CN113564675A - A electrically conductive clamp and coating machine for coating machine - Google Patents
A electrically conductive clamp and coating machine for coating machine Download PDFInfo
- Publication number
- CN113564675A CN113564675A CN202110736348.7A CN202110736348A CN113564675A CN 113564675 A CN113564675 A CN 113564675A CN 202110736348 A CN202110736348 A CN 202110736348A CN 113564675 A CN113564675 A CN 113564675A
- Authority
- CN
- China
- Prior art keywords
- clamping
- conductive
- clip
- clamping surface
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention discloses a conductive clamp for a film coating machine and the film coating machine, wherein the conductive clamp comprises a first clamping part and a second clamping part, the first clamping part comprises a conductive first clamping surface, and a first sealing part is formed around the first clamping surface; the second clamping part comprises a conductive second clamping surface, and a second sealing part is formed around the second clamping surface; the first clamping part and the second clamping part can move relatively to enable the conductive clamp to be in a clamping or opening state, when the conductive clamp is in the clamping state, the first clamping face is communicated with the second clamping face, and the first sealing part is matched with the second sealing part to seal the first clamping face and the second clamping face. This structure can prevent the plating efficiency from being lowered. And the first clamping surface and the second clamping surface of the conductive clamp can be prevented from being plated with copper, so that the coating efficiency of the coating machine is improved, and the service life of the coating machine is prolonged.
Description
Technical Field
The application relates to the field of electroplating, in particular to a conductive clamp for a film plating machine and the film plating machine.
Background
At present, lithium ion batteries are widely used, and have the advantages of large capacity, small volume, light weight and the like.
The current collector refers to a structure for collecting current, and in a lithium ion battery, the current collector mainly refers to a base metal, such as a copper foil, an aluminum foil and the like, for attaching an active material to a positive electrode or a negative electrode of the battery. The function of the battery is mainly to collect the current generated by the active materials of the battery so as to form larger current to be output. When the current collector is manufactured, a thicker metal plating layer is usually formed on the conductive base film in an electroplating mode so as to ensure the conductivity of the current collector. The conductive base film can be electroplated by a film plating machine.
When a film coating machine is used for coating, the conductive base film can be clamped by the conductive clamp so as to be immersed into the plating solution for electroplating. However, since the conductive clip is also partially immersed in the plating solution during the plating process, a plating layer is easily formed on the surface of the conductive clip, and when the plating layer is thick, the opening and closing of the conductive clip are affected and the conductive base film is easily punctured, and since the conductive capability of the conductive clip in the plating solution is higher than that of the conductive base film, the current passing through the conductive base film is reduced during the plating process, thereby affecting the plating efficiency.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a conductive clamp for a film plating machine and the film plating machine, and aims to solve the problem that the conductive clamp is difficult to normally use due to the fact that the conductive clamp is directly contacted with a plating solution in the prior art.
In order to solve the above technical problem, in a first aspect, the present invention provides a conductive clip for a film plating machine, including a first clamping portion, the first clamping portion includes a first clamping surface, the first clamping surface is a conductive surface, and a first sealing portion is formed around the first clamping surface; the second clamping part comprises a second clamping surface, the second clamping surface is a conductive surface, and a second sealing part is formed around the second clamping surface; the first clamping part and the second clamping part can move relatively to enable the conductive clamp to be in a clamping state or an opening state, when the conductive clamp is in the clamping state, the first clamping face is in contact conduction with the second clamping face, and the first sealing part is matched with the second sealing part to seal the first clamping face and the second clamping face.
According to the conductive clamp for the film plating machine, the first sealing part and the second sealing part are arranged on the clamping surface of the conductive clamp, so that when the conductive base film clamped by the conductive clamp is immersed in the plating solution, the plating solution is blocked outside the clamping surface of the conductive clamp by the first sealing part and the second sealing part, the first clamping surface and the second clamping surface of the conductive clamp are effectively protected, the first clamping surface and the second clamping surface are prevented from being plated with copper, the smooth opening and closing of the conductive clamp are ensured, and the service life of the conductive clamp is prolonged.
In a possible implementation manner of the first aspect, the first sealing portion is a first sealing ring arranged around the first clamping surface, at least a part of the first sealing ring protrudes out of the first clamping surface, the second sealing portion is a first annular sealing groove arranged around the second clamping surface, and when the conductive clamp is in the clamping state, a part of the first sealing ring protruding out of the first clamping surface is matched and clamped into the first annular sealing groove. The conducting clamp clamping surface is sealed in a mode of combining the sealing ring and the sealing groove, and the structure is simple and the sealing effect is good.
In a possible implementation manner of the first aspect, an annular mounting groove is formed on the first clamping portion around the first clamping surface, and the sealing ring is clamped in the annular mounting groove. The first sealing ring is clamped and arranged in the annular mounting groove, the annular mounting groove can limit the sealing ring, and the clamping and fixing mode facilitates the detachment and replacement of the sealing ring.
In a possible implementation manner of the first aspect, an elastic clamping portion is arranged on one side, located in the annular mounting groove, of the first sealing ring. Elasticity is exerted to the inner wall of mounting groove to elasticity joint portion, prevents that the sealing washer is not hard up.
In a possible implementation manner of the first aspect, the conductive clip is made of a conductive metal material, the surface of the conductive clip is coated with an insulating sleeve, and the insulating sleeve avoids the arrangement of the first clamping surface and the second clamping surface. The insulating sleeve is arranged to protect the conductive clamp body, so that the conductive clamp is prevented from contacting with the plating solution, the manufacturing process of the insulating sleeve is simple, and the conductive clamp is convenient to disassemble and replace.
In a possible implementation manner of the first aspect, the surface of the conductive clip is configured to: except the first clamping surface and the second clamping surface, at least one part of the rest surfaces which can enter into the plating solution during plating is an insulating surface. Because the surface of the conductive clip immersed in the plating solution is set as an insulating surface, the surface of the conductive clip cannot conduct electricity after being immersed in the plating solution, so that the current passing through the conductive base film cannot be reduced, and the reduction of the electroplating efficiency is prevented.
In a possible implementation manner of the first aspect, a magnetic strip is embedded in the first sealing ring, and when the conductive clamp is in a clamping state, the magnetic strip is attracted to the second clamping portion. This further increases the tightness between the sealing ring and the sealing groove.
In a possible implementation manner of the first aspect, a second sealing ring is further arranged on the second clamping portion around the periphery of the first annular sealing groove, part of the second sealing ring protrudes out of the second clamping surface, a second annular sealing groove is further arranged on the first clamping portion around the periphery of the first sealing ring, and when the conductive clamp is in a clamping state, the part of the second sealing ring protruding out of the first clamping surface is matched and clamped into the second annular sealing groove. This makes it possible to form a double seal around the clamping surface, thereby further improving the sealing effect.
In a possible implementation manner of the first aspect, the depth of the first annular seal groove is less than or equal to the height of the first seal ring protruding out of the first clamping surface; the depth of the second annular sealing groove is smaller than or equal to the height of the second sealing ring protruding out of the second clamping surface. Therefore, when the conductive clamp is in a clamping state, the sealing ring can be abutted to the bottom of the sealing groove, so that the contact area between the sealing ring and the sealing groove is increased, and the sealing effect is further improved.
In a possible implementation manner of the first aspect, the sealing ring is made of ethylene propylene diene monomer or hypalon, and both the ethylene propylene diene monomer and the hypalon have good corrosion resistance, wear resistance and elasticity, and when the sealing ring is used as a material of the sealing ring, the sealing ring is high in reliability and long in service life.
In a possible implementation manner of the first aspect, the conductive clip further comprises a support, a guide post is arranged on the support, the first clamping portion and the second clamping portion are both in sliding connection with the guide post, an elastic piece is arranged between the first clamping portion and the second clamping portion, and the elastic piece is used for keeping the first clamping portion and the second clamping portion in an open state. When the conductive base film is required to be clamped, only the clamping force which moves oppositely needs to be applied to the first clamping part and/or the second clamping part until the first clamping part and the second clamping part clamp the conductive base film; when the conductive base film is loosened, only the clamping force needs to be removed, the first clamping part and the second clamping part can be automatically separated, and the conductive clamp is simple in structure and convenient to use.
In a possible implementation manner of the first aspect, the number of the guide posts is multiple, the guide posts are parallel to each other, the elastic member is a spring, and the spring is sleeved on the guide posts. The guide posts which are parallel to each other are arranged, so that the first clamping part and the second clamping part can be guaranteed to be accurately folded, the spring sleeve is arranged on the guide posts, the spring can be conveniently positioned, and the spring is prevented from falling off.
In a possible implementation manner of the first aspect, a first universal ball is arranged on a surface of the first clamping portion away from the second clamping portion, and/or a second universal ball is arranged on a surface of the second clamping portion away from the first clamping portion. The universal ball can bear load and can roll, and when the conductive clamp is in sliding fit with the guide rail, the sliding friction can be changed into rolling friction by the universal ball, so that the abrasion of parts is reduced.
In a possible implementation manner of the first aspect, the support comprises a first supporting plate and a second supporting plate which are parallel to each other and arranged at intervals, and a connecting plate connected between the first supporting plate and the second supporting plate, the first clamping portion and the second clamping portion are both of plate-shaped structures and arranged between the first supporting plate and the second supporting plate, two ends of the guide column are fixed to the first supporting plate and the second supporting plate respectively, the first clamping portion is arranged close to the first supporting plate, the second clamping portion is arranged close to the second supporting plate, a first through hole is formed in the first supporting plate, a first universal ball on the first clamping portion extends out of the first supporting plate through the first through hole, a second through hole is formed in the second supporting plate, and a second universal ball on the second clamping portion extends out of the second supporting plate through the second through hole. When electrically conductive clamp is in the open mode, first backup pad and second backup pad can form spacingly to first clamping part and second clamping part for the opening range that electrically conductive clamp opened at every turn keeps unanimous, thereby has improved the structural stability when electrically conductive clamp is in the open mode.
In a possible implementation manner of the first aspect, the bracket further includes a connecting rod, the connecting rod is connected with the connecting plate, and the connecting rod is provided with a conductive block, and the conductive block is electrically connected with the first clamping surface and the second clamping surface respectively. The connecting rod can conveniently fix the conductive clamp, and the conductive block conveniently powers on the conductive clamp.
In a possible implementation manner of the first aspect, the first clamping portion is hinged to the second clamping portion through a hinge shaft, an elastic member is arranged between one end of the first clamping portion, which is far away from the clamping surface, and one end of the second clamping portion, which is far away from the clamping surface, and the elastic member is used for keeping the first clamping portion and the second clamping portion in a clamping state. After the conductive base film is clamped by the conductive clamp, the conductive base film can still be stably clamped without continuously applying force to the conductive clamp.
In a second aspect, the invention also provides a film coating machine, which comprises the conductive clamp in the first aspect.
According to the film plating machine provided by the invention, the conductive clamp in the first aspect is adopted, so that the first clamping surface and the second clamping surface of the conductive clamp can be prevented from being plated with copper, and the smooth opening and closing of the conductive clamp are ensured. Thereby improving the film coating efficiency and prolonging the service life of the film coating machine.
In a possible implementation manner of the second aspect, the coating machine comprises a plating solution tank, a first conveying mechanism and a second conveying mechanism, wherein the plating solution tank comprises a first side wall and a second side wall which extend along a first horizontal direction and are arranged oppositely; the first conveying mechanism comprises a first conveying belt and a plurality of first conductive clips, wherein the first conveying belt is arranged close to the first side wall and extends along a first horizontal direction; the second conveying mechanism comprises a second conveying belt which is arranged close to the second side wall and extends along the first horizontal direction, and a plurality of second conductive clips which are arranged on the second conveying belt and are arranged along the first horizontal direction; the first conductive clip and the second conductive clip are respectively used for clamping two opposite side edges of the horizontally placed film, and the first conductive clip and the second conductive clip are conductive clips in the first aspect. The film coating machine adopts a horizontal film-moving mode, and when coating, the whole conductive base film clamped by the first conductive clamp and the second conductive clamp is positioned in the plating solution tank, so that the phenomenon of electric breakdown caused by the reduction of the cooling effect when the part of the conductive base film is positioned outside the plating solution tank can be avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of an overall structure of a conductive clip according to an embodiment of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a cross-sectional view taken at A-A of FIG. 2;
FIG. 4 is a schematic diagram of the conductive clip of FIG. 3 in a clamping position;
FIG. 5 is a schematic structural view of the first clamping surface;
FIG. 6 is a schematic structural view of the second clamping surface;
FIG. 7 is a schematic diagram of a conductive clip with a double-layer sealing structure according to an embodiment of the present invention;
FIG. 8 is an enlarged view taken at A in FIG. 7;
FIG. 9 is a schematic view of a first clamping face of a conductive clip provided with a double layer seal configuration;
FIG. 10 is a schematic view of a second clamping face of a conductive clip provided with a double layer seal configuration;
FIG. 11 is a schematic view of the first seal ring shown separated from the first annular mounting groove;
FIG. 12 is an enlarged view at B in FIG. 11;
FIG. 13 is a schematic structural view of a first seal ring with an elastic clamping portion;
FIG. 14 is a schematic view of a first seal ring with a magnetic strip;
FIG. 15 is a front view of a normally open conductive clip;
fig. 16 is an exploded view of a normally open conductive clip;
FIG. 17 is a schematic view of a normally open conductive clip in and out of a guide rail;
FIG. 18 is a schematic view of a normally closed conductive clip
FIG. 19 is a top view of a coater.
Description of reference numerals:
1. 1 a-a conductive clip; 11. 11 a-a first clamping portion; 111-a first clamping surface; 112-an annular mounting groove; 113-a first universal ball; 114-a first terminal post; 12. 12 a-a second clamping portion; 121-a second clamping surface; 122-a second ball transfer unit; 123-a second terminal; 13-a first seal; 131-a first seal ring; 1311-elastic clip part; 1312-a magnetic strip; 132-a second annular seal groove; 14-a second seal; 141-a first annular seal groove; 142-a second seal ring; 15-an insulating sleeve; 16-a scaffold; 161-a first support plate; 1611 — a first via; 162-a second support plate; 1621-a second via; 163-connecting plate; 164-a connecting rod; 1641-conductive blocks; 17-a guide post; 18. 18 a-an elastic member; 100-coating machine; 101-plating bath; 1011-a first side wall; 1012-a second sidewall; 102-a first transport mechanism; 1021-a first conveyor; 1022 — a first conductive clip; 103-a second transport mechanism; 1031-a second transfer belt; 1032-a second conductive clip; 200-a conductive base film; x-first horizontal direction.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
Electroplating is the process of plating a layer of other metal or alloy on the surface of some plated parts by using the principle of electrolysis. Specifically, a plating metal or other insoluble materials is used as an anode, a workpiece to be plated is used as a cathode, and a liquid containing plating metal ions is used as a plating solution. Before electroplating, the anode and the cathode are electrified, the current forms a loop among the anode, the plating solution and the cathode, and cations of plating metal are reduced on the surface of a workpiece to be plated to form a plating layer in the electroplating process.
In a process of manufacturing a current collector of a lithium ion battery, a thick metal plating layer is generally formed on a conductive base film using an electroplating process to manufacture the current collector. The electroplating process can be specifically completed by using a film coating machine.
The film plating machine comprises a plating solution tank and a conductive base film conveying device, wherein plating solution is filled in the plating solution tank, and the conductive base film conveying device is used for conveying the conductive base film into the plating solution tank. Specifically, electrically conductive base film conveyer includes the conveyer belt and electrically conducts the clamp, and electrically conductive clamp is used for the electrically conductive base film of centre gripping and to the electrically conductive base film circular telegram, and the conveyer belt is used for driving electrically conductive clamp and removes to make electrically conductive base film get into the plating bath inslot.
In the electroplating process, the conductive clamp needs to frequently go in and out of the plating solution, and because the conductive clamp is made of a conductive material, a layer of plating layer is often formed on the surface of the conductive clamp, so that the use of the conductive clamp is influenced.
In view of this, the embodiment of the present invention provides a conductive clip for a film plating machine and a film plating machine, which can ensure that a conductive portion of the conductive clip does not directly contact with a plating solution during a use process of the conductive clip, thereby preventing the surface of the conductive clip from being plated with copper, increasing a service life of the conductive clip, and increasing plating efficiency.
The conductive clip and coater are described in detail below with specific examples:
example one
The embodiment of the application provides a conductive clip 1 for a film plating machine, as shown in fig. 1 and fig. 2, the conductive clip 1 comprises a first clamping part 11 and a second clamping part 12, and the first clamping part 11 and the second clamping part 12 can move relatively to enable the conductive clip 1 to be in a clamping state or an opening state.
As shown in fig. 3, the first clamping portion 11 includes a first clamping surface 111, the first clamping surface 111 is a conductive surface, the second clamping portion 12 includes a second clamping surface 121, and the second clamping surface 121 is also a conductive surface, and when the conductive clip 1 is in a clamping state, the first clamping surface 111 and the second clamping surface 121 can be in contact with each other. When the conductive base film is clamped, the first clamping surface 111, the second clamping surface 121 and the conductive base film are all electric conductors, so that a conductive path is formed after the three parts are contacted.
In order to prevent the conductive portion of the conductive clip 1 from being plated with copper, as shown in fig. 3, a first sealing portion 13 may be provided around the first clamping surface 111, and a second sealing portion 14 may be provided around the second clamping surface 121.
Thus, when the conductive clip is in the clamped state, the first sealing portion 13 can cooperate with the second sealing portion 14 to seal the first clamping face 111 and the second clamping face 121. When the conductive clip 1 in the clamping state needs to enter the plating solution, the areas where the first clamping surface 111 and the second clamping surface 121 of the conductive clip 1 are located are sealed after being matched by the first sealing part 13 and the second sealing part 14, so that the plating solution is prevented from contacting the first clamping surface 111 and the second clamping surface 121, the first clamping surface 111 and the second clamping surface 121 are prevented from being plated with copper, the conductive clip 1 is ensured to be opened and closed smoothly, and the conductive base film is prevented from being punctured by the plating layer of the clamping surface.
Specifically, the first sealing portion 13 and the second sealing portion 14 can be implemented in various ways, as shown in fig. 5, the first sealing portion 13 can be designed as a first sealing ring 131 disposed around the first clamping surface 111, and the second sealing portion 14 can be designed as an annular flat surface (not shown) disposed around the second clamping surface 121, and when the conductive clip 1 is in the clamping state, the first sealing ring 131 is pressed and deformed by the annular flat surface to seal the first clamping surface 111 and the second clamping surface 121. The structure is simple and the manufacture is convenient.
In addition, in order to improve the sealing effect, as shown in fig. 3 and 6, the second sealing portion 14 may be further designed as a first annular sealing groove 141 disposed around the second clamping surface 121, when the conductive clip is in the clamping state, a portion of the first sealing ring 131 protruding from the first clamping surface 111 is fitted and clamped in the first annular sealing groove 141, and a conductive base film contacting with an end of the first sealing ring 131 is also squeezed into the first annular sealing groove 141 along with the first sealing ring 131, so that the first clamping surface 111 and the second clamping surface 121 are sealed, and the plating solution is prevented from contacting with the clamping surface. The structure adopts the matching structure of the sealing ring and the annular sealing groove, so that the sealing area can be increased, and the sealing effect is further improved.
In another implementation, as shown in fig. 7, 8 and 10, a second sealing ring 142 may be further disposed on the second clamping portion 12 around the outer circumference of the first annular sealing groove 141, such that the second sealing ring 142 partially protrudes from the second clamping surface 121, and accordingly, a second annular sealing groove 142 may be disposed on the first clamping portion 11 around the outer circumference of the first sealing ring 131. When the conductive clip 1 is in the clamping state, the portion of the second sealing ring 142 protruding from the first clamping surface 111 is fitted into the second annular sealing groove 132. Thus, first seal ring 131 cooperates with first annular seal groove 141 to form a first seal. While the second seal ring 142 cooperates with the second annular seal groove 132 to form a second seal. The double-layer sealing structure can further improve the sealing effect.
When the depth of the annular seal groove is set, the depth of the first annular seal groove 141 may be smaller than or equal to the height of the first seal ring 131 protruding from the first clamping surface 121; the depth of the second annular seal groove 132 is made less than or equal to the height of the second seal ring 142 projecting above the second clamping surface. After the arrangement, as shown, the first sealing ring 131 and the second sealing ring 142 can be abutted to the bottoms of the first annular sealing groove 141 and the second annular sealing groove 132 respectively, so as to ensure sufficient contact between the sealing rings and the sealing grooves, and improve the sealing effect.
The fixing of the sealing ring can be achieved in various ways, for example, the first sealing ring 131 can be directly bonded to the first clamping surface 111. As shown in fig. 11 and 12, a ring-shaped mounting groove 112 may be formed around the first clamping surface 111 in the first clamping portion 11, and the first seal ring 131 may be engaged with the ring-shaped mounting groove 112. When the sealing ring needs to be installed, the annular installation groove 112 can be used for positioning the first sealing ring 131, so that the installation operation is more convenient. When the sealing effect of the first sealing ring 131 is reduced after the first sealing ring is frequently used and the sealing ring needs to be replaced, the first sealing ring 131 can be directly pulled out of the annular mounting groove 112, so that the first sealing ring 131 can be conveniently detached.
In order to make the clamping of the first sealing ring 131 more stable, as shown in fig. 13, an elastic clamping portion 1311 may be disposed on one side of the first sealing ring 131 located in the annular mounting groove 112, and specifically, the elastic clamping portion 1311 may be configured as an elastic sheet, an elastic rib, or an elastic flange fixed on a side surface of the sealing ring. When installing first sealing washer 131 into annular mounting groove, elasticity joint portion is compressed, and elasticity joint portion 1311 extrusion mounting groove's after the compression inner wall prevents that the sealing washer from taking place not hard up.
To prevent the remaining surface of the conductive clip from being plated with copper, the surface of the conductive clip may also be configured to: except for the first clamping surface 111 and the second clamping surface 121, the rest surfaces which can be immersed into the plating solution during plating are designed as insulating surfaces. Because the surface of the conductive clip immersed in the plating solution is set as an insulating surface, the surface of the conductive clip cannot conduct electricity after being immersed in the plating solution, so that the current passing through the conductive base film cannot be reduced, and the reduction of the electroplating efficiency is prevented.
There are various ways to insulate the surface of the conductive clip, for example, the conductive clip may be made of an insulating material, only the first clamping surface 111 and the second clamping surface 121 are provided with conductive sheets, and then the conductive sheets are connected to the negative electrode of the power supply through wires.
In addition, as shown in fig. 4, the conductive clip may be made of a conductive metal material, and then an insulating sleeve 15 is covered on the surface of the conductive clip, and the insulating sleeve 15 is disposed away from the first clamping surface 111 and the second clamping surface 121. The whole inner part of the conductive clamp 1 can be made to be a conductive body, so that the first clamping surface 111 and the second clamping surface 121 can be electrified from the inner part of the conductive clamp, for example, a part of the conductive surface exposed at the top of the conductive clamp is not coated with the insulating layer 15, or a conductive hole is formed at the top of the conductive clamp to be connected with a power supply cathode, so that a lead can be avoided, and the structure of the conductive clamp is simpler.
Besides the first clamping surface 111 and the second clamping surface 121, the rest surfaces of the conductive clamp, which can be immersed in the plating solution during plating, are coated with insulating sleeves. Only the insulating sleeves 15 covering the first and second clamping portions 11, 12 are shown in fig. 4, and the insulating sleeves covering the rest of the conductive clip are not shown in the figure.
In order to improve the clamping force of the conductive clip 1 in the clamping state, as shown in fig. 14, a magnetic stripe 1312 may be embedded in the first sealing ring 131, and when the conductive clip 1 is in the clamping state, the magnetic stripe 1312 wrapped in the first sealing ring 131 and the second clamping portion 12 attract each other, so as to improve the clamping force of the conductive clip 1 in the clamping state, so that the conductive base film is clamped more stably by the conductive clip, and the first sealing ring 131 and the second clamping portion 12 are attached more tightly, so that the sealing effect is better.
In addition, the material for manufacturing the sealing ring can be ethylene propylene diene monomer or HEPA, firstly, the sealing ring is made of a material with good corrosion resistance in order to prevent the sealing ring from being corroded by the plating solution due to the fact that the sealing ring is contacted with the plating solution for a long time, secondly, the sealing ring needs to be repeatedly sealed and has certain wear resistance, and finally, the sealing ring with good elastic performance is selected to be more beneficial to combination of the sealing ring and a sealing part, and the ethylene propylene diene monomer and HEPA have good corrosion resistance, wear resistance and good elasticity, so that when the sealing ring is used as the material of the sealing ring, the sealing ring can be prevented from being corroded by the plating solution, and the service life of the sealing ring can be prolonged.
Alternatively, there may be a variety of structures that achieve the clamping and opening of the conductive clip. Fig. 15 and 16 show that a normally open type conductive clip 1 is provided, the conductive clip includes a support 16, a guiding post 17 is disposed on the support 16, both the first clamping portion 11 and the second clamping portion 12 are slidably connected to the guiding post 17, and an elastic member 18 is disposed between the first clamping portion 11 and the second clamping portion 12. The elastic member 18 is used to keep the first clamping portion 11 and the second clamping portion 12 in an open state, and specifically, when an external force is applied to bring the first clamping portion 11 and the second clamping portion 12 close to each other, the elastic member is compressed until the first clamping portion 11 and the second clamping portion 12 clamp the conductive base film. When the external force disappears, the elastic member 18 is restored to its original shape by the restoring force, so that the first clamping portion 11 and the second clamping portion 12 are separated (i.e., in the open state). By using the normally open type conductive clamp, after the force applied to the conductive clamp is removed, the conductive clamp 1 can automatically recover to the open state, so that the clamping surface of the conductive clamp can be conveniently cleaned when the conductive clamp 1 does not work.
Wherein, as shown in fig. 16, the guide posts 17 can be set to be a plurality of, and simultaneously keep a plurality of guide posts to be parallel to each other, and a plurality of guide posts 17 simultaneously guide first clamping part 11 and second clamping part 12, not only are favorable to improving the stability of the opening and closing movement of conductive clamp 1, also can guarantee first clamping part 11 and second clamping part 12 and fold accurately, prevent first clamping part 11 and second clamping part 12 dislocation. In addition, a spring can be selected as the elastic member 18 in this embodiment, so that the spring can be directly sleeved on the guide post 17, so as to limit the spring and prevent the spring from falling off.
Because the conductive clip shown in fig. 16 is a normally open structure, the first clamping portion 11 and the second clamping portion 12 need to be closed under the action of external force, for example, the conductive clip 1 can be matched with a guide rail to open and close the conductive clip 1, as shown in fig. 17, the conductive clip 1 is disposed between the upper guide rail 2 and the lower guide rail 3, the upper guide rail 2 and the lower guide rail 3 are fixed, the conductive clip 1 can move along a straight line, and because the distance between the guide surfaces of the upper guide rail 2 and the lower guide rail 3 is gradually reduced from left to right, when the conductive clip 1 moves from left to right between the upper guide rail 2 and the lower guide rail 3, the first clamping portion 11 and the second clamping portion 12 are gradually pressed and closed by the upper guide rail 2 and the lower guide rail 3. That is, the leftmost conductive clip in fig. 17 has not been pressed by the upper rail 2 and the lower rail 3, and thus is in an open state; the middle conductive clip of fig. 17 is pressed by the upper rail 2 and the lower rail 3, so that it is in a closed state and is in sliding contact with the upper rail 2 and the lower rail 3; the rightmost conductive clip in fig. 17 has moved out of the pressing range of the upper and lower rails 2 and 3, and thus it is restored to the open state again by the elastic member 18.
In the process of closing the conductive clip, sliding friction is formed because the clamping part is in sliding contact with the guide rail. In order to reduce the friction force, as shown in fig. 15 and 16, a first ball transfer bearing 113 may be provided on a surface of the first clamping portion 11 away from the second clamping portion 12, or a second ball transfer bearing 122 may be provided on a surface of the second clamping portion 12 away from the first clamping portion 11, and a ball transfer bearing may be provided on both a surface of the first clamping portion 11 away from the second clamping portion 12 and a surface of the second clamping portion 12 away from the first clamping portion 11. The universal ball can bear load and can roll, and when the conductive clamp is in sliding fit with the guide rail, the sliding friction can be changed into rolling friction by the universal ball, so that the abrasion of parts is reduced.
As shown in fig. 16, the bracket 16 includes a first support plate 161 and a second support plate 162 that are parallel to and spaced apart from each other, and a connection plate 163 connected between the first support plate 161 and the second support plate 162. In addition, the first clamping portion 11 and the second clamping portion 12 may be designed to be plate-shaped structures, the first clamping portion 11 and the second clamping portion 12 may be disposed between the first support plate 161 and the second support plate 162, the first clamping portion 11 may be disposed near the first support plate 161, the second clamping portion 12 may be disposed near the second support plate 162, and two ends of the guide column 17 may be fixed to the first support plate 161 and the second support plate 162, respectively. As shown in fig. 4, a first through hole 1611 may be formed in the first support plate 161, the first ball gimbal 113 of the first clamping portion 11 may protrude out of the first support plate 161 through the first through hole 1611, a second through hole 1621 may be formed in the second support plate 162, and the second ball gimbal 122 of the second clamping portion 12 may protrude out of the second support plate 162 through the second through hole 1621.
When the clamping device is used, because the universal ball extends out of the supporting plate, external forces which are opposite to each other can be applied to the universal ball on the first clamping part 11 and the universal ball on the second clamping part 12 on the outer side of the supporting plate, the external forces applied to the universal ball are respectively transmitted to the first clamping part 11 and the second clamping part 12, the first clamping part 11 and the second clamping part 12 are gradually closed, and meanwhile, the spring between the first clamping part 11 and the second clamping part 12 is compressed. When specifically arranging the universal balls, it should be ensured that when the conductive clip 1 is in the clamping state, part of the universal balls should still protrude out of the first support plate 161 and the second support plate 162, and the purpose of this arrangement is to make the conductive clip 1 in the clamping state, and the friction between the conductive clip 1 and the guide rail still can be kept as rolling friction, so as to reduce the friction force.
Specifically, as shown in fig. 16, in order to facilitate the installation of the conductive clip, the bracket 16 may further include a connecting rod 164, the connecting rod 164 is connected to the connecting plate 163, a conductive block 1641 is disposed on the connecting rod 164, and the conductive block 1641 is electrically connected to the first clamping surface 111 and the second clamping surface 121, respectively. Wherein the connecting rod can make things convenient for the installation of electrically conductive clamp, specifically, can be connected electrically conductive clamp 1 and drive arrangement through connecting rod 164 to drive electrically conductive clamp 1 and remove. The conductive bumps 1641 facilitate energizing the conductive clip 1. Specifically, as shown in fig. 6, a first terminal 114 may be disposed on a side wall of the first clamping portion 11, a second terminal 123 may be disposed on a side wall of the second clamping portion 12, the first terminal 114 may be electrically connected to the first clamping surface 111, the second terminal 123 may be electrically connected to the second clamping surface 121, and then the terminals may be electrically connected to the conductive block by a wire, and the conductive block may be connected to the negative electrode of the power supply.
In another implementation manner, the conductive clip may also be a normally closed conductive clip, as shown in fig. 18, the conductive clip 1a includes a first clamping portion 11a and a second clamping portion 12a hinged by a hinge shaft, and an elastic member 18a is disposed between an end of the first clamping portion 11a away from the clamping surface and an end of the second clamping portion 12a away from the clamping surface. The elastic member 18a functions to hold the first clamping portion 11a and the second clamping portion 12a in a clamped state. In one embodiment, the elastic member 18a may be a spring. When the conductive base film clamping device is used, external force is applied to the first clamping part 11a and the second clamping part 12a, the conductive clamp 1a in the clamping state is opened, when the conductive base film enters between the opened first clamping part and the opened second clamping part, the external force is removed, and the first clamping part 11a and the second clamping part 12a can clamp the conductive base film. After the conductive clamp 1a clamps the plated piece, the plated piece can still be stably clamped without continuously applying force to the conductive clamp.
It should be noted that the conductive clip in the normally closed structure shown in fig. 18 is only for illustrating an opening and closing manner of the conductive clip, and the clamping surface sealing structure of the conductive clip in the normally closed structure shown in fig. 18 is similar to the clamping surface sealing structure of the normally open conductive clip, and is not described herein again. The sealing structure of the conductive clip in the present application is not limited by the opening and closing form of the conductive clip.
Example two
The embodiment also provides a film plating machine comprising the conductive clip of the first embodiment.
The coating machine that this embodiment provided owing to adopted the electrically conductive clamp of first aspect for in the coating process, can not make the electric current through electrically conductive base film reduce, prevented that electroplating efficiency from declining. And the first clamping surface 111 and the second clamping surface 121 of the conductive clip can be prevented from being plated with copper. Thereby improving the film coating efficiency and prolonging the service life of the film coating machine.
Specifically, as shown in fig. 19, the film plating machine 100 may be a horizontal-film-type film plating machine, the film plating machine 100 includes a plating bath tank 101, a first conveying mechanism 102 and a second conveying mechanism 103, the plating bath tank 101 includes a first side wall 1011 and a second side wall 1012 extending in a first horizontal direction X and disposed opposite to each other, and an anode member and a plating solution (not shown in the figure) are disposed in the plating bath tank 101; the first conveying mechanism 102 includes a first conveying belt 1021 which is disposed near the first side wall 1011 and extends along the first horizontal direction X, the first conveying belt 1021 is provided with a plurality of first conductive clips 1022, and the plurality of first conductive clips 1022 are arranged along the first horizontal direction X; the second transfer mechanism 103 includes a second transfer belt 1031 that is provided adjacent to the second side wall 1012 and extends in the first horizontal direction X, and a plurality of second conductive clips 1032 are provided on the second transfer belt 1031 and arranged such that the plurality of second conductive clips 1032 are aligned in the first horizontal direction X; the first conductive clip 1022 and the second conductive clip 1032 are respectively used for clamping two opposite sides of the horizontally placed conductive base film 200, and the first conductive clip 1022 and the second conductive clip 1032 can use the conductive clips of the first aspect, during operation, the plurality of conductive clips are driven by the conveyor belt to move along the first horizontal direction, when the conductive clips move to a preset position, the conductive clips clamp the conductive base film 200 from two sides and drive the conductive base film 200 to move forwards, and meanwhile, the film is electrified for electroplating.
The film coating machine adopts a horizontal film-moving mode, and when coating, the whole conductive base film 200 clamped by the first conductive clamp 1022 and the second conductive clamp 1032 is positioned in the plating solution tank 101, so that the phenomenon of electric breakdown caused by the reduction of the cooling effect when the part of the conductive base film 200 is positioned outside the plating solution tank 101 can be avoided.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (14)
1. The utility model provides a conductive clamp for coating machine which characterized in that includes:
the clamping device comprises a first clamping part and a second clamping part, wherein the first clamping part comprises a first clamping surface which is a conductive surface, and a first sealing part is formed around the first clamping surface;
the second clamping part comprises a second clamping surface, the second clamping surface is a conductive surface, and a second sealing part is formed around the second clamping surface;
the first clamping part and the second clamping part can move relatively to enable the conductive clamp to be in a clamping state or an opening state, when the conductive clamp is in the clamping state, the first clamping surface is in contact conduction with the second clamping surface, and the first sealing part is matched with the second sealing part to seal the first clamping surface and the second clamping surface.
2. The conductive clip of claim 1, wherein the first sealing portion is a first sealing ring disposed around the first clamping surface, the first sealing ring at least partially protrudes from the first clamping surface, the second sealing portion is a first annular sealing groove disposed around the second clamping surface, and when the conductive clip is in the clamping state, a portion of the first sealing ring protruding from the first clamping surface is engaged and clamped in the first annular sealing groove.
3. The clip of claim 2, wherein an annular mounting groove is formed on the first clip portion around the first clip surface, and the first sealing ring is engaged in the annular mounting groove.
4. The clip of claim 3, wherein the first sealing ring has a resilient locking portion at a side thereof located in the annular mounting groove.
5. The conductive clip of claim 1, wherein the surface of the conductive clip is configured to: except the first clamping surface and the second clamping surface, at least one part of the rest surfaces which can enter into the plating solution during plating is an insulating surface.
6. The clip of claim 2, wherein the clip is made of a conductive metal material, wherein the surface of the clip is coated with an insulating sleeve, and wherein the insulating sleeve is disposed free of the first clamping surface and the second clamping surface.
7. The conductive clip of claim 6, wherein a magnetic strip is embedded in the first sealing ring, and the magnetic strip is engaged with the second clamping portion when the conductive clip is in the clamping state.
8. The conducting clip of claim 2, wherein a second sealing ring is further disposed on the second clamping portion around the outer circumference of the first annular sealing groove, the second sealing ring partially protrudes from the second clamping surface, a second annular sealing groove is further disposed on the first clamping portion around the outer circumference of the first sealing ring, and when the conducting clip is in the clamping state, the portion of the second sealing ring protruding from the first clamping surface is engaged with and clamped into the second annular sealing groove.
9. The clip of claim 8, wherein the depth of the first annular seal groove is less than or equal to the height of the first seal ring protruding beyond the first clamping surface; the depth of the second annular sealing groove is smaller than or equal to the height of the second sealing ring protruding out of the second clamping surface.
10. The conductive clip according to any one of claims 1 to 9, further comprising a support, wherein a guide post is disposed on the support, the first clamping portion and the second clamping portion are both slidably connected to the guide post, and an elastic member is disposed between the first clamping portion and the second clamping portion, and the elastic member is configured to keep the first clamping portion and the second clamping portion in an open state.
11. The clip of claim 10, wherein the plurality of guide posts are parallel to each other, the resilient member is a spring, and the spring is received on the guide posts.
12. The clip according to any one of claims 1 to 9, wherein the first clip portion is hinged to the second clip portion by a hinge shaft, and an elastic member is provided between an end of the first clip portion remote from the clip surface and an end of the second clip portion remote from the clip surface, the elastic member being configured to hold the first clip portion and the second clip portion in a clip state.
13. A coater comprising the conductive clip according to any one of claims 1 to 12.
14. The coater of claim 13 wherein,
the film plating machine comprises a plating solution tank, a first conveying mechanism and a second conveying mechanism,
the plating solution tank comprises a first side wall and a second side wall which extend along a first horizontal direction and are oppositely arranged;
the first conveying mechanism comprises a first conveying belt which is arranged close to the first side wall and extends along the first horizontal direction, and a plurality of first conductive clips which are arranged on the first conveying belt and are arranged along the first horizontal direction;
the second conveying mechanism comprises a second conveying belt which is arranged close to the second side wall and extends along the first horizontal direction, and a plurality of second conductive clips which are arranged on the second conveying belt and are arranged along the first horizontal direction;
the first conductive clip and the second conductive clip are respectively used for clamping two opposite side edges of a horizontally placed film, and the first conductive clip and the second conductive clip are the conductive clips in any one of claims 1 to 12.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2021202648601 | 2021-01-30 | ||
| CN202120264860 | 2021-01-30 | ||
| CN202120367452 | 2021-02-07 | ||
| CN2021203674529 | 2021-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113564675A true CN113564675A (en) | 2021-10-29 |
Family
ID=78163178
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121482132.4U Active CN215925114U (en) | 2021-01-30 | 2021-06-30 | Conductive clamp and film coating machine |
| CN202110736348.7A Pending CN113564675A (en) | 2021-01-30 | 2021-06-30 | A electrically conductive clamp and coating machine for coating machine |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121482132.4U Active CN215925114U (en) | 2021-01-30 | 2021-06-30 | Conductive clamp and film coating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN215925114U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115012020A (en) * | 2022-06-15 | 2022-09-06 | 江苏亨通精密铜业有限公司 | Electroplating clamp and coating machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755271A (en) * | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| US6319383B1 (en) * | 1997-08-21 | 2001-11-20 | Atotech Deutschland Gmbh | Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
| US20140251798A1 (en) * | 2011-10-19 | 2014-09-11 | Jcu Corporation | Substrate electroplating jig |
| US20150294894A1 (en) * | 2012-11-14 | 2015-10-15 | Jcu Corporation | Substrate plating jig |
| JP2018193601A (en) * | 2017-05-22 | 2018-12-06 | 丸仲工業株式会社 | A clamp jig for a plate-like material to be treated in a horizontal transporting metal plating processing unit |
| WO2020152922A1 (en) * | 2019-01-23 | 2020-07-30 | 上村工業株式会社 | Workpiece holding jig and electroplating device |
-
2021
- 2021-06-30 CN CN202121482132.4U patent/CN215925114U/en active Active
- 2021-06-30 CN CN202110736348.7A patent/CN113564675A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755271A (en) * | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| US6319383B1 (en) * | 1997-08-21 | 2001-11-20 | Atotech Deutschland Gmbh | Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
| US20140251798A1 (en) * | 2011-10-19 | 2014-09-11 | Jcu Corporation | Substrate electroplating jig |
| US20150294894A1 (en) * | 2012-11-14 | 2015-10-15 | Jcu Corporation | Substrate plating jig |
| JP2018193601A (en) * | 2017-05-22 | 2018-12-06 | 丸仲工業株式会社 | A clamp jig for a plate-like material to be treated in a horizontal transporting metal plating processing unit |
| WO2020152922A1 (en) * | 2019-01-23 | 2020-07-30 | 上村工業株式会社 | Workpiece holding jig and electroplating device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115012020A (en) * | 2022-06-15 | 2022-09-06 | 江苏亨通精密铜业有限公司 | Electroplating clamp and coating machine |
| CN115012020B (en) * | 2022-06-15 | 2023-12-12 | 江苏瀚叶铜铝箔新材料研究院有限公司 | Electroplating clamp and coating machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN215925114U (en) | 2022-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11888112B2 (en) | Rechargeable battery with anion conducting polymer | |
| CN100365860C (en) | Rechargeable battery | |
| CN113481573A (en) | Film coating machine, electroplating production line and continuous production method of battery current collector | |
| CN113564675A (en) | A electrically conductive clamp and coating machine for coating machine | |
| CN103125035A (en) | Electrode terminal for secondary battery and lithium secondary battery including the same | |
| CN201478392U (en) | High-power lithium ion power battery with collecting disc | |
| CN215925104U (en) | Brush, power supply assembly and film coating machine | |
| CN215925115U (en) | A electrically conductive clamp and coating machine for coating machine | |
| CN212865048U (en) | Electroplating clamp for solar cell | |
| CN213295553U (en) | Transfer device, matching structure and electroplating system | |
| US11296379B2 (en) | Cell packaging techniques | |
| CN113463171B (en) | A electrically conductive clamp and coating machine for coating machine | |
| CN217903392U (en) | Battery with positive electrode suitable for large-current discharge and top cover assembly thereof | |
| CN109193288B (en) | Conduction system between moving parts | |
| CN111850664A (en) | Electroplating clamp for solar cell | |
| CN218123576U (en) | Cylindrical battery spring sheet type cover plate and mounting structure thereof | |
| CN112670628B (en) | Simple structure's quick mounting structure of lithium ion battery pole piece | |
| KR101297093B1 (en) | Wiring substrate and super capacitor of surface mount type using the same | |
| CN213692276U (en) | Bridge type connection structure of battery | |
| CN215008484U (en) | Improved connecting sheet for power battery pack | |
| CN211227395U (en) | Electrophoresis conductive device and automobile part electrophoresis coating system thereof | |
| CN220012866U (en) | Cathode clamp for flat workpiece | |
| CN217026122U (en) | Lower conductive clamp with sealing performance | |
| CN218448338U (en) | Battery converter | |
| CN217922400U (en) | A electrically conductive clamp and coating machine for coating machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 361100 201-1, complex building 5, No. 11, Butang Middle Road, torch high tech Zone (Tongxiang) industrial base, Xiamen, Fujian Province Applicant after: Xiamen Haichen Energy Storage Technology Co.,Ltd. Address before: 361100 201-1, complex building 5, No. 11, Butang Middle Road, torch high tech Zone (Tongxiang) industrial base, Xiamen, Fujian Province Applicant before: Xiamen Haichen New Energy Technology Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211029 |
|
| RJ01 | Rejection of invention patent application after publication |