CN110396711B - Clamping steel band is electroplated to semiconductor - Google Patents
Clamping steel band is electroplated to semiconductor Download PDFInfo
- Publication number
- CN110396711B CN110396711B CN201910684133.8A CN201910684133A CN110396711B CN 110396711 B CN110396711 B CN 110396711B CN 201910684133 A CN201910684133 A CN 201910684133A CN 110396711 B CN110396711 B CN 110396711B
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- clamping
- insulating support
- semiconductor
- steel strip
- conductive
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a semiconductor electroplating clamping steel belt which comprises a steel belt body, wherein an insulating support and a fixing clamp which are matched with each other are arranged on the steel belt body, a clamping part for clamping a semiconductor is arranged between the insulating support and the fixing clamp in a matching manner, a conductive strip is also connected to the steel belt body, and the conductive strip penetrates through the insulating support to realize circuit conduction with the semiconductor at the clamping part; according to the invention, the semiconductor element to be electroplated and the steel strip body are directly conducted through the conductive bars, and compared with the prior art, the circuit connection mode is simpler, so that the stability of the circuit is improved, and the stable power supply in the electroplating process is ensured; meanwhile, the support in an insulating design can effectively reduce the consumption of electric quantity and electroplating liquid medicine, and the production cost of products is greatly reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor electroplating equipment, in particular to a clamping steel belt for semiconductor electroplating.
Background
In the prior art, the production and packaging process of semiconductors includes the following steps: scribing, rotating, bonding, plastic packaging, deburring, electroplating, printing, cutting ribs and the like, wherein in the electroplating process, a product needs to be clamped on a special steel belt, then is immersed in electroplating liquid medicine, and is subjected to electroplating and tin plating after the steel belt is conductive; however, in the prior art, the clamping steel belt body is in current conduction with a product through the clamping device, the clamping part is in linear contact with the steel belt body, the contact area is small, the clamping device is easy to loosen after the clamping steel belt is used for a long time, and further poor conduction is caused, even the clamping device is completely non-conductive, and the electroplating quality of the product is influenced; if all parts are replaced by conductive materials, the conductivity of the clamping steel strip can be guaranteed, but in the electroplating process, metal parts partially immersed in liquid medicine can be electroplated simultaneously, the power consumption can be increased, a large amount of liquid medicine can be wasted, the electroplating cost is increased, and the popularization and the application are not facilitated.
Disclosure of Invention
Aiming at the defects of poor conduction and serious waste of liquid medicine in the prior art, the invention discloses a clamping steel belt for semiconductor electroplating, which can ensure that the current is kept in a stable state in the electroplating process, thereby avoiding and improving the electroplating quality.
The invention realizes the aim through the following technical scheme:
the utility model provides a centre gripping steel band is electroplated to semiconductor, includes the steel band body, it is provided with mutually supporting insulating support and fixation clamp to electroplate on the body, form the clamping part that is used for centre gripping semiconductor between insulating support and the fixation clamp, its characterized in that: the conductive strip is characterized by further comprising a conductive strip, one end of the conductive strip is fixedly connected with the steel strip body, the other end of the conductive strip penetrates through the insulating support, and the conductive strip is in contact with the semiconductor at the clamping part to realize circuit conduction.
The one end of insulating support is provided with the mounting groove with steel band body looks adaptation, and the other end is provided with the clamping face as the clamping part, communicate each other through the spread groove between clamping face and the mounting groove, the busbar passes the spread groove and stretches into on the clamping face.
The fixing clamp comprises a clamp seat, a connecting shaft is arranged on the clamp seat, a clamping plate is rotatably arranged on the connecting shaft, and two sides of the clamping plate are connected with the clamp seat through torsion springs; the insulating support is U-shaped, and its back is provided with the clamping part, the splint front end is provided with the portion of bending that is used for fixed semiconductor, the portion of bending passes the insulating support and stretches into the back of insulating support to just right with the clamping part at the insulating support back.
The fixing clamp is a torsion spring, the middle of the torsion spring is provided with a bending part connected with the steel belt body, the two ends of the torsion spring are provided with bending parts used for fixing a semiconductor, the insulating support is provided with clamping holes matched with the insulating support, and the bending part penetrates through the clamping holes to stretch into the back face of the insulating support and is right opposite to the clamping part at the back face of the insulating support.
The connecting groove and the conductive strip are in interference fit, and the mounting groove and the steel strip body are in interference fit.
The insulating support is connected with 2-4 conducting bars.
The length of the conducting strip in the clamping part is 2-3 cm.
The conducting bar and the steel strip body are of an integrally formed structure.
The insulating support is made of corrosion-resistant insulating materials, and the fixing clamp is made of corrosion-resistant insulating materials or corrosion-resistant conducting materials.
Compared with the prior art, the invention has the following beneficial effects:
1. the electroplating device comprises a steel strip body, wherein an insulating support and a fixing clamp which are matched with each other are arranged on the steel strip body, a semiconductor to be electroplated is clamped and fixed through a clamping part which is matched with each other between the insulating support and the fixing clamp, a conductive strip is also arranged at the same time, one end of the conductive strip is connected with the steel strip body, the other end of the conductive strip penetrates through the insulating support to extend into the clamping part, and the conductive strip is electrically communicated with the semiconductor to be electroplated in the clamping part; the steel strip body is directly communicated with the semiconductor through the conductive strips in the using process, one end of each conductive strip is fixedly connected with the steel strip body, so that the connection is stable and reliable, the other end of each conductive strip is in surface contact with the semiconductor, the contact area of the conductive strip is enlarged, and the stability of the conduction is ensured, so that compared with the prior art, the stability of the current of the semiconductor in the electroplating process can be ensured; meanwhile, the bracket is made of insulating materials, so that the surface of the bracket can not be electroplated even if the bracket is immersed in electroplating liquid medicine, the energy consumption and the liquid medicine consumption in the electroplating process are reduced, and the production cost is reduced.
2. One end of an insulating support is provided with a mounting groove matched with a steel belt body, the other end of the insulating support is provided with a clamping surface, the clamping surface is connected with the mounting groove through a connecting hole, and a conducting bar is mounted in the connecting hole; the conducting bar part is wrapped up by the connecting hole, and the liquid medicine is isolated outside the connecting hole by the surface tension of the liquid medicine, so that the conducting bar is prevented from contacting with the liquid medicine, the consumption of the liquid medicine and the electric energy can be further reduced on the one hand, and the conducting bar can be protected on the other hand, thereby ensuring the working stability of the liquid medicine.
3. According to the invention, the connecting groove and the conductive bar are in interference fit, and the mounting groove and the steel strip body are in interference fit, so that the gaps among the conductive bar, the steel strip body and the conductive bar are reduced, the liquid medicine is isolated from the mounting groove and the connecting hole by the surface tension of the liquid medicine, and the sealing effect is improved; on the other hand, the connection stability between the insulating support and the steel strip body and between the insulating support and the conductive strips can be ensured, so that the working stability of the equipment is improved.
4. Each insulating support is connected with 2-4 conductive bars, the stability of power supply to a semiconductor is further improved by adding the conductive bars, and the electroplating quality of equipment is improved; meanwhile, the connection stability of the insulating support can be further improved by the aid of the plurality of conductive strips.
5. The length of the bus bar in the clamping part is 2-3cm, and the contact area between the bus bar and the steel strip body can be further increased by increasing the length of the bus bar, so that the stability of the current conduction weak node of the bus bar is improved, and the stability and reliability of the continuous work of the whole bus bar are improved.
6. The bus bar and the steel strip body are of an integrally formed structure, so that the connection strength between the bus bar and the steel strip body can be improved, the reliability of equipment is improved, the stability of an electrifying circuit between the bus bar and the steel strip body can be further improved, the stability of electrifying a semiconductor is ensured, and the electroplating quality is improved.
7. The insulating support is made of corrosion-resistant insulating materials, and the fixing clamp is made of corrosion-resistant insulating materials or corrosion-resistant conductive materials, so that on one hand, the corrosion damage of electroplating liquid medicine to equipment is avoided, the service life of the equipment is prolonged, and meanwhile, the reliability and stability of the equipment are improved; on the other hand insulating material can completely cut off the electric current, avoids the support of entering into the liquid medicine to be electroplated, reduces the quantity of electric energy and liquid medicine, and the fixation clamp only has the foremost part that is located semiconductor top surface below just can submerge in liquid medicine when using simultaneously, consequently even the fixation clamp uses its electric energy and the liquid medicine of consuming of conductor also less, and can also improve the electric conductivity of this device, consequently the fixation clamp adopts insulating material or conducting material all can.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic view showing the overall structure of a steel strip in example 1;
FIG. 2 is an enlarged view of a portion of the structure at A in FIG. 1;
FIG. 3 is a schematic structural view of the front surface of the steel strip in example 1;
FIG. 4 is a schematic view showing the structure of the back surface of the steel strip in example 1;
FIG. 5 is a schematic top view of the steel strip of example 1;
FIG. 6 is a schematic side view of the steel strip of example 1;
FIG. 7 is a schematic view showing a structure in which a steel strip is combined with a semiconductor in example 1;
FIG. 8 is an enlarged view of a portion of the structure at C in FIG. 7;
FIG. 9 is a schematic view of another perspective of the mating of the steel strip with the semiconductor of example 1;
FIG. 10 is a schematic view showing the entire structure of the steel strip of example 2;
FIG. 11 is an enlarged view of a portion of the structure at B in FIG. 7;
FIG. 12 is a schematic structural view of the front surface of the steel strip in example 2;
FIG. 13 is a schematic view showing the structure of the back surface of the steel strip in example 2;
FIG. 14 is a schematic top view of the steel strip of example 2;
FIG. 15 is a schematic side view of the steel strip of example 2;
FIG. 16 is a schematic view showing a structure in which a steel strip is combined with a semiconductor in example 2;
FIG. 17 is an enlarged view of a portion of the structure shown in FIG. 16 at D;
fig. 18 is a schematic view of another perspective of the mating of the steel strip with the semiconductor of example 1.
Reference numerals: 1. the steel strip body, 2, insulating support, 3, fixation clamp, 4, conducting strip, 5, mounting groove, 6, clamping face, 22, centre gripping hole, 31, holder, 32, connecting axle, 33, splint, 34, torsional spring, 35, grip block, 36, connecting rod, 37, supporting rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In addition, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "top", "bottom", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, which are merely for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 9, this embodiment is a basic example of the present invention, and discloses a semiconductor electroplating clamping steel strip, which has a specific structure as shown in fig. 1, 2 and 5, and includes a steel strip body 1, an insulating support 2 and a fixing clip 3, where the insulating support 2 is made of an insulating material resistant to corrosion of electroplating solution, such as engineering plastic; the steel belt body 1 is provided with a mounting hole, and the bottom of the fixing clamp 3 is inserted into the mounting hole, so that the clamp seat 31 is fixed on the steel belt body 1; a connecting shaft 32 is fixedly arranged on the clamping seat 31, the middle part of the connecting shaft 32 is rotatably connected with a clamping plate 33 through a revolute pair, and two side surfaces of the clamping plate 33 are respectively connected with the inner side surfaces of the corresponding clamping seats 31 through torsion springs 34;
the insulating support 2 is U-shaped, the top ends of the transverse supporting rods of the insulating support 2 are provided with mounting grooves 5 matched with the steel strip body, connecting holes are formed in the two vertical supporting rods of the insulating support 2, one end of each connecting hole is communicated with the bottom of each mounting groove 5, and the other end of each connecting hole is of an open structure or a U-shaped groove; if an opening structure is adopted, the plane at the connection part with the outlet of the connecting hole is a clamping surface; the lower end of the steel strip body 1 is connected with a conductive strip 4 in an integrally formed or welded mode, the conductive strip 4 is in a strip shape, the cross section of the conductive strip can be in a square shape, a semicircular shape and the like, and meanwhile, the conductive strip can be made of conductive metal such as iron, steel or copper and the like according to actual needs; the other end of the conductive strip 4 passes through the connecting hole and is attached to the clamping surface 6, and the length of the conductive strip on the clamping surface 6 is 2 cm; the clamping block 35 is fixedly arranged at the front end of the clamping plate 33, the insulating support 2 is of a U-shaped structure, the clamping block 35 penetrates through a gap in the middle of the insulating support 2 and extends into the back of the insulating support 2, and the clamping block 35 is opposite to the clamping surface 6, so that a clamping part for clamping a semiconductor is formed; meanwhile, the fixing clamp can be made of corrosion-resistant materials such as engineering plastics and the like as required, and can also be made of metal conductive materials such as steel, copper and the like.
As shown in fig. 10 to 18, the present embodiment discloses a semiconductor electroplating clamping steel strip as a preferred embodiment of the present invention, and the specific structure thereof includes a steel strip body 1, an insulating support 2 and a fixing clip 3, wherein the fixing clip 3 is formed by modifying a torsion spring, a connecting rod 36 is arranged in the middle of the fixing clip 3, a mounting hole is arranged on the steel strip body 1, and the connecting rod 36 is inserted into the mounting hole to fix the fixing clip; meanwhile, one end of the insulating support 2 is provided with an installation groove 5 matched with the steel strip body 1, and the end opposite to the installation groove 5 is provided with a clamping surface 6; the insulating support 2 is also provided with 2-4 connecting holes according to requirements, one end of each connecting hole is communicated with the bottom surface of the mounting groove 5, and the outlet of the other end of each connecting hole is a clamping surface 6; still be provided with centre gripping hole 22 on the insulating support 2, the both ends of fixation clamp 3 are provided with the supporting rod 37 with the adaptation of centre gripping hole 22, and supporting rod 37 passes the centre gripping hole 22 and inserts the insulating support 2 back to just to the clamping face 6 that is located the insulating support 2 back, supporting rod 37 and clamping face 6 constitute the clamping part that is used for centre gripping semiconductor jointly.
When the semiconductor electroplating device is used, the semiconductor to be electroplated is clamped and fixed on the clamping part, as can be seen from fig. 7, two sides of the semiconductor are respectively contacted with the conductive strips and the fixed block, the semiconductor is fixed through the torsion of the torsion spring, and the torsion spring can be used for conducting or non-conducting according to the practical application environment; one end of each conductive strip is fixedly connected with the steel strip body, so that the connection is stable and reliable, the conduction is stable, the other end of each conductive strip is in contact with the surface of the semiconductor, the contact area of the conductive strips is larger, and meanwhile, the contact area can be further enlarged by arranging a plurality of conductive strips, so that the conduction between the conductive strips and the semiconductor is good, and compared with the prior art, the problem of poor conduction is fundamentally solved, and the electroplating quality of the semiconductor is greatly improved; meanwhile, the bracket is made of insulating materials, so that the bracket immersed in the electroplating liquid medicine can not be electrified, electroplating can not be carried out, a large amount of waste of the liquid medicine is avoided, and the power consumption is reduced; the part of the splint immersed in the liquid medicine is very small, so that the liquid medicine and the electric power which are wasted when the splint is made of a conductive material are very small, and the conductivity can be further improved; the adoption of the insulating material can further reduce the dosage of the liquid medicine and the electric power; the invention can greatly reduce the consumption of liquid medicine and electric energy and reduce the production cost while ensuring the stable conduction of the semiconductor in the electroplating process.
Claims (6)
1. The utility model provides a centre gripping steel band is electroplated to semiconductor, includes steel band body (1), be provided with mutually supporting insulating support (2) and fixation clamp (3) on steel band body (1), be provided with the clamping part that is used for the centre gripping semiconductor of mutually supporting between insulating support (2) and fixation clamp (3), its characterized in that: the conductive strip is characterized by further comprising a conductive strip (4), wherein one end of the conductive strip (4) is fixedly connected with the lower edge of the steel strip body (1), and the other end of the conductive strip penetrates through the insulating support (2) and is in contact with the semiconductor at the clamping part to realize circuit conduction;
one end of the insulating support (2) is provided with an installation groove (5) matched with the steel strip body (1); the clamping part comprises a clamping surface (6), the clamping surface is positioned at the other end of the insulating support, the clamping surface (6) is communicated with the mounting groove (5) through a connecting hole, and the conducting strip (4) penetrates through the connecting hole and extends into the clamping surface (6);
the fixing clamp (3) comprises a clamp seat (31) connected with the steel belt body (1), a connecting shaft (32) is arranged on the clamp seat (31), a clamping plate (33) is rotatably arranged on the connecting shaft (32), and two sides of the clamping plate (33) are connected with the clamp seat (31) through torsion springs (34); the insulating support (2) is U-shaped, a clamping surface (6) is arranged on the back surface of the insulating support (2), a clamping block (35) for fixing a semiconductor is arranged at the front end of the clamping plate (33), and the clamping block (35) penetrates through the insulating support (2) to extend into the back surface of the insulating support (2) and is matched with the clamping surface (6) on the back surface of the insulating support (2) to form a clamping part;
the fixing clamp (3) is a torsion spring, the middle of the fixing clamp (3) is provided with a connecting rod (36) connected with the steel belt body (1), the two ends of the connecting rod are provided with clamping rods (37) used for fixing semiconductors, the insulating support (2) is provided with clamping holes (22) matched with the insulating support, the clamping rods (37) penetrate through the clamping holes (22) and stretch into the back of the insulating support (2), and clamping portions are formed by matching with clamping faces (6) on the back of the insulating support (2).
2. A semiconductor electroplating clamping steel strip according to claim 1, characterized in that: the connecting holes and the conductive strips (4) are in interference fit, and the mounting grooves (5) and the steel strip body (1) are in interference fit.
3. A semiconductor electroplating clamping steel strip according to claim 1, characterized in that: the insulating support (2) is connected with 2-4 conducting bars (4).
4. A semiconductor electroplating clamping steel strip according to claim 1, characterized in that: the conducting strips (4) are located in the clamping part and have the length of 2-3 cm.
5. A semiconductor electroplating clamping steel strip according to claim 1, characterized in that: the conductive strips (4) and the steel strip body (1) are of an integrally formed structure.
6. A semiconductor electroplating clamping steel strip according to claim 1, characterized in that: the insulating support (2) is made of corrosion-resistant insulating materials, and the fixing clamp (3) is made of corrosion-resistant insulating materials or corrosion-resistant conductive materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910684133.8A CN110396711B (en) | 2019-07-26 | 2019-07-26 | Clamping steel band is electroplated to semiconductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910684133.8A CN110396711B (en) | 2019-07-26 | 2019-07-26 | Clamping steel band is electroplated to semiconductor |
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| Publication Number | Publication Date |
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| CN110396711A CN110396711A (en) | 2019-11-01 |
| CN110396711B true CN110396711B (en) | 2021-01-05 |
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| CN201910684133.8A Active CN110396711B (en) | 2019-07-26 | 2019-07-26 | Clamping steel band is electroplated to semiconductor |
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| CN204644494U (en) * | 2015-04-27 | 2015-09-16 | 栾善东 | Biserial exempts from the zinc-plated fully automatic high-speed line of strip semiconductor lead frame |
| CN106555220B (en) * | 2016-11-11 | 2018-05-18 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of semiconductor crystal wafer electroplating clamp and clamp method |
| CN108950655B (en) * | 2018-08-13 | 2019-07-23 | 四川奥临科技有限公司 | A kind of environmental protection and energy saving steel band and its electroplating technology applied to semiconductor packages |
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