HK1011458A1 - Substrate provided with electric lines and its manufacturing method - Google Patents

Substrate provided with electric lines and its manufacturing method

Info

Publication number
HK1011458A1
HK1011458A1 HK98112231A HK98112231A HK1011458A1 HK 1011458 A1 HK1011458 A1 HK 1011458A1 HK 98112231 A HK98112231 A HK 98112231A HK 98112231 A HK98112231 A HK 98112231A HK 1011458 A1 HK1011458 A1 HK 1011458A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
substrate provided
electric lines
lines
electric
Prior art date
Application number
HK98112231A
Other languages
English (en)
Inventor
Masaharu Shirai
Kimihiro Yamanaka
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of HK1011458A1 publication Critical patent/HK1011458A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK98112231A 1991-05-31 1998-11-24 Substrate provided with electric lines and its manufacturing method HK1011458A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3156123A JPH04354398A (ja) 1991-05-31 1991-05-31 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
HK1011458A1 true HK1011458A1 (en) 1999-07-09

Family

ID=15620829

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98112231A HK1011458A1 (en) 1991-05-31 1998-11-24 Substrate provided with electric lines and its manufacturing method

Country Status (5)

Country Link
US (2) US5252781A (xx)
EP (1) EP0516402B1 (xx)
JP (1) JPH04354398A (xx)
DE (1) DE69222356T2 (xx)
HK (1) HK1011458A1 (xx)

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CA2055148C (en) * 1991-10-25 2002-06-18 Alain Langevin Method of forming an electrically conductive contact on a substrate
US5471090A (en) * 1993-03-08 1995-11-28 International Business Machines Corporation Electronic structures having a joining geometry providing reduced capacitive loading
JPH07101699B2 (ja) * 1993-09-29 1995-11-01 インターナショナル・ビジネス・マシーンズ・コーポレイション 印刷回路基板及び液晶表示装置
EP0723387A1 (en) * 1995-01-19 1996-07-24 Digital Equipment Corporation Soldermask gasketing of printed wiring board surface mount pads
SG71838A1 (en) 1995-06-06 2000-04-18 Ibiden Co Ltd Printed circuit boards
US5691509A (en) * 1995-09-11 1997-11-25 Balzano; Alfiero Flexible cable termination and connector system
US6115910A (en) * 1997-05-08 2000-09-12 Lsi Logic Corporation Misregistration fidutial
JP2000003977A (ja) * 1998-06-16 2000-01-07 Shinko Electric Ind Co Ltd 半導体チップ実装用基板
JP3420076B2 (ja) * 1998-08-31 2003-06-23 新光電気工業株式会社 フリップチップ実装基板の製造方法及びフリップチップ実装基板及びフリップチップ実装構造
US6341071B1 (en) 1999-03-19 2002-01-22 International Business Machines Corporation Stress relieved ball grid array package
CN1178232C (zh) * 1999-04-26 2004-12-01 松下电器产业株式会社 电子零件及无线终端装置
US6774474B1 (en) * 1999-11-10 2004-08-10 International Business Machines Corporation Partially captured oriented interconnections for BGA packages and a method of forming the interconnections
JP2001320168A (ja) 2000-03-02 2001-11-16 Murata Mfg Co Ltd 配線基板およびその製造方法、ならびにそれを用いた電子装置
DE10164880B4 (de) * 2000-03-02 2005-11-03 Murata Mfg. Co., Ltd., Nagaokakyo Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet
US8158508B2 (en) 2001-03-05 2012-04-17 Megica Corporation Structure and manufacturing method of a chip scale package
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
US20060163729A1 (en) * 2001-04-18 2006-07-27 Mou-Shiung Lin Structure and manufacturing method of a chip scale package
US20040032562A1 (en) * 2001-05-01 2004-02-19 Three-Five Systems, Inc. Method and apparatus for adjusting contrast during assembly of liquid crystal displays and similar devices
JP3581111B2 (ja) * 2001-05-01 2004-10-27 新光電気工業株式会社 半導体素子の実装基板及び実装構造
US7149090B2 (en) * 2001-09-11 2006-12-12 Brother Kogyo Kabushiki Kaisha Structure of flexible printed circuit board
US6667090B2 (en) * 2001-09-26 2003-12-23 Intel Corporation Coupon registration mechanism and method
CN100482041C (zh) * 2002-05-17 2009-04-22 日本电气株式会社 印刷布线板
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
JP4196875B2 (ja) 2004-04-26 2008-12-17 ブラザー工業株式会社 プリント基板及びそれを用いたインクジェットヘッド
US7190157B2 (en) * 2004-10-25 2007-03-13 Agilent Technologies, Inc. Method and apparatus for layout independent test point placement on a printed circuit board
WO2006053036A2 (en) * 2004-11-10 2006-05-18 Unitive International Limited Non-circular via holes for bumping pads and related structures
US9258904B2 (en) * 2005-05-16 2016-02-09 Stats Chippac, Ltd. Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings
US20060255473A1 (en) * 2005-05-16 2006-11-16 Stats Chippac Ltd. Flip chip interconnect solder mask
US7646567B2 (en) * 2005-06-28 2010-01-12 Seagate Technology Llc Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects
JP2007227731A (ja) * 2006-02-24 2007-09-06 Matsushita Electric Ind Co Ltd プリント基板とそれを用いた電子機器
TWI340612B (en) * 2007-07-24 2011-04-11 Advanced Semiconductor Eng Circuit substrate and method for fabricating inductive circuit
WO2009102108A1 (en) * 2008-02-15 2009-08-20 Gigalane Co.Ltd Printed circuit board
US7952834B2 (en) * 2008-02-22 2011-05-31 Seagate Technology Llc Flex circuit assembly with thermal energy dissipation
JP2010258302A (ja) * 2009-04-27 2010-11-11 Texas Instr Japan Ltd 超音波フリップチップ実装方法およびそれに用いられる基板
US8669777B2 (en) 2010-10-27 2014-03-11 Seagate Technology Llc Assessing connection joint coverage between a device and a printed circuit board
JP6024078B2 (ja) * 2011-08-17 2016-11-09 大日本印刷株式会社 サスペンション用基板
EP3088931B1 (en) * 2015-04-30 2024-09-04 LG Innotek Co., Ltd. Lens moving apparatus and camera module and optical device including the same
KR102529998B1 (ko) * 2015-04-30 2023-05-08 엘지이노텍 주식회사 인쇄회로기판, 이를 포함하는 렌즈 구동장치 및 카메라 모듈
CN105979716A (zh) * 2016-05-20 2016-09-28 泉州三宝电子有限公司 一种柔性电路板及其制造方法
JP6884835B2 (ja) * 2019-09-27 2021-06-09 サンコール株式会社 バスバーアッセンブリ及びその製造方法

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US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
JPS5680196A (en) * 1979-12-05 1981-07-01 Hitachi Ltd Method of forming electrode for printed circuit board
JPS5622846A (en) * 1980-07-02 1981-03-04 Takiron Co Expansion purlin hiding
JPS57107042A (en) * 1980-12-25 1982-07-03 Nec Corp Semiconductor integrated circuit device
US4345119A (en) * 1981-02-19 1982-08-17 Motorola Inc. Membrane switch assembly with improved spacer
EP0058849A3 (en) * 1981-02-19 1983-06-29 Motorola, Inc. Membrane keyboard assembly
US4493952A (en) * 1983-08-29 1985-01-15 Amp Incorporated Membrane switch having integral switch tail insulator
US4764644A (en) * 1985-09-30 1988-08-16 Microelectronics Center Of North Carolina Microelectronics apparatus
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
AU610249B2 (en) * 1987-09-29 1991-05-16 Microelectronics And Computer Technology Corporation Customizable circuitry
US5025348A (en) * 1987-11-20 1991-06-18 Casio Computer Co., Ltd. Bonding structure of an electronic device and a method for manufacturing the same
US5010448A (en) * 1987-12-18 1991-04-23 Alpine Electronics Inc. Printed circuit board
EP0439546A1 (de) * 1988-10-20 1991-08-07 Siemens Aktiengesellschaft Verfahren und vorrichtung zum löten von drähten von bauelementen zur montage auf oberflächen
US5130768A (en) * 1990-12-07 1992-07-14 Digital Equipment Corporation Compact, high-density packaging apparatus for high performance semiconductor devices

Also Published As

Publication number Publication date
DE69222356D1 (de) 1997-10-30
US5517756A (en) 1996-05-21
EP0516402B1 (en) 1997-09-24
JPH04354398A (ja) 1992-12-08
EP0516402A1 (en) 1992-12-02
DE69222356T2 (de) 1998-03-26
US5252781A (en) 1993-10-12

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20060528