GB2459124A - Wafer holder for electroplating apparatus - Google Patents

Wafer holder for electroplating apparatus Download PDF

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Publication number
GB2459124A
GB2459124A GB0806552A GB0806552A GB2459124A GB 2459124 A GB2459124 A GB 2459124A GB 0806552 A GB0806552 A GB 0806552A GB 0806552 A GB0806552 A GB 0806552A GB 2459124 A GB2459124 A GB 2459124A
Authority
GB
United Kingdom
Prior art keywords
main body
pressure element
wafer
electrical contact
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0806552A
Other versions
GB0806552D0 (en
Inventor
Bjorn Sjurseth
Ketil Aarnold
Rune Renshuslokken
Karl Ivar Lundahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REC Solar AS
Original Assignee
REC Solar AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REC Solar AS filed Critical REC Solar AS
Priority to GB0806552A priority Critical patent/GB2459124A/en
Publication of GB0806552D0 publication Critical patent/GB0806552D0/en
Priority to JP2011503929A priority patent/JP2011516733A/en
Priority to KR1020107025169A priority patent/KR20110036793A/en
Priority to PCT/NO2009/000120 priority patent/WO2009126043A2/en
Priority to CN200980112800XA priority patent/CN102084477A/en
Priority to DE112009000838T priority patent/DE112009000838T5/en
Priority to US12/937,209 priority patent/US20110186424A1/en
Publication of GB2459124A publication Critical patent/GB2459124A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The outer edges of semiconductor wafers are received in the grooves 14a and 14b of wafer holder 12. A biasing force presses the electrodes 40 into contact with the backside of the wafers. The biasing force may be caused by the buoyancy of the pivoting floating electrode holders 20 in the plating liquid or by a resilient spring mechanism. The wafer holder transports the wafer through the plating liquid during electrodeposition.

Description

I
CONTACTING DEVICE
FIELD OF THE INVENTION
The present invention relates to a device for contacting a solar cell wafer.
BACKGROUND OF THE INVENTION
In UK patert application 0709619.1 it is described a device for exposing a solar cell wafer to a liquid, comprising a container filled with the liquid; a transportation device for transporting the wafer through the liquid; and a carrier device for carrying the wafer together with the transportation device.
In UK patent application 0719805.4 it is shown a device for supplying electrical power to a wafer that is at least partially submerged in a liquid, comprising a liquid container filled with the liquid; a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; and a power supply device for supplying electrical power to the wafer.
These publications are for example used in electroplating processes where for example Ni, Cu, Sn and/or Ag is applied to the wafer.
A challenge in this process is to provide electrical contact to the wafer without applying strong mçchanical forces to the wafer, which may cause breakage of the wafer. Moreover, it is a need to improve the speed of the process for large scale production of solar cells. In electroplating, this is done by increasing the current density applied to the wafer since the number of metal atoms deposited on the wafer surface is directly proportional to the current applied to the wafer. However, there is an upper limit for the current density called the limiting dffusion current density L (IL=(nFDOXcb)/3). (ref page 97 M Paunovic andM Schlesinger, Fundamentals of Electrochemical Deposition Second Ed., pp. 97, John Wiley and Sons,2006). . IL iS the value of the current where mass transport of ions to the electrode/solution interface start to become the limiting factor for the overall rate of reaction. By increasing the agitation at the solution/electrode interface, the Nernst diffusion layer, 5, becomes smaller. In turn, this implies that IL increases and the theoretical deposition rate of metal can be increased.
The object of the present invention is to improve the electrical contact to the wafer so the above conditions can be met. In particular, the device enables turbulent agitation from the same side as the contacts are applied to the wafer, while at the same time wafers continuously are moving forward through the process.
SUMMARY OF T1E INVENTION
The present invention relates to a device for contacting a wafer during submersion in a liquid, comprising: -a main body fixed to a transportation device; -an electrical contact for contacting the wafer; -a pressure element for pressing the electrical contact and the wafer towards the wafer..
In an aspect of the invention, the electrical contact is provided on the pressure element.
In an aspect of the invention, the pressure element is movably connected to the main body.
In an aspect of the invention, the pressure element comprises a floating element.
In an aspect of the invention, the main body comprises a groove adapted to receive an end of the wafer.
In an aspect of the invention, the electrical contact comprises an upwardly protruding contact.
In an aspect of the invention, the upwardly protruding contact is connected to a bus connector for connection to a bus bar.
In an aspect of the invention, the upwardly protruding contact is connected to the bus connector by means of an electric wire.
In an aspect of the invention, the device comprises several independently movable pressure elements having independent floating elements.
DETAILED DESCRIPTION
Embodiments of the present invention will now be described in detail with reference to the enclosed drawings, where: Fig. I shows a perspective view of three holding devices holding two wafers; Fig. 2 shows a side view of fig. 1; Fig. 3 shows an enlarged side view of one of the holding devices in fig. 2; Fig. 4 shows a perspective view from below of one of the holding device in fig. 4; Fig. 5 shows a side view of the holding device in fig. 2, where some parts are omitted; Fig. 6 shows a perspective view of the holding device in fig. 5; Fig. 7a sbos a perspective view of a second embodiment of the holding device; Fig. 7b shows a side view of the second embodiment; Fig. 7c shows the floating element of the second embodiment; Fig. 7d shows a front view of the second embodiment; Fig. Sa shows a perspective view of a third embodiment of a holding device and bus bar; Fig. 8b shows a sicje view of the holding device and bus bar in fig. 8a; Fig. 8c shows a front view of the holding device and bus bar in fig. 8a; Fig. 8d shows a perspective view of the third embodiment, where the main body is removed; Fig. 8e shows a front view of the main body.
It is now referred to fig. I and 2, where three holding devices lOa, lOb and lOc are shown. The holding devices are mounted on a transportation device (not shown), for example such as those described in the above-mentioned publications. One solar cell wafer la is held between the holding devices lOa and lOb, and one solar cell wafer lb is held between the holding devices lOb and lOc. Hence, the holding devices are provided for holding one end of a wafer on both sides. The loading and unloading of wafers to the holding devices is also described in the above-mentioned publications.
It is now referred to fig. 3 and 4, showing a holding device 10 corresponding to one of the holding devices lOa, lob, lOc.
The holding device 10 comprises a main body 12 with a substantially wedge-shaped opening 14a and 14b on respective side. The substantially wedge-shaped openings 14a and 14b are adapted to receive an end of a wafer 1, as shown in fig. 2.
Grooves 16 are provided in the lower part of the main body 12 for fastening of the holding device 10 to the transportation device.
The main body 12 comprises a longitudinal opening 18 defining a rotation axis I-I as shown in fig. 4. The opening 18 is provided in the lower part of the main body 12.
Pressure elements 20 are movably or pivotally connected in grooves provided in the main body 12 to the opening 18, so that they can be pivoted around the rotation axis I-I. In fig. 4 it is shown that three pairs of pressure elements 20a and 20b are provided in the lower part of the main body 12, where pressure elements 20a are provided on the left side and pressure elements 20 b are provided on the right side.
The pivotal çonnection of the pressure elements 20 can for example be provided by a cylindrical pin 18a being inserted through the opening 18 of the main body 12 and corresponding openings in the pressure elements 20 (see fig. 6). As shown here, the pin 18a is common for both pressure elements 20a and 20b.
The pressure elemçnts 20 comprise floating elements 30 made of a material with a material with positive buoyancy. In the drawings, the floating elements 30 are provided as eparate cylindrical floating elements 30 provided in peripherical openings (i.e. provided in a distance away from the pin 18a). The floating elements are hollow cylinders which will be sealed at the ends and therefore they contain air for maximum positive buoyancy. The structures 20a and 20 b are preferably made of a material with positive buoyancy relative to the plating liquid (e.g. polypropylene). Both the size of 30 can be altered and/or the distance of 30 to the axis 18 can be changed to reach the desired force from the contacts to the wafer.
Alternatively, the floating elements 20 can be provided as a common floating element for all pressure elements 20a and one common floating element for all pressure elements 20b. Alternatively, the floating elements could be incorporated as a part of the pressure element 20 (i.e. the pressure element made of a material with positive buoyancy).
An upwardly protruding electrical contact 40 is provided on each pressure element for contacting the wafer. In fig. 3 it is seen that when the pressure element 20 is pivoted upwards (in the direction of arrow A), by means of the positive buoyancy caused by the floating element 30 when submerged in a liquid, the upwardly protruding electrical contact 40 will be pressing the wafer towards the upper surface of the substantially wedge-shaped opening 14.
The upwardly protruding electrical contact 40 is connected to a plate 42 made of a current conducting material. The plate 42 is fixed to the pressure element 20.
A bus connector 44 is provided on top of the main body 12. The bus connector 44 is in electrical contact with the plate 42 and the electrical contact 40 by means of an electric wire 46 provided in channels (not shown) in the main body 12. The electric wire 46 is flexible o allow the movement of the pressure element 20. The buss connector 44 is adapted to be in electrical contact with a bus bar (not shown) connected to a power supply. The bus connector 44 is shaped as a lying U or V, to allow for unobstructed sliding along the bus bar.
In fig. 5 and 6 it is shown that the bus connector 44 is connected to the electric contacts 40 of both the right pressure element 20a and the left pressure element 20b.
It would of course also be possible to have one common bus connector for all six pressure elements.
It would of course be possible to provide electrical contact by using more than three contacts 40 for each side surface of the wafer and/or to adjust the distance between them.
It would also be possible to replace the three individual electrical contacts 40 for one side of the wafer with one continuous electrical contact.
Second embodiment In fig. 7a 7d a second embodiment of the holding device is shown. This holding device is denoted with reference number 110. Many details regarding the second embodiment will not be described in detail here, as they are similar to those described above.
As described in detail with reference to the first embodiment, the device 110 comprises a main body 112 with a substantially wedge-shaped opening 1 14a and 1 14b on respective side.
The main body 112 comprises a longitudinal opening 118 provided in the lower part of the main body 112. A pressure element 120 is provided in the opening 118 and allows the pressure element 120 to move upwardly in a substantially linear movement in the direction of arrow B. The pressure element 120 is made of a floating material, i.e. has positive buoyancy in the liquid being used. Alternatively, the pressure element 120 comprises floating elements (not shown) for example incorporated in the body of the pressure element. Ideally, the pressure element 120 incorporates floating elements and the material in 120 is made of a material with a positive buoyancy relative to the liquid being used.
As can be seen in fig. 7b and 7c, the floating element 120 comprises an upwardly protruding, substantially T-shaped element 121. The T-shaped element 121 limits both the upwardly and downwardly movement of the pressure element 120 in the opening 118.
Upwardly protruding electrical contacts 140 are provided on the pressure element for contacting the wafer. These are in electrical contact with a bus connector (not shown), as described with reference to the abovementioned embodiment.
When the pressure element 120 is submerged in liquid, its positive buoyancy causes the pressure element to move upwards in the direction of arrow B, and hence the electrical contacts 140 will contact the wafers provided in the substantially wedge-shaped openings I 14a and 1 14b.
Third embodiment In fig. 8a -8d a third embodiment of the holding device is shown. This holding device is denoted with reference number 210. Many details regarding the third embodiment will not be described in detail here, as they are similar to those described above.
As described in detail with reference to the first embodiment, the device 210 comprises a main body 212 with a substantially wedge-shaped opening 214a and 214b on respective side.
A recess or opening 218 provided in the lower part of the main body 212 (see fig. 8e). A pressure element 220 is provided in the opening 2118. Three substantially cylindrical channels 219 are provided in the main body 2112, as indicated with dashed lines in fig. 8c. Three substantially cylindrical poles 222 are provided in respective channel 219. In their lower end, the poles 222 are fixed to the pressure element 220. In their upper end, the poles 222 are provided with bus connectors or knobs 244 made of an electrical conducting material. The knobs 244 have a substantially spherical shape, and are having a larger diameter than the poles 222.
As seen in fig. 8b nd 8c, the poles 222 are longer than the channels 219.
Consequently, the pressure element 220 together with the poles 222 and knobs 244 are allowed to be moved upwardly and downwardly in a substantially linear movement in the direction of arrow C. The movement is limited by the knobs 244 being larger than the channels 219 and by the pressure element 222 meeting the lower part of the main body 212.
Upwardly protruding electrical contacts 240 are provided on the pressure element 220 for contacting the wafer. These are in electrical contact with the knobs 244. In this embodiment, bus bars 248 comprise pairs of two spaced apart bars, where the distance between each bar allows the pole 222 to pass through between. Moreover, the bus bars 248 are having an inclining end 249.
In the third embodiment, it is not buoyancy that provides movement of the pressure element 220. Initially, the pressure element 220 is in its lower position. When approaching the end 249 of the bus bars 248, the poles 222 will pass between the bars, while the knobs 244 will be guided or pressed upwards because of the inclining end 249. Consequently, the poles and the pressure element will be guided upwardly in the direction of arrow C, and the electrical contacts 240 will contact the surface of the wafer. Of course, the bus bars 248 will be located in a suitable position over the liquid.
The pressure elemnt 220, poles 222 and knobs 244 may be provided with a spring mechanism (not shown) to dampen the pressure and movement of the pressure element. Alternatively, the poles 222 could be made of a flexible material, or the bus bars could be provided with a spring mechanism.
The abovementioncd detailed description is especially provided to illustrate and to describe preferred embodiments of the invention. However, the description is by no means limiting the invention to the specific embodiments.

Claims (14)

  1. CLAIMS1. Device for contacting a wafer during submersion in a liquid, comprising: -a main body (12; 112; 212) fixed to a transportation device; -an electrical contact (40; 140; 240) for contacting the wafer; -a pressure element (20; 120; 220) for pressing the electrical contact (40; 140; 240) towards the wafer.
  2. 2. Device according to claim 1, where the electrical contact (40; 140; 240) is provided on the prçssure element (20; 120; 220).
  3. 3. Device according to claim 1 or 2, where the pressure element (20; 120; 220) is movably connected to the main body.
  4. 4. Device according to claim 3, where the pressure element (20; 120; 220) comprises a floating element.
  5. 5. Device according to claim 1, where the main body comprises a groove (14a, 14b; 1 14a, 1 14b; 214a, 214b) adapted to receive an end of the wafer.
  6. 6. Device according to claim 1, where the electrical contact (40; 140; 240) is upwardly protruding.
  7. 7. Device according to claim 6, where the electrical contact (40; 140; 240) is connected to a bus connector for connection to a bus bar.
  8. 8. Device according to claim 7, where the upwardly protruding contact is connected to the bus connector by means of an electric wire.
  9. 9. Device according to claim 4, where the device comprises several independently movable pressure elements having independent floating elements.
  10. 10. Device according to any of the proceeding claims, where the pressure element is provided in an opening (18; 118; 218) of the main body.
  11. 11. Device according to claim 10, where the pressure element (20) is pivotably connected to the main body by means of a pin (18a) inserted in the opening (18) of the main body.
  12. 12. Device according to claim 10, where the pressure element (120) comprises an upwardly protruding, substantially T-shaped element (121) adapted to the opening (118) in the main body, for limiting the upwardly and downwardly movement of the pressure element (120) in relation to the main body.
  13. 13. Device accordipg to claim 10, where the pressure element (220) is connected to poles (222) movably provided in channels (219) in the main body.
  14. 14. Device accordiig to claim 13, where bus connectors (244) having a larger diameter than the poles (222) are connected in the end of the poles (222), and where the movemept of the pressure element (220) is caused by inclining bus bars guiding the bus connectors (244).
GB0806552A 2008-04-10 2008-04-10 Wafer holder for electroplating apparatus Withdrawn GB2459124A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB0806552A GB2459124A (en) 2008-04-10 2008-04-10 Wafer holder for electroplating apparatus
JP2011503929A JP2011516733A (en) 2008-04-10 2009-03-31 Contact device
KR1020107025169A KR20110036793A (en) 2008-04-10 2009-03-31 Contacting device
PCT/NO2009/000120 WO2009126043A2 (en) 2008-04-10 2009-03-31 Contacting device
CN200980112800XA CN102084477A (en) 2008-04-10 2009-03-31 Contacting device
DE112009000838T DE112009000838T5 (en) 2008-04-10 2009-03-31 Contact unit
US12/937,209 US20110186424A1 (en) 2008-04-10 2009-03-31 Contacting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0806552A GB2459124A (en) 2008-04-10 2008-04-10 Wafer holder for electroplating apparatus

Publications (2)

Publication Number Publication Date
GB0806552D0 GB0806552D0 (en) 2008-05-14
GB2459124A true GB2459124A (en) 2009-10-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB0806552A Withdrawn GB2459124A (en) 2008-04-10 2008-04-10 Wafer holder for electroplating apparatus

Country Status (7)

Country Link
US (1) US20110186424A1 (en)
JP (1) JP2011516733A (en)
KR (1) KR20110036793A (en)
CN (1) CN102084477A (en)
DE (1) DE112009000838T5 (en)
GB (1) GB2459124A (en)
WO (1) WO2009126043A2 (en)

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US20060042934A1 (en) * 1999-03-30 2006-03-02 Homayoun Talieh Method and apparatus for forming an electrical contact with a semiconductor substrate

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US20060042934A1 (en) * 1999-03-30 2006-03-02 Homayoun Talieh Method and apparatus for forming an electrical contact with a semiconductor substrate
US20040074763A1 (en) * 2001-02-20 2004-04-22 Wataru Okase Plating device and plating method

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CN102084477A (en) 2011-06-01
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