ES2142572T3 - Procedimiento para el metalizado electrolitico selectivo o parcial de superficies de sustratos de materiales no conductores. - Google Patents

Procedimiento para el metalizado electrolitico selectivo o parcial de superficies de sustratos de materiales no conductores.

Info

Publication number
ES2142572T3
ES2142572T3 ES96907505T ES96907505T ES2142572T3 ES 2142572 T3 ES2142572 T3 ES 2142572T3 ES 96907505 T ES96907505 T ES 96907505T ES 96907505 T ES96907505 T ES 96907505T ES 2142572 T3 ES2142572 T3 ES 2142572T3
Authority
ES
Spain
Prior art keywords
treatment
metal
selective
metallization
electrolytic metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96907505T
Other languages
English (en)
Spanish (es)
Inventor
Hermann Middeke
Caskie John Mc
Nayan H Joshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7757663&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2142572(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2142572T3 publication Critical patent/ES2142572T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
ES96907505T 1995-03-17 1996-03-15 Procedimiento para el metalizado electrolitico selectivo o parcial de superficies de sustratos de materiales no conductores. Expired - Lifetime ES2142572T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19510855A DE19510855C2 (de) 1995-03-17 1995-03-17 Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien

Publications (1)

Publication Number Publication Date
ES2142572T3 true ES2142572T3 (es) 2000-04-16

Family

ID=7757663

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96907505T Expired - Lifetime ES2142572T3 (es) 1995-03-17 1996-03-15 Procedimiento para el metalizado electrolitico selectivo o parcial de superficies de sustratos de materiales no conductores.

Country Status (10)

Country Link
EP (1) EP0815292B1 (ja)
JP (1) JPH11502263A (ja)
KR (1) KR19980703108A (ja)
AT (1) ATE189274T1 (ja)
BR (1) BR9607848A (ja)
CA (1) CA2210883A1 (ja)
DE (2) DE19510855C2 (ja)
ES (1) ES2142572T3 (ja)
HK (1) HK1008552A1 (ja)
WO (1) WO1996029452A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19857290C2 (de) * 1998-12-14 2001-02-01 Lpw Chemie Gmbh Verfahren zur direkten Metallisierung der Oberfläche eines Kunststoffgegenstandes
US6541080B1 (en) 1998-12-14 2003-04-01 Enthone Inc. Double-dip Pd/Sn crosslinker
DE10208674B4 (de) * 2002-02-28 2011-07-07 BIA Kunststoff- und Galvanotechnik GmbH & Co. KG, 42655 Verfahren zur Herstellung galvanisch beschichteter Elemente mit hinterleuchtbaren Symbolen und nach dem Verfahren hergestellte Elemente
DE10223081A1 (de) * 2002-05-17 2003-12-04 Hansgrohe Ag Verfahren zur Herstellung von galvanisierten Sanitärgegenständen aus Kunststoff
KR100913265B1 (ko) * 2002-07-30 2009-08-21 엘지전자 주식회사 전원 공급 단자
DE102005026633A1 (de) * 2005-06-03 2006-12-28 Hansgrohe Ag Verfahren zur Herstellung von galvanisierten Sanitärgegenständen aus Kunststoff
DE102005031454A1 (de) * 2005-07-04 2007-01-11 Huf Hülsbeck & Fürst Gmbh & Co. Kg Türgriff, Türgriff-Gehäuse und Verfahren zum Herstellen des Türgriff-Gehäuses
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
DE102006042269B4 (de) * 2006-09-08 2014-08-28 Automobile Patentverwaltungs- und -verwertungsgesellschaft mbH Verfahren zum galvanischen Beschichten von Trägerteilen aus Kunststoffen
ES2395736T3 (es) * 2007-05-03 2013-02-14 Atotech Deutschland Gmbh Procedimiento para aplicar un revestimiento metálico a un substrato no conductor
EP2305856A1 (en) 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
EP2602357A1 (en) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Novel adhesion promoting agents for metallization of substrate surfaces
EP2639332A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2644744A1 (en) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Method for promoting adhesion between dielectric substrates and metal layers
JP6035540B2 (ja) 2012-12-21 2016-11-30 奥野製薬工業株式会社 導電性皮膜形成浴
WO2015044091A1 (en) 2013-09-26 2015-04-02 Atotech Deutschland Gmbh Novel adhesion promoting process for metallisation of substrate surfaces
KR101799347B1 (ko) 2014-01-27 2017-11-20 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 도전성 피막 형성 욕
EP3059277B2 (en) 2015-02-23 2022-03-30 MacDermid Enthone Inc. Inhibitor composition for racks when using chrome free etches in a plating on plastics process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
DE4206680C1 (de) * 1992-02-28 1994-01-27 Schering Ag Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren
DE69426732T3 (de) * 1993-03-18 2010-11-25 Atotech Deutschland Gmbh Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd
GB2277745A (en) * 1993-04-20 1994-11-09 Enthone Omi Post activator solution for use in electroplating non-conductive substrates e.g in plating through holes in PCB,s

Also Published As

Publication number Publication date
JPH11502263A (ja) 1999-02-23
WO1996029452A1 (de) 1996-09-26
HK1008552A1 (en) 1999-05-14
DE19510855A1 (de) 1996-09-19
EP0815292A1 (de) 1998-01-07
CA2210883A1 (en) 1996-09-26
EP0815292B1 (de) 2000-01-26
BR9607848A (pt) 1998-07-14
DE19510855C2 (de) 1998-04-30
ATE189274T1 (de) 2000-02-15
DE59604301D1 (de) 2000-03-02
KR19980703108A (ko) 1998-10-15

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