GB929096A - A method for deposition of a copper layer on a non-conductive material - Google Patents
A method for deposition of a copper layer on a non-conductive materialInfo
- Publication number
- GB929096A GB929096A GB491161A GB491161A GB929096A GB 929096 A GB929096 A GB 929096A GB 491161 A GB491161 A GB 491161A GB 491161 A GB491161 A GB 491161A GB 929096 A GB929096 A GB 929096A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- coating
- coated
- thermosetting resin
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
In a modification of the process disclosed in the parent Specification for the chemical deposition of copper on an insulating base such as a synthetic resin, the surface to be coated is first coated with a thermosetting resin which is partially hardened prior to coating with copper and finally hardened after copper coating. The thermosetting resin such as "Bostick" (Registered Trade Mark) and a suitable thinner is applied to the cleaned surface by spraying and prehardened at room temperature and at 180 DEG -200 DEG F. Final hardening after copper coating is also effected at 180 DEG -200 DEG F.ALSO:In a modification of the process disclosed in the parent Specification for the chemical deposition of copper on an electrically non-conducting base such as a synthetic resin, the surface to be coated is first coated with a thermosetting resin which is partially hardened prior to coating with the copper and finally hardened after the copper coating. The thermosetting resin such as "Bostick" (Registered Trade Mark) and a suitable thinner is applied to the cleaned surface by spraying and prehardened at room temperature at 180 DEG F.-200 DEG F. The final hardening after copper coating is effected at 180 DEG F.-200 DEG F.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE126060A SE307047B (en) | 1960-02-09 | 1960-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB929096A true GB929096A (en) | 1963-06-19 |
Family
ID=20257874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB491161A Expired GB929096A (en) | 1960-02-09 | 1960-12-20 | A method for deposition of a copper layer on a non-conductive material |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH399120A (en) |
| GB (1) | GB929096A (en) |
| NL (1) | NL260160A (en) |
| SE (1) | SE307047B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
-
0
- NL NL260160D patent/NL260160A/xx unknown
-
1960
- 1960-02-09 SE SE126060A patent/SE307047B/xx unknown
- 1960-12-20 GB GB491161A patent/GB929096A/en not_active Expired
-
1961
- 1961-01-03 CH CH3561A patent/CH399120A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
Also Published As
| Publication number | Publication date |
|---|---|
| SE307047B (en) | 1968-12-16 |
| NL260160A (en) | |
| CH399120A (en) | 1966-03-31 |
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