CN110396711A - A kind of semiconductor plating clamping steel band - Google Patents
A kind of semiconductor plating clamping steel band Download PDFInfo
- Publication number
- CN110396711A CN110396711A CN201910684133.8A CN201910684133A CN110396711A CN 110396711 A CN110396711 A CN 110396711A CN 201910684133 A CN201910684133 A CN 201910684133A CN 110396711 A CN110396711 A CN 110396711A
- Authority
- CN
- China
- Prior art keywords
- steel band
- clamping
- insulating support
- semiconductor
- conductive bar
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of semiconductors, and clamping steel band is electroplated, including steel band ontology, mutually matched insulating support and fixing clamp are provided on the steel band ontology, the clamping part for clamping semiconductor is equipped between the insulating support and fixing clamp, conductive bar is also connected on the steel band ontology, the conductive bar passes through insulating support and realizes that circuit is connected with semiconductor in clamping part；Semiconductor element to be electroplated is directly realized by circuit with steel band ontology by conductive bar and is connected by the present invention, and compared with the prior art, circuit connecting mode is simpler, to improve the stability of circuit, guarantees the stable power-supplying in electroplating process；The bracket of insulating Design can effectively reduce the consumption to electricity and electroplating liquid medicine simultaneously, substantially reduce the production cost of product.
Description
Technical field
The present invention relates to semiconductor technical field of plating equipment, and in particular to a kind of semiconductor plating clamping steel band.
Background technique
In the prior art, the production encapsulation process of semiconductor is the following steps are included: scribing, rotor, bonding, plastic packaging, go to fly
Side, plating, printing and rib cutting, need to be held on product on dedicated steel band in the plating process, then by product
It is immersed in electroplating liquid medicine, it is tin plating by be electroplated to product after steel band conduction；But clamping steel band sheet in the prior art
Body realizes current lead-through by clamping device and product, and between hold assembly and steel band ontology is mostly linear contact, contact
Area is smaller, and clamping device is easy to appear loosening to clamping steel band after prolonged use, in turn results in conductive bad or even complete
It is non-conductive, influence the electroplating quality of product；And if all changing all components into conductive material, although can guarantee to clamp
The electric conductivity of steel band, but in the plating process, the metal parts being partially immersed in liquid medicine can be also electroplated simultaneously, not only
It will increase power consumption, while can also waste a large amount of liquid medicine, to raise the cost of plating, be unfavorable for promoting and applying.
Summary of the invention
, liquid medicine bad for conduction existing in the prior art wastes serious defect, and the invention discloses one kind partly to lead
Body plating clamping steel band can guarantee that electric current keeps stable state in the plating process using clamping steel band of the present invention,
To avoid, electroplating quality is improved.
Above-mentioned purpose that the invention is realized by the following technical scheme:
A kind of semiconductor plating clamping steel band, including steel band ontology, be provided on the plated body it is mutually matched absolutely
Edge bracket and fixing clamp form the clamping part for clamping semiconductor between the insulating support and fixing clamp, it is characterised in that:
It further include conductive bar, one end of the conductive bar is fixedly connected with steel band ontology, and the other end passes through insulating support, and in clamping part
Realize that circuit is connected with semiconductor contact.
One end of the insulating support is provided with mounting groove compatible with steel band ontology, and the other end is provided with as clamping
The clamping face in portion is interconnected between the clamping face and mounting groove by link slot, and the conductive bar is protruded into across link slot
Onto clamping face.
The fixing clamp includes holder, and connecting shaft is provided on holder, and rotation is provided with clamping plate, the clamping plate in connecting shaft
Two sides pass through torsional spring and be connected with holder；The insulating support is U-shaped, and the back side is provided with clamping part, the clamping plate front end
It is provided with the bending part for fixing semiconductor, the bending part passes through the back side that insulating support extend into insulating support, and with
The clamping part face at the insulating support back side.
The fixing clamp is torsional spring, is provided with the bending part being connected with steel band ontology in the middle part of the torsional spring, the two of torsional spring
End is provided with the bending part for fixing semiconductor, is provided with the holding holes being adapted to it, the bending on the insulating support
Portion passes through holding holes and extend into the insulating support back side, and the clamping part face with the insulating support back side.
It is interference fit between the link slot and conductive bar, is interference fit between the mounting groove and steel band ontology.
Each insulating support is connected with 2-4 conductive bar.
It is 2-3cm that the conductive bar, which is located at the length in clamping part,.
The conductive bar and steel band ontology are an integral molding structure.
The insulating support is made of erosion resisting insulation material, and the fixing clamp uses erosion resisting insulation material or corrosion resistant
Lose conductive material production.
Compared with prior art, the invention has the following advantages:
1, the present invention includes steel band ontology, is provided with mutually matched insulating support and fixing clamp on the steel band ontology,
Semiconductor to be electroplated is gripped by clamping part mutually matched between insulating support and fixing clamp, is additionally provided with simultaneously
One end of conductive bar, the conductive bar is connected with steel band ontology, and the other end of conductive bar passes through insulating support and extend into clamping part
It is interior, and be electrically connected in clamping part with semiconductor holding to be electroplated；The present invention passes through conductive bar for steel band sheet in use
Body is directly connected to semiconductor, and since one end of conductive bar is fixedly connected with steel band ontology, stable connection is reliable, and leads
The other end and semiconductor of electric item are face contact, and contact area is extended, and guarantee conductive stability, thus of the invention and existing
There is technology to compare, can guarantee the stabilization of semiconductor electric current in the plating process；Bracket of the invention simultaneously uses insulating materials
Production, therefore will not be electroplated on its surface again bracket is immersed in electroplating liquid medicine, to reduce electroplating process
Energy consumption and liquid medicine dosage reduce production cost.
2, the present invention is provided with the mounting groove being adapted to steel band ontology in one end of insulating support, and the other end is provided with clamping
Face, and be connected between clamping face and mounting groove by connecting hole, and conductive bar is installed in connecting hole；Connecting hole is by conductive bar portion
Subpackage is wrapped up in, and liquid medicine is isolated from except connecting hole by the surface tension of liquid medicine itself, conductive bar is avoided to contact with liquid medicine, one
Aspect can further decrease the consumption of liquid medicine and electric energy, on the other hand can also protect conductive bar, to guarantee its work
Stability.
3, using interference fit between link slot and conductive bar of the invention, interference is used between mounting groove and steel band ontology
Cooperation reduces the gap between conductive bar and steel band ontology and conductive bar, guarantees liquid medicine through the surface tension of liquid medicine itself
It is isolated from except mounting groove and connecting hole, improves its sealing effect；On the other hand insulating support and steel band ontology be can also ensure that
Connective stability between conductive bar, to improve the job stability of equipment.
4, each insulating support of the invention is respectively connected with 2-4 conductive bar, by increase conductive bar further increase to
The stability of semiconductor power supply, improves the electroplating quality of equipment；Multiple conductive bars can also further increase insulating support simultaneously
Connective stability.
5, length of the conductive bar of the present invention in clamping part is 2-3cm, and the length by increasing conductive bar can be with
The contact area between conductive bar and steel band ontology is further increased, to improve the stabilization of conductive bar current lead-through weak node
Property, and then improve stability and reliability that entire conductive bar continues working.
6, conductive bar of the invention and steel band ontology are an integral molding structure, and are not only able to improve conductive bar and steel band ontology
Between bonding strength, improve the reliability of equipment, while can also further increase and be powered between conductive bar and steel band ontology
The stability of circuit, and then the stability for ensuring to be powered to semiconductor, improve electroplating quality.
7, insulating support of the invention is made of erosion resisting insulation material, and the fixing clamp uses erosion resisting insulation material
Or corrosion-resistant conductive material production, on the one hand avoid electroplating liquid medicine from extending the same of service life of equipment to the corrosion and damage of equipment
The reliability and stability of Shi Tigao equipment；Another aspect insulating materials can completely cut off electric current, avoid enter into the bracket in liquid medicine
It is plated, reduces the dosage of electric energy and liquid medicine, while fixing clamp only has front end to be located at below semiconductor top surface when in use
Part can be just immersed in liquid medicine, therefore less fixing clamp its electric energy and liquid medicine for consuming using conductor, and can also
The electric conductivity of the present apparatus is improved, therefore fixing clamp uses insulating materials or conductive material.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of embodiment of the present invention
Attached drawing be briefly described, it should be understood that the following drawings illustrates only certain embodiments of the invention, therefore should not be seen
Work is the restriction to range, for those of ordinary skill in the art, without creative efforts, can be with
Other relevant attached drawings are obtained according to these attached drawings.
Fig. 1 is the overall structure diagram of steel band in embodiment 1；
Fig. 2 is the partial structurtes enlarged diagram in Fig. 1 at A；
Fig. 3 is the positive structural schematic diagram of steel band in embodiment 1；
Fig. 4 is the structural schematic diagram at the steel band back side in embodiment 1；
Fig. 5 is the overlooking structure diagram of steel band in embodiment 1；
Fig. 6 is the side structure schematic view of steel band in embodiment 1；
Fig. 7 is the structural schematic diagram of steel band and semiconductor cooperation in embodiment 1；
Fig. 8 is partial structurtes enlarged diagram at C in Fig. 7；
Fig. 9 is the schematic diagram at another visual angle of steel band and semiconductor cooperation in embodiment 1；
Figure 10 is the overall structure diagram of steel band in embodiment 2；
Figure 11 is the partial structurtes enlarged diagram in Fig. 7 at B；
Figure 12 is the positive structural schematic diagram of steel band in embodiment 2；
Figure 13 is the structural schematic diagram at the steel band back side in embodiment 2；
Figure 14 is the overlooking structure diagram of steel band in embodiment 2；
Figure 15 is the side structure schematic view of steel band in embodiment 2；
Figure 16 is the structural schematic diagram of steel band and semiconductor cooperation in embodiment 2；
Figure 17 is partial structurtes enlarged diagram at D in Figure 16；
Figure 18 is the schematic diagram at another visual angle of steel band and semiconductor cooperation in embodiment 1.
Appended drawing reference: 1, steel band ontology, 2, insulating support, 3, fixing clamp, 4, conductive bar, 5, mounting groove, 6, clamping face,
22, holding holes, 31, holder, 32, connecting shaft, 33, clamping plate, 34, torsional spring, 35, grip block, 36, connecting rod, 37, supporting rod.
Specific embodiment
To keep the purposes, technical schemes and advantages of embodiment of the present invention clearer, implement below in conjunction with the present invention
The technical solution in embodiment of the present invention is clearly and completely described in attached drawing in mode, it is clear that described reality
The mode of applying is some embodiments of the invention, rather than whole embodiments.Usually it is described and illustrated herein in the accompanying drawings
The component of embodiment of the present invention can arrange and design with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below to protect
The scope of the present invention of shield, but it is merely representative of selected embodiment of the invention.Based on the embodiment in the present invention, ability
Domain those of ordinary skill every other embodiment obtained without creative efforts, belongs to the present invention
The range of protection.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can
To be combined with each other.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that term " center ", "top", "bottom", "vertical", "horizontal",
The orientation or positional relationship of the instructions such as "inner", "outside" be based on the orientation or positional relationship shown in the drawings or the invention produce
Product using when the orientation or positional relationship usually put or the orientation that usually understands of those skilled in the art or position close
System, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
Specific orientation is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " the
One ", " second " etc. is only used for distinguishing description, is not understood to indicate or imply relative importance.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary.
For the ordinary skill in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Embodiment 1
As shown in FIG. 1 to FIG. 9, present embodiment is as a basic embodiment of the invention, and it discloses a kind of semiconductors
Plating clamping steel band, specific structure is as shown in Figure 1, Figure 2 and shown in Fig. 5, including steel band ontology 1, insulating support 2 and fixing clamp 3, described
Insulating materials production of the insulating support 2 using the corrosion of resistance to electroplating liquid medicine, such as engineering plastics；Peace is provided on the steel band ontology 1
Hole is filled, the bottom of fixing clamp 3 is inserted into mounting hole, so that holder 31 is fixed on steel band ontology 1；It is solid on the holder 31
Surely it is provided with connecting shaft 32, the middle part of connecting shaft 32 is rotatably connected to clamping plate 33, two sides point of clamping plate 33 by revolute pair
It is connected not between corresponding 31 medial surface of holder by torsional spring 34；
The insulating support 2 is U-shaped, and the lateral strut top of insulating support 2 is provided with peace compatible with steel band ontology
Tankage 5 is provided with connecting hole in 2 liang of insulating support vertical struts, and one end of connecting hole is connected to the bottom of mounting groove 5, separately
One end is hatch frame or U-type groove；If being clamping face with the plane for connecting hole exits connecting place using hatch frame；Institute
It states 1 lower end of steel band ontology and is connected with conductive bar 4 by way of being integrally formed or welding, conductive bar 4 is strip, cross section
It can be the shapes such as rectangular, semicircle, while according to actual needs, conductive bar can be using conductive metals such as iron, steel or copper；It leads
The other end of electric item 4 passes through connecting hole and fits on clamping face 6, and it is 2cm that it, which is located at the length on clamping face 6,；The clamping plate
33 front end is fixedly installed grip block 35, and since insulating support 2 is U-shaped structure, grip block 35 passes through 2 middle part of insulating support
Gap extend into the back side of insulating support 2, and grip block 35 and 6 face of clamping face, to constitute the folder for clamping semiconductor
Hold portion；Simultaneously as needed fixing clamp can using the resistant materials production such as engineering plastics, can also using such as steel,
The production of the conductive metal materials such as copper.
Embodiment 2
As shown in Figure 10~Figure 18, for present embodiment as a preferred embodiment of the invention, it discloses one kind partly to lead
Body plating clamping steel band, specific structure includes steel band ontology 1, insulating support 2 and fixing clamp 3, and the fixing clamp 3 passes through torsional spring
It is transformed, the middle part of fixing clamp 3 is provided with connecting rod 36, mounting hole is provided on steel band ontology 1, the connecting rod 36 is inserted
Enter into mounting hole the fixation realized to fixing clamp；One end of insulating support 2 is provided with the installation being adapted to steel band ontology 1 simultaneously
Slot 5, one end opposite with mounting groove 5 are provided with clamping face 6；It is additionally provided with connecting hole on the insulating support 2, is connected as needed
Connecing hole can be set 2-4, and one end of connecting hole is connected to 5 bottom surface of mounting groove, and the exit of the other end is clamping face 6；It is described
Holding holes 22 are additionally provided on insulating support 2, the both ends of the fixing clamp 3 are provided with the supporting rod 36 being adapted to holding holes 22,
And supporting rod 36 passes through holding holes 22 and is inserted into 2 back side of insulating support, and face is located at the clamping face 6 at 2 back side of insulating support, institute
It states supporting rod 37 and clamping face 6 collectively forms clamping part for clamping semiconductor.
The present invention using when by the way that semiconductor to be electroplated is clamped and fastened on clamping part, as shown in Figure 7, the two of semiconductor
Side is contacted with conductive bar and fixed block respectively, is fixed semiconductor by the torsion of torsional spring, according to actual application environment, torsional spring
It can be used for conduction or non-conductive, in the present embodiment, torsional spring is made of conductive material；One end and steel band ontology due to conductive bar
Between be fixedly connected, stable connection is reliable, therefore conductive stable, and the other end is then contacted with semiconductor surface, contact area
It is larger, while can also be by the way that multiple conductive bar further expansion contacts area are arranged, therefore led between conductive bar and semiconductor
It is electric good, compared with prior art, fundamentally solves the problems, such as that conduction is bad, substantially increase the plating matter of semiconductor
Amount；Simultaneously because bracket is made of insulating materials, therefore it is immersed in the bracket in electroplating liquid medicine and will not be powered, therefore will not sends out
Raw plating, so as to avoid a large amount of wastes of liquid medicine, and electricity consumption can also be reduced；And clamping plate is immersed in the part in liquid medicine very
It is small, thus when it uses conductive material to make its waste liquid medicine and electric power very little, while electric conductivity can also be further increased；
And the dosage of liquid medicine and electric power can be then further decreased using insulating materials；The present invention is guaranteeing semiconductor in the plating process
The consumption of liquid medicine and electric energy can be substantially reduced while conductive stable, reduce production cost.
Claims (9)
1. a kind of semiconductor plating clamps steel band, including steel band ontology (1), mutual cooperation is provided on the steel band ontology (1)
Insulating support (2) and fixing clamp (3), be provided between insulating support (2) and fixing clamp (3) mutually matched for clamping half
The clamping part of conductor, it is characterised in that: further include conductive bar (4), one end and steel band ontology (1) of the conductive bar (4) are fixed
Connection, the other end pass through insulating support (2), and realize that circuit is connected with semiconductor contact in clamping part.
2. a kind of semiconductor plating clamping steel band according to claim 1, it is characterised in that: the insulating support (2)
One end is provided with the compatible mounting groove (5) with steel band ontology (1)；The clamping part includes clamping face (6), and clamping face is located at exhausted
The other end of edge bracket is interconnected between the clamping face (6) and mounting groove (5) by connecting hole, and the conductive bar (4) is worn
Connecting hole is crossed to extend on clamping face (6).
3. a kind of semiconductor plating clamping steel band according to claim 1, it is characterised in that: the fixing clamp (3) includes
The holder (31) being connected with steel band ontology (1) is provided with connecting shaft (32) on holder (31), rotates and be provided in connecting shaft (32)
Clamping plate (33), the two sides of the clamping plate (33) pass through torsional spring (34) and are connected with holder (31)；The insulating support (2) is U-shaped,
Insulating support (2) back side is provided with clamping face (6), and clamping plate (33) front end is provided with the grip block for fixing semiconductor
(35), the grip block (35) passes through insulating support (2) and extend into the back side of insulating support (2), and with insulating support (2) back side
Clamping face (6) cooperatively form clamping part.
4. a kind of semiconductor plating clamping steel band according to claim 1, it is characterised in that: the fixing clamp (3) is to turn round
Spring, the connecting rod (36) being connected with steel band ontology (1) is provided in the middle part of the fixing clamp (3), and both ends are provided with for solid
Determine the supporting rod (37) of semiconductor, the holding holes (22) being adapted to it, the supporting rod are provided on the insulating support (2)
(37) holding holes (22) are passed through and extend into insulating support (2) back side, and cooperate shape with the clamping face (6) at insulating support (2) back side
At clamping part.
5. a kind of semiconductor plating clamping steel band according to claim 2, it is characterised in that: the connecting hole and conductive bar
(4) it is interference fit between, is interference fit between the mounting groove (5) and steel band ontology (1).
6. a kind of semiconductor plating clamping steel band according to claim 1, it is characterised in that: each insulating support
(2) 2-4 conductive bar (4) are connected with.
7. a kind of semiconductor plating clamping steel band according to claim 1, it is characterised in that: the conductive bar (4) is located at
Length in clamping part is 2-3cm.
8. a kind of semiconductor plating clamping steel band according to claim 1, it is characterised in that: the conductive bar (4) and steel
Band body (1) is an integral molding structure.
9. a kind of semiconductor plating clamping steel band according to claim 1, it is characterised in that: the insulating support (2) is adopted
It is made of erosion resisting insulation material, the fixing clamp (3) is made of erosion resisting insulation material or corrosion-resistant conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910684133.8A CN110396711B (en) | 2019-07-26 | 2019-07-26 | Clamping steel band is electroplated to semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910684133.8A CN110396711B (en) | 2019-07-26 | 2019-07-26 | Clamping steel band is electroplated to semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110396711A true CN110396711A (en) | 2019-11-01 |
| CN110396711B CN110396711B (en) | 2021-01-05 |
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ID=68326116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910684133.8A Active CN110396711B (en) | 2019-07-26 | 2019-07-26 | Clamping steel band is electroplated to semiconductor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021095591A (en) * | 2019-12-13 | 2021-06-24 | 株式会社荏原製作所 | Substrate holder |
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| CN204644494U (en) * | 2015-04-27 | 2015-09-16 | 栾善东 | Biserial exempts from the zinc-plated fully automatic high-speed line of strip semiconductor lead frame |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| CN108950655A (en) * | 2018-08-13 | 2018-12-07 | 四川奥临科技有限公司 | A kind of environmental protection and energy saving steel band and its electroplating technology applied to semiconductor packages |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204644494U (en) * | 2015-04-27 | 2015-09-16 | 栾善东 | Biserial exempts from the zinc-plated fully automatic high-speed line of strip semiconductor lead frame |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| CN108950655A (en) * | 2018-08-13 | 2018-12-07 | 四川奥临科技有限公司 | A kind of environmental protection and energy saving steel band and its electroplating technology applied to semiconductor packages |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2021095591A (en) * | 2019-12-13 | 2021-06-24 | 株式会社荏原製作所 | Substrate holder |
| JP7242516B2 (en) | 2019-12-13 | 2023-03-20 | 株式会社荏原製作所 | substrate holder |
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| CN110396711B (en) | 2021-01-05 |
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