HK1008552A1 - Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials - Google Patents

Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials

Info

Publication number
HK1008552A1
HK1008552A1 HK98108815A HK98108815A HK1008552A1 HK 1008552 A1 HK1008552 A1 HK 1008552A1 HK 98108815 A HK98108815 A HK 98108815A HK 98108815 A HK98108815 A HK 98108815A HK 1008552 A1 HK1008552 A1 HK 1008552A1
Authority
HK
Hong Kong
Prior art keywords
treatment
metal
electrolytic metallization
metallization
selective
Prior art date
Application number
HK98108815A
Inventor
Hermann Middeke
Caskie John Mc
Nayan H Joshi
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7757663&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1008552(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1008552A1 publication Critical patent/HK1008552A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Abstract

The invention concerns a process for the selective or partial electrolytic metallization of surfaces of substrates made from electrically non-conducting materials which for the purpose of the coating process are secured to plastic-coated holding elements. The proposed process involves the following steps: a) preliminary treatment of the surfaces with an etching solution containing chromium (VI) oxide; followed immediately by b) treatment of the surfaces with a colloidal acidic solution of palladium-/zinc compounds, care being taken to prevent prior contact with adsorption-promoting solutions; c) treatment of the surfaces with a solution containing a soluble metal compound capable of being reduced by zinc (II) compounds, an alkali or alkaline earth metal hydroxide, and a complex forming agent for the metal in a quantity sufficient at least to prevent precipitation of metal hydroxides; d) treatment of the surfaces with an electrolytic metallization solution. By applying this process, it is possible to ensure that only the surfaces of the work piece are coated with metal, not the holding elements or, where applicable, non-conductive plastic layers applied to parts of the work pieces. In addition, the process facilitates direct electrolytic metallization even of large plastic surfaces without prior currentless metallization.
HK98108815A 1995-03-17 1998-06-30 Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials HK1008552A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19510855A DE19510855C2 (en) 1995-03-17 1995-03-17 Process for the selective or partial electrolytic metallization of substrates made of non-conductive materials
PCT/EP1996/001190 WO1996029452A1 (en) 1995-03-17 1996-03-15 Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials

Publications (1)

Publication Number Publication Date
HK1008552A1 true HK1008552A1 (en) 1999-05-14

Family

ID=7757663

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98108815A HK1008552A1 (en) 1995-03-17 1998-06-30 Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials

Country Status (10)

Country Link
EP (1) EP0815292B1 (en)
JP (1) JPH11502263A (en)
KR (1) KR19980703108A (en)
AT (1) ATE189274T1 (en)
BR (1) BR9607848A (en)
CA (1) CA2210883A1 (en)
DE (2) DE19510855C2 (en)
ES (1) ES2142572T3 (en)
HK (1) HK1008552A1 (en)
WO (1) WO1996029452A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6541080B1 (en) 1998-12-14 2003-04-01 Enthone Inc. Double-dip Pd/Sn crosslinker
DE19857290C2 (en) * 1998-12-14 2001-02-01 Lpw Chemie Gmbh Process for the direct metallization of the surface of a plastic object
DE10208674B4 (en) * 2002-02-28 2011-07-07 BIA Kunststoff- und Galvanotechnik GmbH & Co. KG, 42655 Process for the production of electroplated elements with backlightable symbols and elements produced by the process
DE10223081A1 (en) * 2002-05-17 2003-12-04 Hansgrohe Ag Process for the production of galvanized plastic sanitary ware
KR100913265B1 (en) * 2002-07-30 2009-08-21 엘지전자 주식회사 Power supply port
DE102005026633A1 (en) 2005-06-03 2006-12-28 Hansgrohe Ag Process for the production of galvanized plastic sanitary articles
DE102005031454A1 (en) * 2005-07-04 2007-01-11 Huf Hülsbeck & Fürst Gmbh & Co. Kg Door handle, door handle housing and method of making the door handle housing
DE102005051632B4 (en) * 2005-10-28 2009-02-19 Enthone Inc., West Haven Process for pickling non-conductive substrate surfaces and for metallizing plastic surfaces
DE102006042269B4 (en) * 2006-09-08 2014-08-28 Automobile Patentverwaltungs- und -verwertungsgesellschaft mbH Process for galvanic coating of carrier parts made of plastics
EP1988192B1 (en) * 2007-05-03 2012-12-05 Atotech Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
EP2305856A1 (en) 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
EP2602357A1 (en) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Novel adhesion promoting agents for metallization of substrate surfaces
EP2639332A1 (en) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Method for metallising non-conductive plastic surfaces
EP2639333A1 (en) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Method for metallising non-conductive plastic surfaces
EP2644744A1 (en) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Method for promoting adhesion between dielectric substrates and metal layers
WO2014098064A1 (en) 2012-12-21 2014-06-26 奥野製薬工業株式会社 Conductive coating film forming bath
CN114107984A (en) 2013-09-26 2022-03-01 德国艾托特克公司 Novel adhesion promotion method for substrate surface metallization
JP6024044B2 (en) 2014-01-27 2016-11-09 奥野製薬工業株式会社 Conductive film forming bath
ES2727075T5 (en) 2015-02-23 2022-05-27 Macdermid Enthone Inc Inhibiting composition for frames when chrome-free mordants are used in a galvanizing process on plastic materials

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
DE4206680C1 (en) * 1992-02-28 1994-01-27 Schering Ag Process for the metallization of non-conductive surfaces and the use of hydroxymethanesulfinic acid in the process
EP0616053B9 (en) * 1993-03-18 2010-09-15 ATOTECH Deutschland GmbH Self accelerating and replenishing non-formaldehyde immersion coating method
GB2277745A (en) * 1993-04-20 1994-11-09 Enthone Omi Post activator solution for use in electroplating non-conductive substrates e.g in plating through holes in PCB,s

Also Published As

Publication number Publication date
WO1996029452A1 (en) 1996-09-26
EP0815292A1 (en) 1998-01-07
ATE189274T1 (en) 2000-02-15
KR19980703108A (en) 1998-10-15
DE19510855A1 (en) 1996-09-19
CA2210883A1 (en) 1996-09-26
ES2142572T3 (en) 2000-04-16
BR9607848A (en) 1998-07-14
DE59604301D1 (en) 2000-03-02
JPH11502263A (en) 1999-02-23
EP0815292B1 (en) 2000-01-26
DE19510855C2 (en) 1998-04-30

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20040315

PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)