HK1008552A1 - Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials - Google Patents

Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials

Info

Publication number
HK1008552A1
HK1008552A1 HK98108815A HK98108815A HK1008552A1 HK 1008552 A1 HK1008552 A1 HK 1008552A1 HK 98108815 A HK98108815 A HK 98108815A HK 98108815 A HK98108815 A HK 98108815A HK 1008552 A1 HK1008552 A1 HK 1008552A1
Authority
HK
Hong Kong
Prior art keywords
treatment
metal
electrolytic metallization
metallization
selective
Prior art date
Application number
HK98108815A
Other languages
English (en)
Inventor
Hermann Middeke
Caskie John Mc
Nayan H Joshi
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7757663&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1008552(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1008552A1 publication Critical patent/HK1008552A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
HK98108815A 1995-03-17 1998-06-30 Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials HK1008552A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19510855A DE19510855C2 (de) 1995-03-17 1995-03-17 Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
PCT/EP1996/001190 WO1996029452A1 (de) 1995-03-17 1996-03-15 Verfahren zum selektiven oder partiellen elektrolytischen metallisieren von oberflächen von substraten aus nichtleitenden materialien

Publications (1)

Publication Number Publication Date
HK1008552A1 true HK1008552A1 (en) 1999-05-14

Family

ID=7757663

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98108815A HK1008552A1 (en) 1995-03-17 1998-06-30 Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials

Country Status (10)

Country Link
EP (1) EP0815292B1 (ja)
JP (1) JPH11502263A (ja)
KR (1) KR19980703108A (ja)
AT (1) ATE189274T1 (ja)
BR (1) BR9607848A (ja)
CA (1) CA2210883A1 (ja)
DE (2) DE19510855C2 (ja)
ES (1) ES2142572T3 (ja)
HK (1) HK1008552A1 (ja)
WO (1) WO1996029452A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6541080B1 (en) 1998-12-14 2003-04-01 Enthone Inc. Double-dip Pd/Sn crosslinker
DE19857290C2 (de) * 1998-12-14 2001-02-01 Lpw Chemie Gmbh Verfahren zur direkten Metallisierung der Oberfläche eines Kunststoffgegenstandes
DE10208674B4 (de) * 2002-02-28 2011-07-07 BIA Kunststoff- und Galvanotechnik GmbH & Co. KG, 42655 Verfahren zur Herstellung galvanisch beschichteter Elemente mit hinterleuchtbaren Symbolen und nach dem Verfahren hergestellte Elemente
DE10223081A1 (de) * 2002-05-17 2003-12-04 Hansgrohe Ag Verfahren zur Herstellung von galvanisierten Sanitärgegenständen aus Kunststoff
KR100913265B1 (ko) * 2002-07-30 2009-08-21 엘지전자 주식회사 전원 공급 단자
DE102005026633A1 (de) * 2005-06-03 2006-12-28 Hansgrohe Ag Verfahren zur Herstellung von galvanisierten Sanitärgegenständen aus Kunststoff
DE102005031454A1 (de) * 2005-07-04 2007-01-11 Huf Hülsbeck & Fürst Gmbh & Co. Kg Türgriff, Türgriff-Gehäuse und Verfahren zum Herstellen des Türgriff-Gehäuses
DE102005051632B4 (de) * 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
DE102006042269B4 (de) * 2006-09-08 2014-08-28 Automobile Patentverwaltungs- und -verwertungsgesellschaft mbH Verfahren zum galvanischen Beschichten von Trägerteilen aus Kunststoffen
PT1988192E (pt) * 2007-05-03 2013-01-24 Atotech Deutschland Gmbh Processo para aplicação de um revestimento metálico a um substrato não condutor
EP2305856A1 (en) 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
EP2602357A1 (en) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Novel adhesion promoting agents for metallization of substrate surfaces
EP2639332A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2644744A1 (en) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Method for promoting adhesion between dielectric substrates and metal layers
EP2937447B1 (en) 2012-12-21 2018-10-10 Okuno Chemical Industries Co., Ltd. Conductive coating film forming bath
KR102378658B1 (ko) 2013-09-26 2022-03-28 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 기판 표면들의 금속화를 위한 신규한 접착 촉진 프로세스
US9951433B2 (en) 2014-01-27 2018-04-24 Okuno Chemical Industries Co., Ltd. Conductive film-forming bath
EP3059277B2 (en) 2015-02-23 2022-03-30 MacDermid Enthone Inc. Inhibitor composition for racks when using chrome free etches in a plating on plastics process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
DE4206680C1 (de) * 1992-02-28 1994-01-27 Schering Ag Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren
CA2222158C (en) * 1993-03-18 2001-01-30 Nayan Harsukhrai Joshi Self accelerating and replenishing non-formaldehyde immersion coating method and composition
GB2277745A (en) * 1993-04-20 1994-11-09 Enthone Omi Post activator solution for use in electroplating non-conductive substrates e.g in plating through holes in PCB,s

Also Published As

Publication number Publication date
ATE189274T1 (de) 2000-02-15
BR9607848A (pt) 1998-07-14
EP0815292B1 (de) 2000-01-26
KR19980703108A (ko) 1998-10-15
DE59604301D1 (de) 2000-03-02
JPH11502263A (ja) 1999-02-23
CA2210883A1 (en) 1996-09-26
EP0815292A1 (de) 1998-01-07
DE19510855C2 (de) 1998-04-30
WO1996029452A1 (de) 1996-09-26
DE19510855A1 (de) 1996-09-19
ES2142572T3 (es) 2000-04-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20040315

PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)