GB854881A - Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports - Google Patents

Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports

Info

Publication number
GB854881A
GB854881A GB36983/56A GB3698356A GB854881A GB 854881 A GB854881 A GB 854881A GB 36983/56 A GB36983/56 A GB 36983/56A GB 3698356 A GB3698356 A GB 3698356A GB 854881 A GB854881 A GB 854881A
Authority
GB
United Kingdom
Prior art keywords
wall
coating
silver
aperture
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB36983/56A
Inventor
Ronald Henry Colborne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMI Ltd
Electrical and Musical Industries Ltd
Original Assignee
EMI Ltd
Electrical and Musical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EMI Ltd, Electrical and Musical Industries Ltd filed Critical EMI Ltd
Priority to GB36983/56A priority Critical patent/GB854881A/en
Publication of GB854881A publication Critical patent/GB854881A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

854,881. Coating with metals. ELECTRIC & MUSICAL INDUSTRIES Ltd. Dec. 3, 1957 [Dec. 4, 1956; Feb. 1, 1957], Nos. 36983/56 and 3499/57. Class 82(2) [Also in Group XXXVI] A method of forming a conductive coating on a wall extending into an insulating support comprises providing a covering for the support, apertered to expose the wall, providing a conductive coating which will adhere to the wall, and subsequently removing the covering to leave the conductive coating on the wall in electrical contact with a conductor provided on the support. The wall may be formed either before or after covering. In one embodiment (Fig. 2c), an insulating support 7 having a conductor 8 and an aperture 9, has a rubber mask 10 over its surface which leaves the aperture wall exposed. The wall is first sprayed with an adhesive and then with a thin conductive coating of silver 11 which is used as an electrode for plating a layer of copper 12. The silver coating may be formed by simultaneously spraying a solution of a silver compound e.g. silver nitrate, and a reducing agent. The mask is subsequently removed (Fig. 2d) leaving the portions of the coating 11 and the layer 12 on the aperture wall in electrical contact with the conductor. In other embodiments Figs. 1a to 1c, not shown) the mask may be replaced by a coating, such as wax, shellac or gum and the aperture made after applying this coating. The layer of copper may alternatively be sprayed on to the silver. Specification 854,880 is referred to:
GB36983/56A 1956-12-04 1956-12-04 Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports Expired GB854881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB36983/56A GB854881A (en) 1956-12-04 1956-12-04 Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB36983/56A GB854881A (en) 1956-12-04 1956-12-04 Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports

Publications (1)

Publication Number Publication Date
GB854881A true GB854881A (en) 1960-11-23

Family

ID=10392763

Family Applications (1)

Application Number Title Priority Date Filing Date
GB36983/56A Expired GB854881A (en) 1956-12-04 1956-12-04 Improvements in or relating to methods of forming conducting coatings on walls extending into insulating supports

Country Status (1)

Country Link
GB (1) GB854881A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158503A (en) * 1962-05-11 1964-11-24 Young Res Lab Ltd Metallizing holes
DE1192283B (en) * 1961-09-05 1965-05-06 Philips Nv Process for manufacturing printed circuit boards with metallized holes
DE1257917B (en) * 1961-08-28 1968-01-04 Litton Industries Inc Process for manufacturing a printed circuit
DE1265259B (en) * 1963-03-14 1968-04-04 Litton Industries Inc Process for manufacturing a printed circuit
EP0169265A2 (en) * 1984-07-21 1986-01-29 Nippon Mektron, Ltd. Process for making printed-circuit boards with plated through-holes
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP1701600A1 (en) 2005-03-10 2006-09-13 LPKF Laser & Electronics AG Method for contacting conductive tracks of a printed circuit board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1257917B (en) * 1961-08-28 1968-01-04 Litton Industries Inc Process for manufacturing a printed circuit
DE1192283B (en) * 1961-09-05 1965-05-06 Philips Nv Process for manufacturing printed circuit boards with metallized holes
US3158503A (en) * 1962-05-11 1964-11-24 Young Res Lab Ltd Metallizing holes
DE1265259B (en) * 1963-03-14 1968-04-04 Litton Industries Inc Process for manufacturing a printed circuit
EP0169265A2 (en) * 1984-07-21 1986-01-29 Nippon Mektron, Ltd. Process for making printed-circuit boards with plated through-holes
DE3427015A1 (en) * 1984-07-21 1986-01-30 Nippon Mektron, Ltd., Tokio/Tokyo METHOD FOR PRODUCING VIA CONTACTS IN PRINTED CIRCUITS
EP0169265A3 (en) * 1984-07-21 1986-07-02 Nippon Mektron, Ltd. Process for making printed-circuit boards with plated through-holes
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP1701600A1 (en) 2005-03-10 2006-09-13 LPKF Laser & Electronics AG Method for contacting conductive tracks of a printed circuit board
DE102005011545A1 (en) * 2005-03-10 2006-09-21 Lpkf Laser & Electronics Ag Method for contacting printed conductors of a printed circuit board

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