JPS5514805A - Method of applying partial plating to non-conductor - Google Patents

Method of applying partial plating to non-conductor

Info

Publication number
JPS5514805A
JPS5514805A JP8452878A JP8452878A JPS5514805A JP S5514805 A JPS5514805 A JP S5514805A JP 8452878 A JP8452878 A JP 8452878A JP 8452878 A JP8452878 A JP 8452878A JP S5514805 A JPS5514805 A JP S5514805A
Authority
JP
Japan
Prior art keywords
conductive
conductive material
conductor
plating
partial plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8452878A
Other languages
Japanese (ja)
Inventor
Akiyuki Akamatsu
Kenji Masaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOYO TERUMII KK
Original Assignee
TOYO TERUMII KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOYO TERUMII KK filed Critical TOYO TERUMII KK
Priority to JP8452878A priority Critical patent/JPS5514805A/en
Publication of JPS5514805A publication Critical patent/JPS5514805A/en
Pending legal-status Critical Current

Links

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To perform partial plating accurately and economically by dissolving the rubber or other compounded with conductive material with an organic solvent, coating this on another non-conductive material surface and applying a non-conductive film on the portions of said surface not requiring plating then performing electroplating.
CONSTITUTION: Rubber or plastics are compounded with conductive additives to be made conductive. The solution comprising dissolving this in an organic solvent is coated on the surface of another non-conductive material surface to make its surface conductive. A non-conductive film is applied to the portions not requiring plating of this base material. Next, electroplating is applied on this. This method enables even the delicate figures and patterns to be partially plated readily and economically on the non-conductive material.
COPYRIGHT: (C)1980,JPO&Japio
JP8452878A 1978-07-13 1978-07-13 Method of applying partial plating to non-conductor Pending JPS5514805A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8452878A JPS5514805A (en) 1978-07-13 1978-07-13 Method of applying partial plating to non-conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8452878A JPS5514805A (en) 1978-07-13 1978-07-13 Method of applying partial plating to non-conductor

Publications (1)

Publication Number Publication Date
JPS5514805A true JPS5514805A (en) 1980-02-01

Family

ID=13833130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8452878A Pending JPS5514805A (en) 1978-07-13 1978-07-13 Method of applying partial plating to non-conductor

Country Status (1)

Country Link
JP (1) JPS5514805A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105239119A (en) * 2015-11-09 2016-01-13 芜湖华宇彩晶科技有限公司 Plastic electroplating spraying method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243735A (en) * 1975-10-03 1977-04-06 Dainippon Toryo Kk Electrolytic plating method of polystyrene type resins

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243735A (en) * 1975-10-03 1977-04-06 Dainippon Toryo Kk Electrolytic plating method of polystyrene type resins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105239119A (en) * 2015-11-09 2016-01-13 芜湖华宇彩晶科技有限公司 Plastic electroplating spraying method

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