JPS5514805A - Method of applying partial plating to non-conductor - Google Patents
Method of applying partial plating to non-conductorInfo
- Publication number
- JPS5514805A JPS5514805A JP8452878A JP8452878A JPS5514805A JP S5514805 A JPS5514805 A JP S5514805A JP 8452878 A JP8452878 A JP 8452878A JP 8452878 A JP8452878 A JP 8452878A JP S5514805 A JPS5514805 A JP S5514805A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- conductive material
- conductor
- plating
- partial plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To perform partial plating accurately and economically by dissolving the rubber or other compounded with conductive material with an organic solvent, coating this on another non-conductive material surface and applying a non-conductive film on the portions of said surface not requiring plating then performing electroplating.
CONSTITUTION: Rubber or plastics are compounded with conductive additives to be made conductive. The solution comprising dissolving this in an organic solvent is coated on the surface of another non-conductive material surface to make its surface conductive. A non-conductive film is applied to the portions not requiring plating of this base material. Next, electroplating is applied on this. This method enables even the delicate figures and patterns to be partially plated readily and economically on the non-conductive material.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8452878A JPS5514805A (en) | 1978-07-13 | 1978-07-13 | Method of applying partial plating to non-conductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8452878A JPS5514805A (en) | 1978-07-13 | 1978-07-13 | Method of applying partial plating to non-conductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5514805A true JPS5514805A (en) | 1980-02-01 |
Family
ID=13833130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8452878A Pending JPS5514805A (en) | 1978-07-13 | 1978-07-13 | Method of applying partial plating to non-conductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5514805A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105239119A (en) * | 2015-11-09 | 2016-01-13 | 芜湖华宇彩晶科技有限公司 | Plastic electroplating spraying method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5243735A (en) * | 1975-10-03 | 1977-04-06 | Dainippon Toryo Kk | Electrolytic plating method of polystyrene type resins |
-
1978
- 1978-07-13 JP JP8452878A patent/JPS5514805A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5243735A (en) * | 1975-10-03 | 1977-04-06 | Dainippon Toryo Kk | Electrolytic plating method of polystyrene type resins |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105239119A (en) * | 2015-11-09 | 2016-01-13 | 芜湖华宇彩晶科技有限公司 | Plastic electroplating spraying method |
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