CN217026123U - Tensioning device for electroplating transfer hanging tool - Google Patents

Abstract

The utility model discloses a tensioning device of an electroplating transfer rack, wherein the electroplating transfer rack comprises a support frame, a conductive frame and an upper conductive clamp, the conductive frame is fixedly connected with the support frame, the tensioning device comprises a tensioning moving plate, the upper conductive clamp is fixedly connected with the tensioning moving plate, two vertical slotted holes are formed in the support frame, two pin shafts are fixed on the tensioning moving plate, the pin shafts are in one-to-one correspondence with the vertical slotted holes, the pin shafts penetrate through the vertical slotted holes, can slide up and down relative to the vertical slotted holes, limiting blocks are fixed at the end parts of the pin shafts, the limiting blocks are clamped at the outer side of the support frame, and tension springs are connected between the tensioning moving plate and the conductive frame. The flexible circuit board clamping device can ensure that the electroplating transfer hanger can reliably clamp the flexible circuit board, and can also keep the flexible circuit board tensioned and flat, thereby meeting the requirement of a high-quality electroplating process.

Description

Tensioning device for electroplating transfer hanging tool

Technical Field

The utility model relates to circuit board electroplating equipment, in particular to a tensioning device of an electroplating transfer hanger.

Background

In the prior art, for electroplating equipment of high-end PCBs such as flexible boards, IC carrier boards and the like, an electroplating transfer hanger is generally provided with an upper clamp and a lower clamp, the flexible circuit board is clamped and fixed under the cooperation of the upper clamp and the lower clamp, and meanwhile, the power-on performance of the flexible circuit board is kept.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that the defects in the prior art are overcome, and the tensioning device not only can ensure that the electroplating transfer hanger reliably clamps the flexible circuit board, but also can keep the flexible circuit board tensioned and leveled.

In order to solve the technical problems, the utility model adopts the following technical scheme.

The utility model provides an electroplate overspeed device tensioner who moves and carry hanger, electroplate and move and carry hanger including support frame, electrically conductive frame and go up electrically conductive anchor clamps, electrically conductive frame with support frame fixed connection, overspeed device tensioner is including the tensioning motion board, go up electrically conductive anchor clamps with tensioning motion board fixed connection, two vertical slotted holes have been seted up on the support frame, be fixed with two round pin axles on the tensioning motion board, the round pin axle with vertical slotted hole one-to-one, the round pin axle passes vertical slotted hole, just the round pin axle can be relative vertical slotted hole slides from top to bottom, the tip of round pin axle is fixed with the stopper, the stopper card is located the outside of support frame, the tensioning motion board with be connected with the extension spring between the electrically conductive frame.

Preferably, the support frame is an inverted U-shaped support frame, and the conductive frame is fixedly connected to the two support arms of the support frame.

Preferably, the two vertical slots are respectively formed in the two support arms of the support frame.

Preferably, the vertical slot is near the lower end of the support arm of the support frame.

Preferably, the limiting block is in a round cake shape.

Preferably, two tension springs are connected between the tensioning motion plate and the conductive frame, and the two tension springs are respectively close to two ends of the tensioning motion plate.

Preferably, two holding notches are formed in the joint of the tensioning moving plate and the conductive frame, and two tension springs are respectively arranged in the two holding notches.

In the tensioning device of the electroplating transfer rack disclosed by the utility model, the tensioning moving plate can move up and down relative to the support frame based on the matching of the pin shaft and the vertical slotted hole, on the basis, a tension spring is connected between the tensioning moving plate and the conductive frame, and when a flexible circuit board is clamped between the upper conductive clamp and the lower conductive clamp, the tensioning moving plate and the upper conductive clamp can be lifted upwards under the action of elastic tension applied by the tension spring, so that the flexible circuit board is tensioned between the upper conductive clamp and the lower conductive clamp and kept flat, and the electroplating uniformity of the flexible circuit board is further improved.

Drawings

FIG. 1 is a perspective view of a flexible circuit board electroplating shifting hanger;

FIG. 2 is a front view of a flexible circuit board electroplating transferring rack;

FIG. 3 is a side view of a flexible circuit board electroplating transfer rack;

FIG. 4 is a structural view of the support frame;

FIG. 5 is a view showing the construction of a support frame and an upper conductive jig;

FIG. 6 is a perspective view of a lower conductive clip;

FIG. 7 is a cross-sectional view of a lower conductive clip;

FIG. 8 is a perspective view of an auxiliary conductive mechanism;

FIG. 9 is a side view of the auxiliary conductive mechanism;

FIG. 10 is a block diagram of the catching grooves and the anti-backup fins.

Detailed Description

The utility model is described in more detail below with reference to the figures and examples.

Example one

The utility model provides a tensioning device of an electroplating shifting hanger, which is combined with the tensioning device shown in figures 1, 4 and 5, the electroplating shifting and carrying hanger comprises a support frame 2, a conductive frame 3 and an upper conductive clamp 4, wherein the conductive frame 3 is fixedly connected with the support frame 2, the tensioning device 5 comprises a tensioning moving plate 50, the upper conductive clamp 4 is fixedly connected with the tensioning moving plate 50, two vertical slotted holes 20 are arranged on the supporting frame 2, two pin shafts 51 are fixed on the tensioning moving plate 50, the pins 51 correspond to the vertical slots 20 one by one, the pins 51 penetrate through the vertical slots 20, the pin shaft 51 can slide up and down relative to the vertical slot 20, a limit block 52 is fixed at the end of the pin shaft 51, the limiting block 52 is clamped at the outer side of the supporting frame 2, and a tension spring 53 is connected between the tensioning moving plate 50 and the conductive frame 3.

In the structure, based on the matching of the pin shaft 51 and the vertical slot 20, the tensioning moving plate 50 can move up and down relative to the support frame 2, on the basis, a tension spring 53 is connected between the tensioning moving plate 50 and the conductive frame 3, when the flexible circuit board is clamped between the upper conductive clamp 4 and the lower conductive clamp 6, under the action of elastic tension applied by the tension spring 53, the tensioning moving plate 50 and the upper conductive clamp 4 can be lifted upwards, so that the flexible circuit board is tensioned between the upper conductive clamp 4 and the lower conductive clamp 6 and kept flat, and the electroplating uniformity of the flexible circuit board is improved.

As a preferred structure, the supporting frame 2 is an inverted U-shaped supporting frame, and the conductive frame 3 is fixedly connected to two supporting arms of the supporting frame 2.

Regarding the specific positions of the two vertical slots 20, in the present embodiment, the two vertical slots 20 are respectively opened on the two arms of the supporting frame 2. Further, the vertical slot 20 is near the lower end of the arm of the support frame 2.

In order to be better clamped at the outer side of the supporting frame 2, in this embodiment, the limiting block 52 is shaped like a circular cake.

Preferably, two tension springs 53 are connected between the tensioning moving plate 50 and the conductive frame 3, and the two tension springs 53 are respectively close to two ends of the tensioning moving plate 50. Wherein, based on the cooperation of the two tension springs 53, the elastic tension can be stably applied to the tensioning moving plate 50, thereby ensuring the uniform tension of the left and right sides.

In order to place the tension springs 53, in this embodiment, two accommodating notches 54 are formed at a connection portion between the tensioning moving plate 50 and the conductive frame 3, and the two tension springs 53 are respectively disposed in the two accommodating notches 54.

Compared with the prior art, in the embodiment, the tensioning device can automatically tension the circuit board after clamping the circuit board during electroplating, the tensioning device is flatly connected with the conductive frame through the carrier U-shaped frame to conduct electricity to the lower clamp, so that the lower clamp is flatly connected with the conductive clamp through the up-and-down sliding boss, the spring plays a role in automatic tensioning, when the circuit board is installed on a manipulator or a mechanism, the conductive clamp is flatly and automatically pressed down, and when the circuit board is clamped, the lead clamp is flatly and automatically tensioned, so that the circuit board is always kept in a tensioned state in the circuit board electroplating process, and the uniformity of the surface of the circuit board can be higher during electroplating the circuit board.

Example two

This embodiment has provided a flexible line way board is electroplated and is carried hanger, combines that fig. 1 to fig. 10 are shown, and it is including crossbeam 1, the front end of crossbeam 1 is equipped with support frame 2, the lower extreme of support frame 2 is fixed with electrically conductive frame 3, be equipped with a plurality of electrically conductive anchor clamps 4 and a plurality of electrically conductive anchor clamps 6 down on the electrically conductive frame 3, go up electrically conductive anchor clamps 4 with electrically conductive anchor clamps 6 one-to-one down, go up electrically conductive anchor clamps 4 with electrically conductive anchor clamps 6 are used for the upper and lower both ends of centre gripping flexible line way board 100 respectively down, the rear end of crossbeam 1 is equipped with running gear 7 and main electrically conductive mechanism 8, main electrically conductive mechanism 8 crossbeam 1 support frame 2 with electrically conductive frame 3 electrical contact in proper order, go up electrically conductive anchor clamps 4 with electrically conductive anchor clamps 6 down all with electrically conductive frame 3 electrical contact.

In the structure, a plurality of upper conductive clamps 4 and a plurality of lower conductive clamps 6 are arranged on the conductive frame 3, the upper conductive clamps 4 and the lower conductive clamps 6 are distributed in a vertically symmetrical manner, and when the flexible circuit board 100 is clamped between the upper conductive clamps 4 and the lower conductive clamps 6, the upper conductive clamps 4 and the lower conductive clamps 6 are all conductive, so that the surface charge distribution of the flexible circuit board 100 is more uniform, the uniformity of the board surface of the high-order flexible circuit board during electroplating is more uniform, and the electroplating processing quality is improved.

In this embodiment, the upper conductive clamp 4 and the lower conductive clamp 6 are both disposed on the front side of the conductive frame 3.

In order to ensure the tension of the circuit board during the electroplating process, a tension device 5 is connected between the upper conductive clamp 4 and the upper end of the conductive frame 3 in the embodiment.

As a preferable mode, an auxiliary conductive mechanism 9 is arranged on the beam 1, and the upper conductive clamp 4 and the lower conductive clamp 6 are both connected to the auxiliary conductive mechanism 9 through a wire 10. Under the matching action of the main conductive mechanism 8 and the auxiliary conductive mechanism 9, the conductive reliability can be ensured.

Because the conductive frame 3 has conductivity, in order to avoid adverse effect to the conductive frame 3 in the electroplating process link, in this embodiment, a teflon coating is sprayed on the conductive frame 3.

In order to better realize the supporting function, in this embodiment, the supporting frame 2 is an inverted U-shaped supporting frame, and the upper end of the supporting frame 2 is fixed to the front end of the cross beam 1 through a bolt.

In this embodiment, an i-shaped frame 11 is fixed at the rear end of the cross beam 1, and the main conductive mechanism 8 and the traveling mechanism 7 are respectively arranged at the upper end and the lower end of the i-shaped frame 11. The I-shaped frame 11 can reliably support and fix the rear end of the cross beam 1 and is matched with the travelling mechanism 7 to stably travel on a preset track.

As a preferred structure, two vertical guiding posts 30 are fixed at the lower end of the conductive frame 3, and the two vertical guiding posts 30 are respectively close to the left and right ends of the conductive frame 3.

In this embodiment, referring to fig. 10, an inverted "U" shaped fastening groove 12 is fixed at the rear end of the i-shaped frame 11, a plurality of anti-falling fins 120 capable of being turned over are arranged in the fastening groove 12, the anti-falling fins 120 are arranged obliquely, and an included angle between the anti-falling fins 120 and the moving direction of the electroplating transfer rack is an acute angle. Further, the upper end of the anti-reverse fin 120 is rotationally matched with the side wall of the catching groove 12, and the lower end of the anti-reverse fin 120 extends towards the lower part of the catching groove 12. The anti-reverse fins 120 are arranged obliquely and used for matching with preset reverse teeth on the electroplating line, and when the electroplating transfer hanger moves forwards, the anti-reverse fins are clamped at corresponding positions, so that the electroplating transfer hanger is prevented from moving backwards and forwards.

In practical application, the main conductive mechanism 8 is a main conductive mode, the auxiliary conductive mechanism 9 further enhances the conductivity to enable the conductivity to be better, the upper conductive clamp is mainly connected with the auxiliary conductive through the auxiliary conductive connecting line for conduction, and the lower conductive clamp is mainly connected with the lower conductive clamp through the conductive frame Teflon spray coating and the U-shaped support flat and tin bronze conductive copper for conduction. The hanging tool is in seamless butt joint with an automatic upper circuit board and a lower circuit board or a manipulator upper circuit board and a manipulator lower circuit board, and the automatic tensioning of the 0.036 MM-1.0 MM circuit board can be realized through the circuit board tensioning device, so that the surface electroplating uniformity of the circuit board is higher in the electroplating process.

EXAMPLE III

In the prior art, an electroplating transfer hanger generally utilizes an upper clamp and a lower clamp to clamp a circuit board, then the circuit board is placed in electroplating liquid medicine for electroplating, in the process, the lower clamp needs to be immersed below the electroplating liquid medicine, in order to improve the electroplating uniformity, the lower clamp needs to be conductive at the same time, and the positions of the lower clamp except for a clamping point for clamping the circuit board can be coated with copper in the electroplating process, so that anode metal loss in the electroplating liquid medicine is caused, and meanwhile, the electroplating quality is influenced.

To this end, the present invention provides a lower conductive clamp having sealing performance, capable of avoiding being coated with copper during an electroplating process, and avoiding wasting anode metal in an electroplating solution, as shown in fig. 2, fig. 6 and fig. 7, the lower conductive clamp 6 is mounted at a lower end of a preset conductive frame 3, the lower conductive clamp 6 includes a fixed jaw 60, a movable jaw 61 and a spring 62 for driving the movable jaw 61 and the fixed jaw 60 to clamp a flexible circuit board 100, a sealant layer 600 covers a surface of the fixed jaw 60, a bottom frame 31 is disposed at a lower end of the conductive frame 3, a sealing coating layer 310 covers a surface of the bottom frame 31, the fixed jaw 60 and the bottom frame 31 are stacked, the sealant layer 600 and the sealing coating layer 310 are in sealing fit, a conductive screw 63 penetrates through the fixed jaw 60, an end of the conductive screw 63 is screwed to the bottom frame 31, the nut of the conductive screw 63 is sleeved with a sealing sleeve 64, and the sealing sleeve 64 is in sealing fit with the joint of the encapsulating layer 600.

In the structure, the surface of the fixed clamping jaw 60 is covered with the encapsulating layer 600, the surface of the bottom frame 31 is covered with the sealing coating 310, and the nut of the conductive screw 63 is sleeved with the sealing sleeve 64, so that the lower conductive clamp 6 is completely covered and blocked by the insulating layer except for the clamping point for clamping the circuit board, thereby avoiding the copper-feeding condition caused by exposed clamp, further improving the sealing performance of the clamp, avoiding waste of anode metal in electroplating liquid medicine, on the basis, the fixed clamping jaw 60 and the bottom frame 31 are screwed and fixed by the conductive screw 63, further realizing the conductive function, and better meeting the application requirements.

In order to further improve the sealing performance of the joint between the sealing sleeve 64 and the encapsulating layer 600, in this embodiment, a first sealing ring 65 is sleeved outside a nut of the conductive screw 63, and the first sealing ring 65 is clamped between the sealing sleeve 64 and the fixed clamping jaw 60. Further, a first step opening 601 is formed in the encapsulating layer 600, and the first sealing ring 65 is located in the first step opening 601. Preferably, the first seal ring 65 is a teflon seal ring.

Accordingly, in order to improve the sealing performance of the screwing position of the conductive screw 63 and the bottom frame 31, in this embodiment, a second sealing ring 66 is sleeved on the conductive screw 63, and the second sealing ring 66 is sandwiched between the fixed jaw 60 and the bottom frame 31. In this embodiment, a second step opening 602 is formed in the encapsulating layer 600, and the second sealing ring 66 is located in the second step opening 602. Further, the second sealing ring 66 is a teflon sealing ring.

As a preferred material choice, in this embodiment, the sealing sleeve 64 is a PEEK sealing sleeve. The seal coating 310 is a teflon coating.

In practical application, the lower conductive clamp with sealing performance disclosed by the utility model enables the conductivity of the lower part of a circuit board of the lower conductive clamp to be more uniform based on a sealing mechanism on the surface layer of the lower conductive clamp, saves more anode metal, can enable the conductive clamp to conduct electricity, and has the advantage of reducing the risk of copper plating. The device is characterized in that a conductive clamp is arranged on a conductive frame sprayed with a PTFE coating through a conductive screw, the upper part of the conductive clamp is sealed by a sealing ring and a sealing sleeve, so that the conductive clamp is not contacted with and insulated from liquid medicine except other parts at a clamping point, and in addition, a circuit board can be clamped at the bottom of a liquid medicine tank so as not to float on the circuit board, so that the conductivity is more consistent and more anode metals are not lost.

Example four

In practical application, in order to ensure that the electroplating transfer hanging tool has the functions of electrifying and transferring the circuit board, the clamp of the electroplating transfer hanging tool can still keep conducting after the electroplating transfer hanging tool moves to the liquid medicine groove, in order to meet the requirements, a conducting mechanism needs to be arranged on the hanging tool, current transmission is ensured through continuous contact of the conducting mechanism and the conductor rail, but the hanging tool is difficult to avoid being influenced by jolting, turning, rusting or other conditions in the moving process, the electric connection relation between the conducting mechanism and the conductor rail at a certain position is unreliable, the electroplating effect of the circuit board is influenced at the moment, and the electroplating quality cannot meet the production requirement.

To this end, this embodiment provides an auxiliary conductive mechanism capable of performing a conductive compensation function on an electroplating transfer hanger to further improve the reliability of electrical connection, and as shown in fig. 3, fig. 8 and fig. 9, the auxiliary conductive mechanism 9 includes a strip-shaped conductive shell 90, a plurality of conductive swing arms 92 and at least one conductive swing block 93, the cross section of the conductive shell 90 is in an inverted "U" shape, a plurality of first conductive rotating shafts 91 parallel to each other are inserted between two sidewalls of the conductive shell 90, the plurality of first conductive rotating shafts 91 are sequentially distributed along the length direction of the conductive shell 90, the plurality of conductive swing arms 92 are respectively disposed on two sides of the conductive shell 90, an end of the first conductive rotating shaft 91 passes through the conductive swing arms 92, the conductive shell 90 and/or the conductive swing arms 92 are rotatably connected to the first conductive rotating shafts 91, at least two second conductive rotating shafts 94 are inserted in the conductive swing block 93, two ends of the second conductive rotating shaft 94 respectively penetrate through two conductive swing arms 92 which are symmetrical to each other, the conductive swing arms 92 and/or the conductive swing blocks 93 are rotatably connected to the second conductive rotating shaft 94, and the bottoms of the conductive swing blocks 93 are used for being electrically contacted with conductive rails.

In the structure, the two sides of the conductive shell 90 are respectively provided with the conductive swing arms 92 capable of swinging back and forth, the conductive swing block 93 is arranged between the two symmetrical conductive swing arms 92, when the transfer hanger moves, the bottom of the conductive swing block 93 is in electrical contact with the conductive rail under the action of gravity, and based on the matching of the auxiliary conductive mechanism and the main conductive mechanism of the hanger, the hanger is enabled to have dual conductive performance, the auxiliary conductive mechanism plays a role in conductive compensation for the electroplating transfer hanger, thereby greatly improving the reliability of the electrical connection of the hanger and further ensuring the electroplating quality.

In order to better match with the conductive rail, in this embodiment, the conductive swing arm 92 is inclined, and an included angle between the conductive swing arm 92 and the moving direction of the conductive shell 90 is an acute angle.

Preferably, two side walls of the conductive shell 90 are respectively formed with a stopper 95 bent outward, and the stopper 95 abuts against a side portion of the conductive swing arm 92 facing the moving direction. The stopper 95 may keep the conductive swing arm 92 in an inclined state by abutting against the conductive swing arm 92.

In this embodiment, the first conductive rotating shaft 91 is sleeved with a torsion spring 96, two ends of the torsion spring 96 are respectively abutted to the conductive shell 90 and the conductive swing block 93, and the conductive swing block 93 is driven to swing towards the moving direction by the elasticity applied by the torsion spring 96, so that the conductive swing arm 92 abuts against the stopper 95. Meanwhile, under the elastic force of the torsion spring 96, the conductive swing block 93 can be attached to the conductive rail more closely.

In this embodiment, an oblique portion 930 is formed at one end of the conductive pendulum block 93 facing the moving direction, and the oblique portion 930 is located at a bottom corner of the conductive pendulum block 93. The beveled portion 930 is mainly used to reduce friction between the conductive pendulum block 93 and the conductive rail.

The auxiliary conductive mechanism 9 disclosed in the present invention can be connected to the conductive clamp through a wire 10.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents or improvements made within the technical scope of the present invention should be included in the scope of the present invention.

Claims (7)

1. The utility model provides an electroplate overspeed device tensioner who moves and carry hanger which characterized in that, electroplate and move and carry the hanger including support frame, electrically conductive frame and last electrically conductive anchor clamps, electrically conductive frame with support frame fixed connection, overspeed device tensioner is including the tensioning motion board, go up electrically conductive anchor clamps with tensioning motion board fixed connection, two vertical slotted holes have been seted up on the support frame, be fixed with two round pin axles on the tensioning motion board, the round pin axle with vertical slotted hole one-to-one, the round pin axle passes vertical slotted hole, just the round pin axle can be relative vertical slotted hole slides from top to bottom, the tip of round pin axle is fixed with the stopper, the stopper card is located the outside of support frame, tensioning motion board with be connected with the extension spring between the electrically conductive frame.

2. The tensioning device for electroplating transfer rack as claimed in claim 1, wherein the support frame is an inverted "U" shaped support frame, and the conductive frame is fixedly connected to two arms of the support frame.

3. The tensioning device for the electroplating transfer rack as claimed in claim 1, wherein two vertical slots are respectively formed on two arms of the supporting frame.

4. The tensioning device for electroplating transfer rack of claim 3, wherein said vertical slot is near the lower end of the arm of said support rack.

5. The tensioning device for electroplating transfer hangers of claim 1 wherein said stop is in the shape of a pie.

6. The tensioning device for electroplating transfer rack according to claim 1, wherein two tension springs are connected between the tensioning moving plate and the conductive frame, and the two tension springs are respectively close to two ends of the tensioning moving plate.

7. The tensioning device for the electroplating transfer rack as claimed in claim 1, wherein the joint of the tensioning moving plate and the conductive frame is provided with two receiving slots, and two tension springs are respectively arranged in the two receiving slots.

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