GB9930217D0 - Solutiion processed transistors - Google Patents
Solutiion processed transistorsInfo
- Publication number
- GB9930217D0 GB9930217D0 GBGB9930217.6A GB9930217A GB9930217D0 GB 9930217 D0 GB9930217 D0 GB 9930217D0 GB 9930217 A GB9930217 A GB 9930217A GB 9930217 D0 GB9930217 D0 GB 9930217D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- solutiion
- processed transistors
- transistors
- processed
- solutiion processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/30—Doping active layers, e.g. electron transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/115—Polyfluorene; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thin Film Transistor (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Formation Of Insulating Films (AREA)
- Electrodes Of Semiconductors (AREA)
- Ink Jet (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (53)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9930217.6A GB9930217D0 (en) | 1999-12-21 | 1999-12-21 | Solutiion processed transistors |
GBGB0009911.9A GB0009911D0 (en) | 1999-12-21 | 2000-04-20 | Solution processed devices |
GBGB0009917.6A GB0009917D0 (en) | 1999-12-21 | 2000-04-20 | Forming interconnects |
GBGB0009913.5A GB0009913D0 (en) | 1999-12-21 | 2000-04-20 | Integrated circuits |
GBGB0009915.0A GB0009915D0 (en) | 1999-12-21 | 2000-04-20 | Solution processing |
CA002394881A CA2394881A1 (en) | 1999-12-21 | 2000-12-21 | Solution processed devices |
EP00983402.9A EP1243032B1 (en) | 1999-12-21 | 2000-12-21 | Inkjet-fabricated integrated circuits |
CA2394886A CA2394886C (en) | 1999-12-21 | 2000-12-21 | Inkjet-fabricated integrated circuits |
AU22069/01A AU779878B2 (en) | 1999-12-21 | 2000-12-21 | Forming interconnects |
PCT/GB2000/004934 WO2001047043A1 (en) | 1999-12-21 | 2000-12-21 | Solution processed devices |
JP2001547677A JP2003518754A (ja) | 1999-12-21 | 2000-12-21 | 溶液処理された素子 |
CNB008185891A CN1245769C (zh) | 1999-12-21 | 2000-12-21 | 溶液加工 |
AU22066/01A AU781584B2 (en) | 1999-12-21 | 2000-12-21 | Solution processed devices |
PCT/GB2000/004942 WO2001047045A1 (en) | 1999-12-21 | 2000-12-21 | Solution processing |
EP00985667.5A EP1243035B1 (en) | 1999-12-21 | 2000-12-21 | Forming interconnects |
BRPI0016660A BRPI0016660B1 (pt) | 1999-12-21 | 2000-12-21 | método para formar um transistor, o qual inclui uma camada semicondutora não polar e uma camada porta dielétrica polar |
JP2001547679A JP5014547B2 (ja) | 1999-12-21 | 2000-12-21 | 電子スイッチング素子またはトランジスタの電極を基板上に形成する方法 |
CNB008185905A CN100379048C (zh) | 1999-12-21 | 2000-12-21 | 形成互连 |
PCT/GB2000/004940 WO2001047044A2 (en) | 1999-12-21 | 2000-12-21 | Forming interconnects |
AU20160/01A AU781789B2 (en) | 1999-12-21 | 2000-12-21 | Solution processing |
CA2829416A CA2829416C (en) | 1999-12-21 | 2000-12-21 | Solution processed devices |
PCT/GB2000/004938 WO2001046987A2 (en) | 1999-12-21 | 2000-12-21 | Inkjet-fabricated integrated circuits |
AU20159/01A AU2015901A (en) | 1999-12-21 | 2000-12-21 | Inkjet-fabricated integrated circuits |
JP2001547423A JP5060695B2 (ja) | 1999-12-21 | 2000-12-21 | 電子素子配列から電子回路を構成する方法および該方法により形成される電子回路 |
EP00985664A EP1243034A1 (en) | 1999-12-21 | 2000-12-21 | Solution processed devices |
CNB008185913A CN100375310C (zh) | 1999-12-21 | 2000-12-21 | 喷墨制作的集成电路 |
BR0016660-0A BR0016660A (pt) | 1999-12-21 | 2000-12-21 | Método para formar um transistor, transistor, e circuito lógico e dispositivo de exibição ou de memória |
JP2001547678A JP5073141B2 (ja) | 1999-12-21 | 2000-12-21 | 内部接続の形成方法 |
BRPI0016643-0A BRPI0016643B1 (pt) | 1999-12-21 | 2000-12-21 | Método para formar sobre um substrato um dispositivo eletrônico, e, circuito lógico, dispositivo de exibição ou memória |
KR1020027008129A KR100872154B1 (ko) | 1999-12-21 | 2000-12-21 | 용액 처리 공정 |
CNB008185808A CN100483774C (zh) | 1999-12-21 | 2000-12-21 | 半导体器件及其形成方法 |
KR1020027008126A KR100927890B1 (ko) | 1999-12-21 | 2000-12-21 | 용액 처리 디바이스 |
BR0016643-0A BR0016643A (pt) | 1999-12-21 | 2000-12-21 | Método para formar sobre um substrativo um dispositivo eletrônico, e, circuito lógico e dispositivo de exibição ou de memória. |
BRPI0016670A BRPI0016670B1 (pt) | 1999-12-21 | 2000-12-21 | método para configuração de um circuito eletrônico, e, circuito eletrônico |
EP00983403.7A EP1243033B1 (en) | 1999-12-21 | 2000-12-21 | Solution processing |
BRPI0016661-8B1A BR0016661B1 (pt) | 1999-12-21 | 2000-12-21 | Métodos para formação de um dispositivo eletrônico, dispositivo eletrônico e dispositivo de exibição |
CA2395004A CA2395004C (en) | 1999-12-21 | 2000-12-21 | Solution processing |
CA2394895A CA2394895C (en) | 1999-12-21 | 2000-12-21 | Forming interconnects |
BR0016670-7A BR0016670A (pt) | 1999-12-21 | 2000-12-21 | Métodos para formar um circuito integrado e para definir um circuito eletrônico, e, dispositivo eletrônico |
KR1020027008128A KR100909481B1 (ko) | 1999-12-21 | 2000-12-21 | 잉크젯으로 제조되는 집적회로 및 전자 디바이스 제조 방법 |
KR1020077010832A KR100940110B1 (ko) | 1999-12-21 | 2000-12-21 | 잉크젯으로 제조되는 집적회로 및 전자 디바이스 제조 방법 |
US10/175,909 US6808972B2 (en) | 1999-12-21 | 2002-06-21 | Method of processing solution on a substrate |
US10/175,954 US7176040B2 (en) | 1999-12-21 | 2002-06-21 | Inkjet-fabricated integrated circuits |
US10/176,007 US6905906B2 (en) | 1999-12-21 | 2002-06-21 | Solution processed devices |
US10/176,173 US7098061B2 (en) | 1999-12-21 | 2002-06-21 | Forming interconnects using locally deposited solvents |
HK03105169.1A HK1053011B (zh) | 1999-12-21 | 2003-07-17 | 形成互連 |
HK03105168.2A HK1054816B (zh) | 1999-12-21 | 2003-07-17 | 溶液加工 |
HK03105170.8A HK1053012B (zh) | 1999-12-21 | 2003-07-17 | 半導體器件及其形成方法 |
HK03105171.7A HK1053013B (zh) | 1999-12-21 | 2003-07-17 | 噴墨製作的集成電路 |
US10/901,172 US7572651B2 (en) | 1999-12-21 | 2004-07-29 | Inkjet-fabricated integrated circuits |
US11/135,278 US7635857B2 (en) | 1999-12-21 | 2005-05-24 | Transistor having soluble layers |
US11/467,687 US7763501B2 (en) | 1999-12-21 | 2006-08-28 | Forming interconnects |
JP2013098405A JP5658789B2 (ja) | 1999-12-21 | 2013-05-08 | 溶液処理された素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9930217.6A GB9930217D0 (en) | 1999-12-21 | 1999-12-21 | Solutiion processed transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
GB9930217D0 true GB9930217D0 (en) | 2000-02-09 |
Family
ID=10866760
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB9930217.6A Ceased GB9930217D0 (en) | 1999-12-21 | 1999-12-21 | Solutiion processed transistors |
GBGB0009917.6A Ceased GB0009917D0 (en) | 1999-12-21 | 2000-04-20 | Forming interconnects |
GBGB0009911.9A Ceased GB0009911D0 (en) | 1999-12-21 | 2000-04-20 | Solution processed devices |
GBGB0009913.5A Ceased GB0009913D0 (en) | 1999-12-21 | 2000-04-20 | Integrated circuits |
GBGB0009915.0A Ceased GB0009915D0 (en) | 1999-12-21 | 2000-04-20 | Solution processing |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0009917.6A Ceased GB0009917D0 (en) | 1999-12-21 | 2000-04-20 | Forming interconnects |
GBGB0009911.9A Ceased GB0009911D0 (en) | 1999-12-21 | 2000-04-20 | Solution processed devices |
GBGB0009913.5A Ceased GB0009913D0 (en) | 1999-12-21 | 2000-04-20 | Integrated circuits |
GBGB0009915.0A Ceased GB0009915D0 (en) | 1999-12-21 | 2000-04-20 | Solution processing |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP5014547B2 (ja) |
KR (3) | KR100909481B1 (ja) |
BR (3) | BRPI0016670B1 (ja) |
CA (1) | CA2829416C (ja) |
GB (5) | GB9930217D0 (ja) |
HK (3) | HK1053012B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4906934B2 (ja) * | 2003-06-02 | 2012-03-28 | 株式会社リコー | 電子素子、電子素子アレイ及び表示装置 |
JP4629997B2 (ja) * | 2003-06-02 | 2011-02-09 | 株式会社リコー | 薄膜トランジスタ及び薄膜トランジスタアレイ |
JP4666999B2 (ja) * | 2003-10-28 | 2011-04-06 | 株式会社半導体エネルギー研究所 | 配線及び薄膜トランジスタの作製方法 |
US7968461B2 (en) | 2003-10-28 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method |
JP4713192B2 (ja) * | 2004-03-25 | 2011-06-29 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
JP4665545B2 (ja) * | 2005-02-24 | 2011-04-06 | 凸版印刷株式会社 | 薄膜トランジスタの製造方法 |
JP2006261535A (ja) * | 2005-03-18 | 2006-09-28 | Ricoh Co Ltd | 積層構造体、積層構造体を用いた電子素子、電子素子を用いた電子素子アレイ、積層構造体の製造方法および電子素子の製造方法 |
JP4556838B2 (ja) * | 2005-05-13 | 2010-10-06 | セイコーエプソン株式会社 | バンクの形成方法および膜パターンの形成方法 |
KR100696555B1 (ko) * | 2006-02-28 | 2007-03-19 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터의 제조방법, 이로부터 제조된 유기박막 트랜지스터 및 상기 유기 박막 트랜지스터를 구비한평판 표시 장치 |
KR100792407B1 (ko) * | 2006-10-10 | 2008-01-08 | 고려대학교 산학협력단 | 플렉시블 기판 상에 나노 입자를 이용한 전면 게이트 박막트랜지스터 및 그 제조 방법 |
JP4415977B2 (ja) | 2006-07-14 | 2010-02-17 | セイコーエプソン株式会社 | 半導体装置の製造方法、及び転写用の基板 |
JP4096985B2 (ja) | 2006-07-14 | 2008-06-04 | セイコーエプソン株式会社 | 半導体装置の製造方法、半導体装置、及び電気光学装置 |
KR100777741B1 (ko) * | 2006-07-19 | 2007-11-19 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터의 제조 방법 및 상기 방법으로제조된 유기 박막 트랜지스터를 구비한 평판 표시 장치 |
KR100792036B1 (ko) * | 2006-10-17 | 2008-01-04 | 한양대학교 산학협력단 | 유기 박막 트랜지스터 및 그 제조 방법 |
US8637343B2 (en) * | 2007-04-25 | 2014-01-28 | Merck Patent Gmbh | Process for preparing an electronic device |
JP2009105258A (ja) * | 2007-10-24 | 2009-05-14 | Konica Minolta Holdings Inc | 薄膜トランジスタの製造方法、薄膜トランジスタおよび表示装置 |
KR101678670B1 (ko) * | 2010-01-22 | 2016-12-07 | 삼성전자주식회사 | 박막트랜지스터 및 어레이 박막트랜지스터의 제조방법 |
JP2011216647A (ja) | 2010-03-31 | 2011-10-27 | Dainippon Printing Co Ltd | パターン形成体の製造方法、機能性素子の製造方法および半導体素子の製造方法 |
JP5866783B2 (ja) * | 2011-03-25 | 2016-02-17 | セイコーエプソン株式会社 | 回路基板の製造方法 |
JP6531319B2 (ja) * | 2016-05-16 | 2019-06-19 | 株式会社Nsc | 表示装置製造方法 |
JP6804082B2 (ja) * | 2016-09-21 | 2020-12-23 | 国立研究開発法人物質・材料研究機構 | 有機トランジスタとその動作制御方法および動作制御装置 |
CN106953029B (zh) * | 2017-03-22 | 2019-08-02 | 京东方科技集团股份有限公司 | 一种薄膜封装方法及封装薄膜、喷墨打印设备 |
JP7030352B2 (ja) * | 2020-10-13 | 2022-03-07 | 国立研究開発法人物質・材料研究機構 | 有機トランジスタおよび有機トランジスタの動作制御装置 |
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FR2664430B1 (fr) * | 1990-07-04 | 1992-09-18 | Centre Nat Rech Scient | Transistor a effet de champ en couche mince de structure mis, dont l'isolant et le semiconducteur sont realises en materiaux organiques. |
JP2507153B2 (ja) | 1990-07-31 | 1996-06-12 | 松下電器産業株式会社 | 有機デバイスとその製造方法 |
JP3941169B2 (ja) * | 1997-07-16 | 2007-07-04 | セイコーエプソン株式会社 | 有機el素子の製造方法 |
WO1999010939A2 (en) * | 1997-08-22 | 1999-03-04 | Koninklijke Philips Electronics N.V. | A method of manufacturing a field-effect transistor substantially consisting of organic materials |
DE69840914D1 (de) * | 1997-10-14 | 2009-07-30 | Patterning Technologies Ltd | Methode zur Herstellung eines elektrischen Kondensators |
JP2001521269A (ja) | 1997-10-17 | 2001-11-06 | ザ リージェンツ オブ ザ ユニヴァーシティー オブ カリフォルニア | インクジェット印刷技術を使って有機半導体装置を製造する方法、およびこれを利用した装置およびシステム |
KR100608543B1 (ko) * | 1998-03-17 | 2006-08-03 | 세이코 엡슨 가부시키가이샤 | 표시장치의 제조방법 및 박막발광소자의 제조방법 |
GB9808061D0 (en) * | 1998-04-16 | 1998-06-17 | Cambridge Display Tech Ltd | Polymer devices |
BR0011888A (pt) * | 1999-06-21 | 2004-03-09 | Univ Cambridge Tech | Processo para formar um dispositivo eletrônico, dispositivo eletrônico, circuito lógico, visor de matriz ativa, e, transistor de polímero |
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1999
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2000
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- 2000-12-21 KR KR1020027008128A patent/KR100909481B1/ko active IP Right Grant
- 2000-12-21 KR KR1020027008126A patent/KR100927890B1/ko active IP Right Grant
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- 2000-12-21 BR BRPI0016643-0A patent/BRPI0016643B1/pt unknown
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Also Published As
Publication number | Publication date |
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GB0009917D0 (en) | 2000-06-07 |
HK1053013B (zh) | 2008-11-28 |
KR20020086870A (ko) | 2002-11-20 |
JP2003518756A (ja) | 2003-06-10 |
KR100927890B1 (ko) | 2009-11-23 |
GB0009915D0 (en) | 2000-06-07 |
HK1053011B (zh) | 2008-11-28 |
HK1053011A1 (en) | 2003-10-03 |
KR20020088065A (ko) | 2002-11-25 |
JP2013211565A (ja) | 2013-10-10 |
HK1053012A1 (en) | 2003-10-03 |
BRPI0016670B1 (pt) | 2018-09-11 |
BRPI0016643B1 (pt) | 2018-04-03 |
JP5014547B2 (ja) | 2012-08-29 |
KR100872154B1 (ko) | 2008-12-08 |
KR20020089313A (ko) | 2002-11-29 |
JP5658789B2 (ja) | 2015-01-28 |
HK1053012B (zh) | 2010-01-15 |
GB0009913D0 (en) | 2000-06-07 |
HK1053013A1 (en) | 2003-10-03 |
KR100909481B1 (ko) | 2009-07-28 |
BRPI0016660B1 (pt) | 2018-09-25 |
CA2829416A1 (en) | 2001-06-28 |
GB0009911D0 (en) | 2000-06-07 |
CA2829416C (en) | 2018-04-10 |
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