GB809247A - A method of electroplating non-conductive material - Google Patents

A method of electroplating non-conductive material

Info

Publication number
GB809247A
GB809247A GB548/55A GB5485557A GB809247A GB 809247 A GB809247 A GB 809247A GB 548/55 A GB548/55 A GB 548/55A GB 5485557 A GB5485557 A GB 5485557A GB 809247 A GB809247 A GB 809247A
Authority
GB
United Kingdom
Prior art keywords
areas
copper
adhesive
silver
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB548/55A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB548/55A priority Critical patent/GB809247A/en
Publication of GB809247A publication Critical patent/GB809247A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)

Abstract

809,247. Ornamenting. FURNESS, R. W. Nov. 15, 1957, No. 548/55. Class 93 [Also in Group XXXVI] A method of electroplating predetermined areas of non-conductive material, e.g. to produce a display sign, comprises coating the material with an adhesive, coating the adhesive with an electrically conductive substance e.g. chemically deposited silver, applying an acid-resisting substance, e.g wax or lacquer, to leave predetermined areas exposed, electroplating the areas. e.g. with copper and washing with a solvent for both the adhesive and the wax or lacquer to remove these substances, along with the silver, from the unplated areas. The solvent may be acetone or methyl ethyl ketone, and instead of silver, a minute deposit of nickelchrome followed by one of copper, botH vacuum-deposited, may be employed. The non-conductive material may be a sheet pierced with holes, the finished sheet comprising copper plated areas on each face connected by copper plating extending through the holes.
GB548/55A 1957-11-15 1957-11-15 A method of electroplating non-conductive material Expired GB809247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB548/55A GB809247A (en) 1957-11-15 1957-11-15 A method of electroplating non-conductive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB548/55A GB809247A (en) 1957-11-15 1957-11-15 A method of electroplating non-conductive material

Publications (1)

Publication Number Publication Date
GB809247A true GB809247A (en) 1959-02-18

Family

ID=10472264

Family Applications (1)

Application Number Title Priority Date Filing Date
GB548/55A Expired GB809247A (en) 1957-11-15 1957-11-15 A method of electroplating non-conductive material

Country Status (1)

Country Link
GB (1) GB809247A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115503383A (en) * 2022-09-29 2022-12-23 黄向文 Article with wire inlay graph-text structure on outer surface and processing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115503383A (en) * 2022-09-29 2022-12-23 黄向文 Article with wire inlay graph-text structure on outer surface and processing method thereof

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