HK1005163A1 - Method and composition for forming a multilayer printed circuit board - Google Patents
Method and composition for forming a multilayer printed circuit boardInfo
- Publication number
- HK1005163A1 HK1005163A1 HK98104288A HK98104288A HK1005163A1 HK 1005163 A1 HK1005163 A1 HK 1005163A1 HK 98104288 A HK98104288 A HK 98104288A HK 98104288 A HK98104288 A HK 98104288A HK 1005163 A1 HK1005163 A1 HK 1005163A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- innerlayers
- epoxy resin
- photoresist
- printed circuit
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Epoxy Resins (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Graft Or Block Polymers (AREA)
- Reinforced Plastic Materials (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27161494A | 1994-07-07 | 1994-07-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1005163A1 true HK1005163A1 (en) | 1998-12-24 |
Family
ID=23036319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98104288A HK1005163A1 (en) | 1994-07-07 | 1998-05-19 | Method and composition for forming a multilayer printed circuit board |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0691802B1 (xx) |
JP (1) | JP2693135B2 (xx) |
KR (1) | KR100199539B1 (xx) |
AT (1) | ATE223142T1 (xx) |
DE (1) | DE69527896T2 (xx) |
HK (1) | HK1005163A1 (xx) |
SG (1) | SG50346A1 (xx) |
TW (1) | TW353858B (xx) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69833550T2 (de) | 1997-06-26 | 2006-08-10 | Dai Nippon Printing Co., Ltd. | Verfahren zum Bilden von Mustern von Erhebungen und Vertiefungen und Verwendung der Muster in der Herstellung von Farbfiltern und Flüssigkristalldisplays |
JP2003066603A (ja) * | 2001-08-28 | 2003-03-05 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた多層プリント配線板の製造方法 |
WO2007042068A1 (en) * | 2005-10-11 | 2007-04-19 | Fci | Method to manufacture a printed circuit partially protected by an insulating layer |
TWI485939B (zh) | 2012-10-29 | 2015-05-21 | Delta Electronics Inc | 模組化的連接器 |
CN103616799B (zh) * | 2013-11-07 | 2016-02-24 | 李厚民 | 一种固化后有机可溶的光敏树脂、制备方法及溶解方法 |
JP5835416B2 (ja) * | 2014-06-25 | 2015-12-24 | 日立化成株式会社 | 感光性樹脂組成物、感光性フィルム及びレジストパターンの形成方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3317465A (en) | 1963-06-26 | 1967-05-02 | Robertson Co H H | Combination catalyst-inhibitor for betahydroxy carboxylic esters |
US3377406A (en) | 1963-12-16 | 1968-04-09 | Shell Oil Co | Process of esterification of polyepoxides with ethylenically unsaturated monocarboxylic acids in the presence of onium salts of inorganic acids |
US3345401A (en) | 1964-10-19 | 1967-10-03 | Shell Oil Co | Process for preparing polyesters and resulting products |
US3373221A (en) | 1964-11-04 | 1968-03-12 | Shell Oil Co | Reaction products of unsaturated esters of polyepoxides and unsaturated carboxylic acids, and polyisocyanates |
US3256226A (en) | 1965-03-01 | 1966-06-14 | Robertson Co H H | Hydroxy polyether polyesters having terminal ethylenically unsaturated groups |
US3564074A (en) | 1966-11-28 | 1971-02-16 | Dow Chemical Co | Thermosetting vinyl resins reacted with dicarboxylic acid anhydrides |
US3548030A (en) | 1968-03-27 | 1970-12-15 | Dow Chemical Co | Vinyl ester resins containing esterified secondary hydroxy groups |
US3469982A (en) | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
US3634542A (en) | 1969-08-04 | 1972-01-11 | Shell Oil Co | Unsaturated polyesters esterified with polycarboxylic acid anhydride and containing polyepoxide |
US3637618A (en) | 1970-03-11 | 1972-01-25 | Shell Oil Co | Unsaturated polyesters from epoxides and ethylenically unsaturated monocarboxylic acid mixed with solid epoxide resin |
US4092443A (en) | 1976-02-19 | 1978-05-30 | Ciba-Geigy Corporation | Method for making reinforced composites |
DE2962710D1 (en) | 1978-09-07 | 1982-06-24 | Akzo Nv | Radiation curable liquid coating composition based on an epoxy terminated compound and a process for coating a substrate with such a composition |
US4451523A (en) | 1982-11-12 | 1984-05-29 | Loctite Corporation | Conformal coating systems |
JPH07103217B2 (ja) * | 1986-05-14 | 1995-11-08 | 株式会社日立製作所 | 樹脂組成物 |
JPH0655806B2 (ja) * | 1987-02-23 | 1994-07-27 | 株式会社日立製作所 | エポキシ樹脂用硬化剤 |
IL94474A (en) * | 1989-06-09 | 1993-07-08 | Morton Int Inc | Photoimageable compositions |
CA2090099C (en) * | 1992-05-15 | 1997-01-14 | James Rath | Method of forming a multilayer printed circuit board and product thereof |
-
1995
- 1995-03-10 TW TW084102334A patent/TW353858B/zh not_active IP Right Cessation
- 1995-04-17 KR KR1019950008928A patent/KR100199539B1/ko not_active IP Right Cessation
- 1995-06-21 DE DE69527896T patent/DE69527896T2/de not_active Expired - Fee Related
- 1995-06-21 EP EP95304322A patent/EP0691802B1/en not_active Expired - Lifetime
- 1995-06-21 AT AT95304322T patent/ATE223142T1/de not_active IP Right Cessation
- 1995-06-28 SG SG1995000745A patent/SG50346A1/en unknown
- 1995-07-04 JP JP7169010A patent/JP2693135B2/ja not_active Expired - Lifetime
-
1998
- 1998-05-19 HK HK98104288A patent/HK1005163A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0851266A (ja) | 1996-02-20 |
KR100199539B1 (ko) | 1999-06-15 |
EP0691802B1 (en) | 2002-08-28 |
SG50346A1 (en) | 2000-02-22 |
DE69527896D1 (de) | 2002-10-02 |
ATE223142T1 (de) | 2002-09-15 |
JP2693135B2 (ja) | 1997-12-24 |
EP0691802A1 (en) | 1996-01-10 |
DE69527896T2 (de) | 2003-04-10 |
TW353858B (en) | 1999-03-01 |
KR960006715A (ko) | 1996-02-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20060621 |