HK1006124A1 - Method for encasing an electronic component with a hardening plastic - Google Patents

Method for encasing an electronic component with a hardening plastic

Info

Publication number
HK1006124A1
HK1006124A1 HK98105345A HK98105345A HK1006124A1 HK 1006124 A1 HK1006124 A1 HK 1006124A1 HK 98105345 A HK98105345 A HK 98105345A HK 98105345 A HK98105345 A HK 98105345A HK 1006124 A1 HK1006124 A1 HK 1006124A1
Authority
HK
Hong Kong
Prior art keywords
component
encasing
plastic
film
electronic component
Prior art date
Application number
HK98105345A
Other languages
English (en)
Inventor
Ireneus Johannes Theodorus Pas
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Publication of HK1006124A1 publication Critical patent/HK1006124A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B29C45/345—Moulds having venting means using a porous mould wall or a part thereof, e.g. made of sintered metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
HK98105345A 1994-01-27 1998-06-16 Method for encasing an electronic component with a hardening plastic HK1006124A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9400119A NL9400119A (nl) 1994-01-27 1994-01-27 Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.

Publications (1)

Publication Number Publication Date
HK1006124A1 true HK1006124A1 (en) 1999-02-12

Family

ID=19863746

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98105345A HK1006124A1 (en) 1994-01-27 1998-06-16 Method for encasing an electronic component with a hardening plastic

Country Status (12)

Country Link
EP (1) EP0665584B1 (zh)
JP (2) JP3169315B2 (zh)
KR (2) KR100327500B1 (zh)
AT (1) ATE178737T1 (zh)
DE (1) DE69508815T2 (zh)
ES (1) ES2130513T3 (zh)
HK (1) HK1006124A1 (zh)
MY (2) MY118471A (zh)
NL (1) NL9400119A (zh)
RU (1) RU2139597C1 (zh)
SG (1) SG55005A1 (zh)
TW (1) TW257737B (zh)

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* Cited by examiner, † Cited by third party
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TW302527B (zh) * 1994-11-17 1997-04-11 Hitachi Ltd
EP0730937B1 (en) * 1994-11-21 1998-02-18 Apic Yamada Corporation A resin molding machine with release film
MY114536A (en) * 1994-11-24 2002-11-30 Apic Yamada Corp A resin molding machine and a method of resin molding
JP3246848B2 (ja) * 1995-02-22 2002-01-15 アピックヤマダ株式会社 汎用ゲート位置樹脂モールド装置および樹脂モールド方法
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
NL1000777C2 (nl) * 1995-07-11 1997-01-14 3P Licensing Bv Werkwijze voor het inkapselen van een elektronische component, elektronische component geschikt te worden toegepast bij het uitvoeren van deze werkwijze en ingekapselde component verkregen onder toepassing der werkwijze.
EP0759349B1 (en) * 1995-08-23 2002-06-05 Apic Yamada Corporation Automatic molding machine using release film
MY114454A (en) * 1996-03-14 2002-10-31 Towa Corp Method of sealing electronic component with molded resin
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
US6048483A (en) 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3017470B2 (ja) 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3017485B2 (ja) 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
TW421833B (en) 1998-07-10 2001-02-11 Apic Yamada Corp Method of manufacturing semiconductor devices and resin molding machine
NL1011392C2 (nl) * 1999-02-25 2000-08-28 3P Licensing Bv Inrichting voor het omhullen van elektronische componenten en daarvoor bestemde matrijs.
JP3581814B2 (ja) * 2000-01-19 2004-10-27 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂封止装置
DE10108253C1 (de) * 2001-02-21 2002-07-11 Bayern Chemie Gmbh Flugchemie Verfahren zur Herstellung von aus fliessfähigem Material bestehenden Gegenständen
US6567630B1 (en) 2002-02-01 2003-05-20 Toshiba Tec Kabushiki Kaisha Image forming device
BE1014855A5 (nl) * 2002-05-30 2004-05-04 Sol Spa Het vormgeven in een omhulling.
JP4540415B2 (ja) * 2004-07-16 2010-09-08 パナソニック株式会社 音響整合部材の製造方法
US20090035501A1 (en) * 2005-12-29 2009-02-05 Neil Edwin Wallace Composite product
US9082775B2 (en) * 2008-11-17 2015-07-14 Advanpack Solutions Pte Ltd System for encapsulation of semiconductor dies
HUE039327T2 (hu) * 2008-12-18 2018-12-28 Novartis Ag Szerszám és eljárás szemészeti lencsék gyártására
JP5119221B2 (ja) * 2009-08-31 2013-01-16 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR101101669B1 (ko) * 2009-12-01 2011-12-30 삼성전기주식회사 전자부품 제조장치 및 전자부품 제조방법
NL2007614C2 (nl) 2011-10-18 2013-04-22 Fico Bv Werkwijze en inrichting voor het met behulp van een reductie-materiaal dat een faseovergang ondergaat omhullen van elektronische componenten.
US9700222B2 (en) * 2011-12-02 2017-07-11 Lumiradx Uk Ltd Health-monitor patch
US9734304B2 (en) 2011-12-02 2017-08-15 Lumiradx Uk Ltd Versatile sensors with data fusion functionality
DE102012109144A1 (de) * 2012-09-27 2014-04-17 Osram Opto Semiconductors Gmbh Bauteilanordnung und Verfahren zum Herstellen von optischen Bauteilen
CN103465419A (zh) * 2013-09-16 2013-12-25 铜陵荣鑫机械有限公司 大功率led球形封装成型机
NL2011512C2 (en) * 2013-09-26 2015-03-30 Besi Netherlands B V Method for moulding and surface processing electronic components and electronic component produced with this method.
US9640743B2 (en) * 2014-09-29 2017-05-02 Nichia Corporation Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device
US11292166B2 (en) * 2017-04-07 2022-04-05 Tactotek Oy Method for manufacturing an electronic assembly and an electronic assembly
BR102018073788B1 (pt) * 2017-11-20 2023-05-09 Coexpair S.A. Montagem de injetor e método para injetar material em um molde com o uso de uma montagem de injetor
US11318642B2 (en) 2019-12-20 2022-05-03 Eaton Intelligent Power Limited Permeable wall encapsulation mold
CN114434751B (zh) * 2022-03-18 2024-07-16 珠海格力精密模具有限公司 仿生透气装置及注塑模具
CN117719137B (zh) * 2024-02-06 2024-05-03 河南君源塑业有限公司 聚氯乙烯板材加工用挤压成型装置及其成型工艺

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US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
JPS63250846A (ja) * 1987-04-08 1988-10-18 Hitachi Ltd 面付実装用ｌｓｉプラスチツクパツケ−ジとその製造方法
JPS6444056A (en) * 1987-08-11 1989-02-16 Nec Corp Hybrid integrated circuit
JPS6444026A (en) * 1987-08-11 1989-02-16 Michio Osada Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
DE68912426T2 (de) * 1988-06-21 1994-05-11 Gec Avery Ltd Herstellung von tragbaren elektronischen Karten.
SE466051B (sv) * 1990-01-11 1991-12-09 Swerad Heat Radiating Concrete Gjutform foer gjutning av ett haerdbart material
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置

Also Published As

Publication number Publication date
KR100336873B1 (ko) 2002-05-15
RU2139597C1 (ru) 1999-10-10
MY131118A (en) 2007-07-31
TW257737B (zh) 1995-09-21
EP0665584B1 (en) 1999-04-07
JPH07283260A (ja) 1995-10-27
KR950034712A (ko) 1995-12-28
DE69508815T2 (de) 1999-11-11
ES2130513T3 (es) 1999-07-01
NL9400119A (nl) 1995-09-01
EP0665584A1 (en) 1995-08-02
ATE178737T1 (de) 1999-04-15
SG55005A1 (en) 1998-12-21
KR100327500B1 (ko) 2002-08-08
DE69508815D1 (de) 1999-05-12
MY118471A (en) 2004-11-30
RU95101033A (ru) 1996-10-27
JP2001260149A (ja) 2001-09-25
JP3169315B2 (ja) 2001-05-21

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080125