CH399120A - Method for covering a non-conductive material with a copper layer and according to this method a non-conductive material covered with a copper layer - Google Patents

Method for covering a non-conductive material with a copper layer and according to this method a non-conductive material covered with a copper layer

Info

Publication number
CH399120A
CH399120A CH3561A CH3561A CH399120A CH 399120 A CH399120 A CH 399120A CH 3561 A CH3561 A CH 3561A CH 3561 A CH3561 A CH 3561A CH 399120 A CH399120 A CH 399120A
Authority
CH
Switzerland
Prior art keywords
conductive material
copper layer
covering
covered
material covered
Prior art date
Application number
CH3561A
Other languages
German (de)
Inventor
Erik Eriksson Lars
Original Assignee
Erik Eriksson Lars
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Erik Eriksson Lars filed Critical Erik Eriksson Lars
Publication of CH399120A publication Critical patent/CH399120A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CH3561A 1960-02-09 1961-01-03 Method for covering a non-conductive material with a copper layer and according to this method a non-conductive material covered with a copper layer CH399120A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE126060A SE307047B (en) 1960-02-09 1960-02-09

Publications (1)

Publication Number Publication Date
CH399120A true CH399120A (en) 1966-03-31

Family

ID=20257874

Family Applications (1)

Application Number Title Priority Date Filing Date
CH3561A CH399120A (en) 1960-02-09 1961-01-03 Method for covering a non-conductive material with a copper layer and according to this method a non-conductive material covered with a copper layer

Country Status (4)

Country Link
CH (1) CH399120A (en)
GB (1) GB929096A (en)
NL (1) NL260160A (en)
SE (1) SE307047B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes

Also Published As

Publication number Publication date
NL260160A (en)
GB929096A (en) 1963-06-19
SE307047B (en) 1968-12-16

Similar Documents

Publication Publication Date Title
CH467669A (en) Method for covering a substrate with a covering material
CH405899A (en) Device for gripping and dispensing of structures with at least one surface part made of a pierceable material
AT243885B (en) Process for the simultaneous overpressing of a cable core with two layers of different plastic compounds and an extrusion press for carrying out this process
CH348434A (en) Process for rendering electrically non-conductive structures antistatic and structures treated according to this process
CH433903A (en) Process for coating a metallic object with a glass coating, crystallizable glass material for carrying out this process and coated object produced by the process
AT258093B (en) Method of joining a body made of composite material
CH370996A (en) Method of cleaning solid material
CH468849A (en) Process for coating solid particles with organic polymer material
CH399588A (en) Method for determining the specific resistance of a thin semiconductor layer
CH359483A (en) Method of plating the surface of a body of semiconducting material
CH399120A (en) Method for covering a non-conductive material with a copper layer and according to this method a non-conductive material covered with a copper layer
CH384196A (en) Method for impregnating strands of fibrous material
AT248578B (en) Method and device for applying a coating material
CH450553A (en) Process for coating a semiconductor material
FI42680C (en) Method for coating a building material with a protective layer by spraying a thixotropic coating mixture
AT260562B (en) Method and device for regulating the movement of a melt pool made of electrically conductive material
CH418576A (en) Process for creating a structure and intermediate layer for carrying out the process
AT228855B (en) Method of manufacturing a drum and drum manufactured by this method
CH433959A (en) Process for applying a waterproof layer to a non-textile support
CH441240A (en) Method for producing a semiconducting connection from two or more components
CH446667A (en) Method for dehumidifying or drying a composite layer and device for carrying out the method
CH424681A (en) Method for defibrating fibrous material
CH393551A (en) Process for coating a molybdenum lattice with a layer of platinum and a lattice produced by this process
CH400994A (en) Process for flocking the surface of fiber material
AT250155B (en) Method and device for applying a layer of thermoplastic material to a moving web of material, e.g. B. a paper web