HK100891A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
HK100891A
HK100891A HK100891A HK100891A HK100891A HK 100891 A HK100891 A HK 100891A HK 100891 A HK100891 A HK 100891A HK 100891 A HK100891 A HK 100891A HK 100891 A HK100891 A HK 100891A
Authority
HK
Hong Kong
Prior art keywords
layer
ptfe
printed circuit
circuit board
solid
Prior art date
Application number
HK100891A
Other languages
English (en)
Inventor
Hirosuke Suzuki
Original Assignee
Junkosha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Junkosha Co Ltd filed Critical Junkosha Co Ltd
Publication of HK100891A publication Critical patent/HK100891A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
HK100891A 1984-04-10 1991-12-12 Printed circuit board HK100891A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59072472A JPS60214941A (ja) 1984-04-10 1984-04-10 プリント基板

Publications (1)

Publication Number Publication Date
HK100891A true HK100891A (en) 1991-12-20

Family

ID=13490289

Family Applications (1)

Application Number Title Priority Date Filing Date
HK100891A HK100891A (en) 1984-04-10 1991-12-12 Printed circuit board

Country Status (6)

Country Link
US (1) US4640866A (xx)
EP (1) EP0160418B1 (xx)
JP (1) JPS60214941A (xx)
DE (1) DE3578811D1 (xx)
HK (1) HK100891A (xx)
SG (1) SG93691G (xx)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4977025A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977008A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4999248A (en) * 1981-08-20 1991-03-12 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4982056A (en) * 1981-08-20 1991-01-01 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxide
US5000547A (en) * 1981-08-20 1991-03-19 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US5006382A (en) * 1981-08-20 1991-04-09 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4985308A (en) * 1981-08-20 1991-01-15 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977297A (en) * 1981-08-20 1990-12-11 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977026A (en) * 1981-08-20 1990-12-11 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4973142A (en) * 1981-08-20 1990-11-27 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4975505A (en) * 1981-08-20 1990-12-04 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
JPH0229732Y2 (xx) * 1984-11-08 1990-08-09
US4954873A (en) * 1985-07-22 1990-09-04 Digital Equipment Corporation Electrical connector for surface mounting
US4716074A (en) * 1986-02-10 1987-12-29 Pall Corporation Porous fibrous fluorocarbon structures
JPH0246061Y2 (xx) * 1986-03-17 1990-12-05
JPS62254484A (ja) * 1986-04-28 1987-11-06 住友ベークライト株式会社 高周波回路用誘電体基板の製造方法
JPH0753420B2 (ja) * 1986-08-15 1995-06-07 松下電工株式会社 多層プリント配線板の製法
JPS6347134A (ja) * 1986-08-15 1988-02-27 松下電工株式会社 多層プリント配線板の製法
DE3750205T2 (de) * 1986-08-29 1994-12-08 Hitachi Chemical Co Ltd Substrat für Hochfrequenzschaltung und Verfahren zur Herstellung desselben.
JPH0824011B2 (ja) * 1986-09-11 1996-03-06 松下電工株式会社 電気用積層板及びそれを用いたプリント配線基板
JPS63249394A (ja) * 1987-04-06 1988-10-17 日本電気株式会社 多層回路基板
US4784901A (en) * 1987-04-13 1988-11-15 Japan Gore-Tex, Inc. Flexible printed circuit board base material
US4770922A (en) * 1987-04-13 1988-09-13 Japan Gore-Tex, Inc. Printed circuit board base material
US4755911A (en) * 1987-04-28 1988-07-05 Junkosha Co., Ltd. Multilayer printed circuit board
US5136123A (en) * 1987-07-17 1992-08-04 Junkosha Co., Ltd. Multilayer circuit board
JP2559236B2 (ja) * 1987-09-10 1996-12-04 ジャパンゴアテックス株式会社 シート材
JPH01225539A (ja) * 1988-03-04 1989-09-08 Junkosha Co Ltd 積層板
US4854038A (en) * 1988-03-16 1989-08-08 International Business Machines Corporation Modularized fabrication of high performance printed circuit boards
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards
US4937707A (en) * 1988-05-26 1990-06-26 International Business Machines Corporation Flexible carrier for an electronic device
US4987100A (en) * 1988-05-26 1991-01-22 International Business Machines Corporation Flexible carrier for an electronic device
US4916259A (en) * 1988-08-01 1990-04-10 International Business Machines Corporation Composite dielectric structure for optimizing electrical performance in high performance chip support packages
US4996097A (en) * 1989-03-16 1991-02-26 W. L. Gore & Associates, Inc. High capacitance laminates
US5072075A (en) * 1989-06-28 1991-12-10 Digital Equipment Corporation Double-sided hybrid high density circuit board and method of making same
JP3061059B2 (ja) * 1989-08-07 2000-07-10 ジャパンゴアテックス株式会社 Ｉｃパッケージ
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5126192A (en) * 1990-01-26 1992-06-30 International Business Machines Corporation Flame retardant, low dielectric constant microsphere filled laminate
US5948533A (en) * 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
US5604017A (en) * 1990-04-12 1997-02-18 Arlon, Inc. Multi-dielectric laminates
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
GB9020428D0 (en) * 1990-09-19 1990-10-31 Gore W L & Ass Uk Thermal control materials
US5311406A (en) * 1991-10-30 1994-05-10 Honeywell Inc. Microstrip printed wiring board and a method for making same
US5440805A (en) * 1992-03-09 1995-08-15 Rogers Corporation Method of manufacturing a multilayer circuit
US5287619A (en) * 1992-03-09 1994-02-22 Rogers Corporation Method of manufacture multichip module substrate
US6728113B1 (en) * 1993-06-24 2004-04-27 Polychip, Inc. Method and apparatus for non-conductively interconnecting integrated circuits
US5785787A (en) * 1994-05-23 1998-07-28 General Electric Company Processing low dielectric constant materials for high speed electronics
US5449427A (en) * 1994-05-23 1995-09-12 General Electric Company Processing low dielectric constant materials for high speed electronics
US5512360A (en) * 1994-09-20 1996-04-30 W. L. Gore & Associates, Inc. PTFE reinforced compliant adhesive and method of fabricating same
US5670250A (en) * 1995-02-24 1997-09-23 Polyclad Laminates, Inc. Circuit board prepreg with reduced dielectric constant
US5679444A (en) * 1996-07-15 1997-10-21 International Business Machines Corporation Method for producing multi-layer circuit board and resulting article of manufacture
SE509570C2 (sv) * 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperaturkompenserande organ och förfarande vid montering av elektronik på ett mönsterkort
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US5882954A (en) * 1997-10-06 1999-03-16 Ford Motor Company Method for adhering a metallization to a substrate
SE513875C2 (sv) * 1998-06-15 2000-11-20 Ericsson Telefon Ab L M Elektrisk komponent samt ett flerlagrigt kretskort
SG93210A1 (en) 1999-06-29 2002-12-17 Univ Singapore Method for lamination of fluoropolymer to metal and printed circuit board (pcb) substrate
JP2001185653A (ja) 1999-10-12 2001-07-06 Fujitsu Ltd 半導体装置及び基板の製造方法
EP1194020A3 (en) * 2000-09-27 2004-03-31 Matsushita Electric Industrial Co., Ltd. Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
JP2002160316A (ja) * 2000-11-27 2002-06-04 Daikin Ind Ltd 電気絶縁板、プリプレグ積層体及びこれらの製造方法
CN100579332C (zh) * 2001-07-19 2010-01-06 东丽株式会社 电路基板、电路基板用构件及其制造方法和柔性薄膜的层压方法
KR100408815B1 (ko) * 2001-12-13 2003-12-06 주식회사 비에스이 초고전하보존 특성을 갖는 다층 일렉트릿 및 그 제조방법
US6788620B2 (en) * 2002-05-15 2004-09-07 Matsushita Electric Ind Co Ltd Acoustic matching member, ultrasound transducer, ultrasonic flowmeter and method for manufacturing the same
JP3887337B2 (ja) * 2003-03-25 2007-02-28 株式会社東芝 配線部材およびその製造方法
TWI243751B (en) * 2003-10-21 2005-11-21 Park Electrochemical Corp Laminates having a low dielectric, low dissipation factor bond core and method of making same
JP4367623B2 (ja) * 2004-01-14 2009-11-18 住友電気工業株式会社 多孔質延伸ポリテトラフルオロエチレンシート製または多孔質延伸ポリテトラフルオロエチレンフィルム製の電気回路部品の製造方法、及び電気回路部品
US7425760B1 (en) 2004-10-13 2008-09-16 Sun Microsystems, Inc. Multi-chip module structure with power delivery using flexible cables
JP4545682B2 (ja) * 2005-12-05 2010-09-15 株式会社潤工社 弗素樹脂積層基板
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
MY155804A (en) 2008-08-18 2015-11-30 Semblant Ltd Halo-hydrocarbon polymer coating
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
JP5528250B2 (ja) 2010-07-30 2014-06-25 日東電工株式会社 配線回路基板の製造方法
CN103181247A (zh) * 2011-05-23 2013-06-26 住友电工超效能高分子股份有限公司 高频电路基板
WO2016109720A1 (en) * 2014-12-31 2016-07-07 Saint-Gobain Performance Plastics Corporation Coated films for circuit boards
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
CN109561594B (zh) * 2018-12-28 2020-01-17 深圳市景旺电子股份有限公司 高频电路板及其制作方法
CN111674118A (zh) * 2020-06-09 2020-09-18 陕西卫宁电子材料有限公司 铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板
CN114434901B (zh) * 2021-12-13 2023-04-04 华为技术有限公司 一种覆铜板及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE555621A (xx) * 1953-12-10 1900-01-01
NL267988A (xx) * 1960-08-15 1900-01-01
US3421972A (en) * 1965-06-28 1969-01-14 Koppers Co Inc Process for directly bonding polytetrafluoroethylene to metal,adhesive composition used therefor and laminated product thereof
US3486961A (en) * 1966-07-27 1969-12-30 Minnesota Mining & Mfg Continuous method for making a polytetrafluoroethylene laminate
US4236952A (en) * 1977-12-29 1980-12-02 Imperial Chemical Industries Limited Production of sheet materials
US4335180A (en) * 1978-12-26 1982-06-15 Rogers Corporation Microwave circuit boards
DE2945191A1 (de) * 1979-11-08 1981-05-14 Castall Inc., East Weymouth, Mass. Isolierstoffplatte
JPS56158502A (en) * 1980-05-12 1981-12-07 Junkosha Co Ltd Strip line
DE3020622C2 (de) * 1980-05-30 1985-05-15 W.L. Gore & Associates, Inc., Newark, Del. Bandkabel und Verfahren zu seiner Herstellung
JPS57275A (en) * 1980-05-31 1982-01-05 Nat Jutaku Kenzai Apparatus for mounting end of plate material
US4423282A (en) * 1981-06-29 1983-12-27 Hirosuke Suzuki Flat cable
FR2524247A1 (fr) * 1982-03-23 1983-09-30 Thomson Csf Procede de fabrication de circuits imprimes avec support metallique rigide conducteur individuel
JPS6050425U (ja) * 1983-09-14 1985-04-09 株式会社　潤工社 フラツトケ−ブル

Also Published As

Publication number Publication date
JPS60214941A (ja) 1985-10-28
SG93691G (en) 1991-12-13
EP0160418B1 (en) 1990-07-25
DE3578811D1 (de) 1990-08-30
EP0160418A3 (en) 1986-11-26
US4640866A (en) 1987-02-03
JPH0131717B2 (xx) 1989-06-27
EP0160418A2 (en) 1985-11-06

Similar Documents

Publication Publication Date Title
SG93691G (en) Printed circuit board
EG17361A (en) Dielectric materials having low dielectric constant and method for their manufacture
DE3586532D1 (de) Mehrschichtleiterplatte mit hoher dichte.
ATE279321T1 (de) Pastendruckverfahren
NO875098L (no) Sting i en eksotermisk reduserende flammeatmosfŸre.
AU1868588A (en) A sheet material
IT8319963A0 (it) Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
NO902785D0 (no) Presse med styrekretsanordning.
JPS56161158A (en) Multilayer board with lacquer surface, its manufacture and its use
EP0331429A3 (en) A laminated printed circuit board and process for its manufacture
EP0335679A3 (en) Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
EP0194655A3 (en) Print circuit board and method of manufacturing the same
DE3679627D1 (de) Mehrschichtige gedruckte schaltungsplatte.
DE3664183D1 (en) Printed circuits
KR890013225A (ko) 저항성 금속층 및 그의 제법
DE3684743D1 (de) Anordnung in gestanzter schaltungstechnik.
DK31085D0 (da) Trykte kredsloebskort af pressede lagdelte stoffer
DE3561213D1 (en) Bistable reversing device, especially for feeding an oxygen circuit in an airplane, and its application
DE3780352D1 (de) Gehaeuse, das fuer die thermische stabilisierung von anlagen sorgt, insbesondere fuer die im gehaeuse enthaltenen elektronischen bausteine.
GB2019093A (en) Improvements in or relating to electrical assemblies or components having connecting wires for insertion into bores of circuit boards
EP0224922A3 (en) Invar foil
DE3483232D1 (de) Leiterplatte mit maximaler dichte von bauelementen.
ES263530Y (es) Mesa de tablero escamoteable ascendente y descendente.
Chamero Thermal Conductance in Metallic Contacts
ES233529Y (es) Mesa de trabajo para la comprobacion y montaje de circuitos electronicos.

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)