-18 (주)제이앤씨 가변 구조의 차체 용접용 지그장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3586105D1 (de) * 1985-11-27 1992-06-25 Matsushita Electric Ind Co Ltd Montagevorrichtung.
JPH07105624B2 (ja) * 1987-10-30 1995-11-13 松下電器産業株式会社 電子部品装着機
US5342460A (en) * 1989-06-13 1994-08-30 Matsushita Electric Industrial Co., Ltd. Outer lead bonding apparatus
JPH04241498A (ja) * 1991-01-16 1992-08-28 Sharp Corp 電子部品の自動挿入装置
JPH04354400A (ja) * 1991-05-31 1992-12-08 Sharp Corp Ｌｓｉ実装装置
JPH05304396A (ja) * 1991-07-12 1993-11-16 Canon Inc 部品の実装順序の決定方法及びその装置
JPH066084A (ja) * 1992-06-19 1994-01-14 Olympus Optical Co Ltd 電子部品自動実装機
JPH06247512A (ja) * 1993-02-24 1994-09-06 Kubota Corp 電子部品の自動装着装置におけるトレー供給装置
JPH0715171A (ja) * 1993-06-28 1995-01-17 Matsushita Electric Ind Co Ltd 部品装着装置
JPH0846388A (ja) * 1994-08-03 1996-02-16 Matsushita Electric Ind Co Ltd 部品実装装置
JP3469652B2 (ja) * 1994-09-26 2003-11-25 富士機械製造株式会社 電子部品装着装置
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
CN1091341C (zh) * 1995-02-17 2002-09-18 松下电器产业株式会社 电子元件装配方法及装置
JPH08236989A (ja) * 1995-02-28 1996-09-13 Nippondenso Co Ltd 部品供給装置
US5651176A (en) * 1995-06-30 1997-07-29 Ma Laboratories, Inc. Vibratory feeder trays and synchronous mass production apparatus for circuit board fabrication

Also Published As

Publication number Publication date
KR100391534B1 (ko) 2003-08-19
US6176007B1 (en) 2001-01-23
CN1203015A (zh) 1998-12-23
TW443701U (en) 2001-06-23
KR19990071654A (ko) 1999-09-27
CN1096224C (zh) 2002-12-11
WO1997020455A1 (fr) 1997-06-05

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20091121