CN218059275U - Electroplating transfer hanging tool for flexible high-order circuit board - Google Patents

Electroplating transfer hanging tool for flexible high-order circuit board Download PDF

Info

Publication number
CN218059275U
CN218059275U CN202220841243.8U CN202220841243U CN218059275U CN 218059275 U CN218059275 U CN 218059275U CN 202220841243 U CN202220841243 U CN 202220841243U CN 218059275 U CN218059275 U CN 218059275U
Authority
CN
China
Prior art keywords
conductive
electrically conductive
frame
circuit board
anchor clamps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220841243.8U
Other languages
Chinese (zh)
Inventor
曾亚运
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Xinyijia Electronic Equipment Co ltd
Original Assignee
Dongguan Xinyijia Electronic Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Xinyijia Electronic Equipment Co ltd filed Critical Dongguan Xinyijia Electronic Equipment Co ltd
Priority to CN202220841243.8U priority Critical patent/CN218059275U/en
Application granted granted Critical
Publication of CN218059275U publication Critical patent/CN218059275U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model discloses a flexible high-order circuit board is electroplated and is moved and carry hanger, it is including the crossbeam, the front end of crossbeam is equipped with the support frame, the lower extreme of support frame is fixed with electrically conductive frame, be equipped with a plurality of electrically conductive anchor clamps and a plurality of electrically conductive anchor clamps down on the electrically conductive frame, go up electrically conductive anchor clamps with electrically conductive anchor clamps one-to-one down, go up electrically conductive anchor clamps with electrically conductive anchor clamps are used for the upper and lower both ends of centre gripping flexible line board respectively down, the rear end of crossbeam is equipped with running gear and main electrically conductive mechanism, main electrically conductive mechanism the crossbeam the support frame with electrically conductive frame electric contact in proper order, go up electrically conductive anchor clamps with electrically conductive anchor clamps all with down electrically conductive frame electric contact. The utility model discloses enable high-order flexible line way board face homogeneity more unanimous when electroplating, and then improve the electroplating process quality.

Description

Electroplating transfer rack for flexible high-order circuit board
Technical Field
The utility model relates to a circuit board electroplating device especially relates to a flexible high-order circuit board is electroplated and is carried hanger that carries.
Background
In the prior art, with the rapid development of the field of semiconductors and chips, the requirements of electroplating processes of high-end PCB boards such as flexible boards, IC carrier boards and the like are more strict, and the requirements of electroplating effects are higher, wherein the requirements of electroplating hangers on high performance are shown.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to prior art's not enough, provides one kind and enables high-order flexible line way board face homogeneity more unanimous when electroplating, and then improves the flexible high-order line way board electroplating of electroplate processing quality and carry the hanger.
In order to solve the technical problem, the utility model adopts the following technical scheme.
The utility model provides a flexible high-order circuit board is electroplated and is moved and carry hanger, its including the crossbeam, the front end of crossbeam is equipped with the support frame, the lower extreme of support frame is fixed with electrically conductive frame, electrically conductive frame is last to be equipped with a plurality of electrically conductive anchor clamps and a plurality of electrically conductive anchor clamps down, electrically conductive anchor clamps go up with electrically conductive anchor clamps one-to-one down, electrically conductive anchor clamps go up with electrically conductive anchor clamps are used for the upper and lower both ends of centre gripping flexible line board respectively down, the rear end of crossbeam is equipped with running gear and main electrically conductive mechanism, main electrically conductive mechanism the crossbeam the support frame with electrically conductive frame electric contact in proper order, go up electrically conductive anchor clamps with electrically conductive frame electric contact down all with.
Preferably, the upper conductive clamp and the lower conductive clamp are both arranged on the front side of the conductive frame.
Preferably, a tension device is connected between the upper conductive clamp and the upper end of the conductive frame.
Preferably, an auxiliary conductive mechanism is arranged on the beam, and the upper conductive clamp and the lower conductive clamp are connected to the auxiliary conductive mechanism through wires.
Preferably, the conductive frame is coated with a teflon coating.
Preferably, the support frame is an inverted U-shaped support frame, and the upper end of the support frame is fixed to the front end of the cross beam through a bolt.
Preferably, the rear end of the cross beam is fixed with a H-shaped frame, and the main conducting mechanism and the traveling mechanism are respectively arranged at the upper end and the lower end of the H-shaped frame.
Preferably, two vertical guide posts are fixed at the lower end of the conductive frame, and the two vertical guide posts are respectively close to the left end and the right end of the conductive frame.
Preferably, the rear end of worker's shape frame is fixed with the catching groove of "U" shape, be equipped with a plurality of can the upset prevent the fin that moves back in the catching groove, prevent that the fin slope that moves back sets up, just prevent that the fin that moves back with electroplating moves and carries the contained angle between the hanger direction of motion for the acute angle.
Preferably, the upper end of the anti-reverse fin is in running fit with the side wall of the catching groove, and the lower end of the anti-reverse fin extends out of the lower part of the catching groove.
The utility model discloses an among flexible high-order circuit board electroplating transfer hanger be equipped with a plurality of electrically conductive anchor clamps and a plurality of electrically conductive anchor clamps down on the electrically conductive frame simultaneously, and make go up electrically conductive anchor clamps with electrically conductive anchor clamps longitudinal symmetry distributes down, when the flexible line way board centre gripping in go up electrically conductive anchor clamps with when electrically conductive between the anchor clamps down, because of go up electrically conductive anchor clamps with electrically conductive anchor clamps all have conductivity down, so flexible line way board surface charge distribution is more even for the high-order flexible line way board face homogeneity is more unanimous when electroplating, and then has improved the electroplate processing quality.
Drawings
FIG. 1 is a perspective view of a flexible high-order circuit board electroplating transfer hanger;
FIG. 2 is a front view of a flexible high-order circuit board electroplating transfer hanger;
FIG. 3 is a side view of a flexible high-order circuit board electroplating transfer hanger;
FIG. 4 is a structural view of the supporting frame;
FIG. 5 is a view showing the construction of a support frame and an upper conductive jig;
FIG. 6 is a perspective view of a lower conductive clip;
FIG. 7 is a cross-sectional view of a lower conductive clip;
FIG. 8 is a perspective view of an auxiliary conductive mechanism;
FIG. 9 is a side view of the auxiliary conductive mechanism;
FIG. 10 is a block diagram of the catching grooves and the anti-backup fins.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings and examples.
Example one
This embodiment has proposed a flexible high order circuit board is electroplated and is moved and carry hanger, combine fig. 1 to fig. 10 to show, it is including crossbeam 1, the front end of crossbeam 1 is equipped with support frame 2, the lower extreme of support frame 2 is fixed with electrically conductive frame 3, be equipped with a plurality of electrically conductive anchor clamps 4 and a plurality of electrically conductive anchor clamps 6 down on the electrically conductive frame 3, go up electrically conductive anchor clamps 4 with electrically conductive anchor clamps 6 one-to-one down, go up electrically conductive anchor clamps 4 with electrically conductive anchor clamps 6 down are used for the upper and lower both ends of centre gripping flexible line board 100 respectively, the rear end of crossbeam 1 is equipped with running gear 7 and main electrically conductive mechanism 8, main electrically conductive mechanism 8 the crossbeam 1 support frame 2 with electrically conductive frame 3 electrical contact in proper order, go up electrically conductive anchor clamps 4 with electrically conductive anchor clamps 6 down all with electrically conductive frame 3 electrical contact.
In the structure, the conductive frame 3 is simultaneously provided with the plurality of upper conductive clamps 4 and the plurality of lower conductive clamps 6, the upper conductive clamps 4 and the lower conductive clamps 6 are distributed in an up-and-down symmetrical manner, and when the flexible circuit board 100 is clamped between the upper conductive clamps 4 and the lower conductive clamps 6, the upper conductive clamps 4 and the lower conductive clamps 6 are all conductive, so that the surface charge distribution of the flexible circuit board 100 is more uniform, the surface uniformity of the high-order flexible circuit board during electroplating is more uniform, and the electroplating processing quality is improved.
In this embodiment, the upper conductive clamp 4 and the lower conductive clamp 6 are both disposed on the front side of the conductive frame 3.
In order to ensure the tension of the circuit board during the electroplating process, a tension device 5 is connected between the upper conductive clamp 4 and the upper end of the conductive frame 3 in the embodiment.
As a preferable mode, an auxiliary conductive mechanism 9 is arranged on the beam 1, and the upper conductive clamp 4 and the lower conductive clamp 6 are both connected to the auxiliary conductive mechanism 9 through a wire 10. Under the matching action of the main conductive mechanism 8 and the auxiliary conductive mechanism 9, the conductive reliability can be ensured.
Because the conductive frame 3 has conductivity, in order to avoid adverse effect to the conductive frame 3 in the electroplating process link, in this embodiment, a teflon coating is sprayed on the conductive frame 3.
In order to better realize the supporting function, in this embodiment, the supporting frame 2 is an inverted U-shaped supporting frame, and the upper end of the supporting frame 2 is fixed to the front end of the cross beam 1 through a bolt.
In this embodiment, an i-shaped frame 11 is fixed at the rear end of the cross beam 1, and the main conductive mechanism 8 and the traveling mechanism 7 are respectively arranged at the upper end and the lower end of the i-shaped frame 11. The I-shaped frame 11 can reliably support and fix the rear end of the cross beam 1 and is matched with the travelling mechanism 7 to stably travel on a preset track.
As a preferred structure, two vertical guide posts 30 are fixed at the lower end of the conductive frame 3, and the two vertical guide posts 30 are respectively close to the left and right ends of the conductive frame 3.
In this embodiment, referring to fig. 10, an inverted "U" shaped fastening groove 12 is fixed at the rear end of the i-shaped frame 11, a plurality of anti-falling fins 120 capable of being turned over are arranged in the fastening groove 12, the anti-falling fins 120 are arranged obliquely, and an included angle between the anti-falling fins 120 and the moving direction of the electroplating transfer rack is an acute angle. Further, the upper end of the anti-reverse fin 120 is rotationally matched with the side wall of the catching groove 12, and the lower end of the anti-reverse fin 120 extends to the lower part of the catching groove 12. The anti-reverse fins 120 are arranged obliquely and used for matching with preset reverse teeth on the electroplating line, and when the electroplating transfer hanger moves forwards, the anti-reverse fins are clamped at corresponding positions, so that the electroplating transfer hanger is prevented from moving backwards and forwards.
The utility model discloses a flexible high order circuit board is electroplated and is carried hanger that carries, in practical application, main electrically conductive mechanism 8 is main electrically conductive mode, supplementary electrically conductive mechanism 9 further strengthens electrically conductive, makes its conduction better, goes up electrically conductive anchor clamps and mainly connects electrically conductively with supplementary electrically conductive through supplementary electrically conductive connecting wire, and electrically conductive clamp is mainly through electrically conductive frame teflon spraying and U type support flat and tin bronze electrically conductive copper electrically conductive down. The hanging tool is in seamless butt joint with an automatic upper circuit board and a lower circuit board or a manipulator upper circuit board and a manipulator lower circuit board, and the automatic tensioning of the 0.036 MM-1.0 MM circuit board can be realized through the circuit board tensioning device, so that the surface electroplating uniformity of the circuit board is higher in the electroplating process.
Example two
In the prior art, an electroplating transfer hanger generally utilizes an upper clamp and a lower clamp to clamp a circuit board, then the circuit board is placed in electroplating liquid medicine for electroplating, in the process, the lower clamp needs to be immersed below the electroplating liquid medicine, in order to improve the electroplating uniformity, the lower clamp needs to be conductive at the same time, and the positions of the lower clamp except for a clamping point for clamping the circuit board can be coated with copper in the electroplating process, so that anode metal loss in the electroplating liquid medicine is caused, and meanwhile, the electroplating quality is influenced.
To this, the utility model provides a have sealing performance, can avoid the electroplating in-process by last copper, avoid extravagant electroplating liquid medicine in the lower conductive clamp of positive pole metal simultaneously, combine figure 2, figure 6 and figure 7 to show, lower conductive clamp 6 is installed in 3 lower extremes of predetermined conductive frame, lower conductive clamp 6 is including fixed clamping jaw 60, movable clamping jaw 61 and be used for ordering about movable clamping jaw 61 with fixed clamping jaw 60 presss from both sides the spring 62 of tight flexible line board 100, fixed clamping jaw 60's surface covering has encapsulating layer 600, conductive frame 3's lower extreme is equipped with underframe 31, underframe 31's surface covering has sealing coating 310, fixed clamping jaw 60 with underframe 31 range upon range of setting, just encapsulating layer 600 with sealing coating 310 seals the laminating, wear to be equipped with conductive screw 63 on the fixed clamping jaw 60, conductive screw 63's tip spiro union underframe 31, conductive screw 63's nut is gone up the cover and is equipped with seal cover 64, seal cover 64 with the sealed cooperation of the junction of encapsulating layer 600.
In the structure, the surface of the fixed clamping jaw 60 is covered with the encapsulating layer 600, the surface of the bottom frame 31 is covered with the sealing coating 310, and the nut of the conductive screw 63 is sleeved with the sealing sleeve 64, so that the lower conductive clamp 6 is completely covered and separated by the insulating layer except for the clamping point for clamping the circuit board, the copper-coating condition caused by the exposed clamp is avoided, the sealing performance of the clamp is further improved, the waste of anode metal in electroplating liquid medicine is avoided, on the basis, the fixed clamping jaw 60 and the bottom frame 31 are screwed and fixed by the conductive screw 63, the conductive function is further realized, and the application requirement is better met.
In order to further improve the sealing performance of the joint between the sealing sleeve 64 and the encapsulating layer 600, in this embodiment, a first sealing ring 65 is sleeved outside a nut of the conductive screw 63, and the first sealing ring 65 is clamped between the sealing sleeve 64 and the fixed clamping jaw 60. Further, a first step opening 601 is formed in the encapsulating layer 600, and the first sealing ring 65 is located in the first step opening 601. Preferably, the first seal ring 65 is a teflon seal ring.
Accordingly, in order to improve the sealing performance of the screwing position of the conductive screw 63 and the bottom frame 31, in the present embodiment, a second sealing ring 66 is sleeved on the conductive screw 63, and the second sealing ring 66 is interposed between the fixed jaw 60 and the bottom frame 31. In this embodiment, the encapsulating layer 600 is provided with a second step opening 602, and the second sealing ring 66 is located in the second step opening 602. Further, the second sealing ring 66 is a teflon sealing ring.
As a preferred material choice, in this embodiment, the sealing sleeve 64 is a PEEK sealing sleeve. The seal coating 310 is a teflon coating.
The utility model discloses a lower electrically conductive anchor clamps with sealing performance, in practical application, lower electrically conductive anchor clamps make its circuit board lower part electric conductivity more even based on the sealing mechanism on its top layer, save more positive pole metals, both can make electrically conductive anchor clamps electrically conductive, have the risk that reduces copper. The device is characterized in that a conductive clamp is arranged on a conductive frame sprayed with a PTFE coating through a conductive screw, the upper part of the conductive clamp is sealed by a sealing ring and a sealing sleeve, so that the conductive clamp is not contacted with and insulated from liquid medicine except other parts at a clamping point, and in addition, a circuit board can be clamped at the bottom of a liquid medicine tank so as not to float on the circuit board, so that the conductivity is more consistent and more anode metals are not lost.
EXAMPLE III
In practical application, in order to ensure that the electroplating transfer hanging tool has the functions of electrifying and transferring the circuit board, the clamp of the electroplating transfer hanging tool can still keep conducting after the electroplating transfer hanging tool moves to the liquid medicine groove, in order to meet the requirements, a conducting mechanism needs to be arranged on the hanging tool, current transmission is ensured through continuous contact of the conducting mechanism and the conductor rail, but the hanging tool is difficult to avoid being influenced by jolting, turning, rusting or other conditions in the moving process, the electric connection relation between the conducting mechanism and the conductor rail at a certain position is unreliable, the electroplating effect of the circuit board is influenced at the moment, and the electroplating quality cannot meet the production requirement.
To this end, this embodiment provides an auxiliary conductive mechanism capable of performing a conductive compensation function on an electroplating transfer hanger, so as to improve reliability of electrical connection, and as shown in fig. 3, fig. 8 and fig. 9, the auxiliary conductive mechanism 9 includes an elongated conductive shell 90, a plurality of conductive swing arms 92 and at least one conductive swing block 93, a cross section of the conductive shell 90 is in an inverted "U" shape, a plurality of first conductive rotating shafts 91 parallel to each other penetrate between two sidewalls of the conductive shell 90, the plurality of first conductive rotating shafts 91 are sequentially distributed along a length direction of the conductive shell 90, the plurality of conductive swing arms 92 are respectively disposed on two sides of the conductive shell 90, an end of the first conductive rotating shaft 91 penetrates through the conductive swing arms 92, the conductive shell 90 and/or the conductive swing arms 92 are rotatably connected to the first conductive rotating shaft 91, at least two second conductive rotating shafts 94 penetrate through the conductive swing blocks 93, two ends of the second conductive rotating shafts 94 respectively penetrate through the two conductive swing arms 92 symmetrical to each other, the conductive swing arms 92 and/or the conductive swing blocks 93 are rotatably connected to the second conductive rotating shafts 94, and the conductive swing blocks 93 are electrically contact the bottom of the conductive swing blocks 93 for electrical connection.
In the structure, the two sides of the conductive shell 90 are respectively provided with the conductive swing arms 92 capable of swinging back and forth, the conductive swing block 93 is arranged between the two symmetrical conductive swing arms 92, when the transfer hanger moves, the bottom of the conductive swing block 93 is in electrical contact with the conductive rail under the action of gravity, and based on the matching of the auxiliary conductive mechanism and the main conductive mechanism of the hanger, the hanger is enabled to have dual conductive performance, the auxiliary conductive mechanism plays a role in conductive compensation for the electroplating transfer hanger, thereby greatly improving the reliability of the electrical connection of the hanger and further ensuring the electroplating quality.
In order to better match with the conductive rail, in this embodiment, the conductive swing arm 92 is inclined, and an included angle between the conductive swing arm 92 and the moving direction of the conductive shell 90 is an acute angle.
Preferably, two side walls of the conductive shell 90 are respectively formed with a stopper 95 bent outward, and the stopper 95 abuts against a side portion of the conductive swing arm 92 facing the moving direction. The stopper 95 may keep the conductive swing arm 92 in an inclined state by abutting against the conductive swing arm 92.
In this embodiment, the first conductive rotating shaft 91 is sleeved with a torsion spring 96, two ends of the torsion spring 96 are respectively abutted to the conductive shell 90 and the conductive swing block 93, and the conductive swing block 93 is driven to swing in the moving direction by the elasticity applied by the torsion spring 96, so that the conductive swing arm 92 abuts against the stopper 95. Meanwhile, under the elastic force of the torsion spring 96, the conductive swing block 93 can be attached to the conductive rail more closely.
In this embodiment, an oblique portion 930 is formed at one end of the conductive pendulum block 93 facing the moving direction, and the oblique portion 930 is located at a bottom corner of the conductive pendulum block 93. Wherein the beveled portion 930 is mainly used to reduce friction between the conductive pendulum block 93 and the conductive rail.
The utility model discloses an auxiliary conductive mechanism 9, it can be connected in electrically conductive anchor clamps through wire 10.
Example four
In the prior art, for flexible circuit board electroplating equipment, an upper clamp and a lower clamp are generally arranged on an electroplating transfer hanger of the flexible circuit board electroplating equipment, the flexible circuit board is clamped and fixed under the coordination action of the upper clamp and the lower clamp, and meanwhile, the electrifying performance of the flexible circuit board is kept.
Therefore, the utility model provides a can guarantee to electroplate and move reliable tight flexible line way board of carrying hanger, can keep flexible line way board tensioning, smooth overspeed device tensioner again, combine fig. 1, fig. 4 and fig. 5 to show, it carries the hanger including support frame 2, conductive frame 3 and last conductive fixture 4 to electroplate, conductive frame 3 with support frame 2 fixed connection, overspeed device tensioner 5 is including tensioning motion plate 50, go up conductive fixture 4 with tensioning motion plate 50 fixed connection, two vertical slotted holes 20 have been seted up on the support frame 2, be fixed with two round pin axles 51 on the tensioning motion plate 50, round pin axle 51 with vertical slotted hole 20 one-to-one, round pin axle 51 passes vertical slotted hole 20, just round pin axle 51 can be relative vertical slotted hole 20 slides from top to bottom, the end fixing of round pin axle 51 has stopper 52, stopper 52 card is located the outside of support frame 2, tensioning motion plate 50 with be connected with extension spring 53 between the conductive frame 3.
In the structure, based on round pin axle 51 with the cooperation of vertical slotted hole 20 can make tensioning motion plate 50 can be relative support frame 2 moves from top to bottom on this basis, the utility model discloses tensioning motion plate 50 with be connected with extension spring 53 between the electrically conductive frame 3, when flexible line way board centre gripping in when between electrically conductive anchor clamps 4 and the lower electrically conductive anchor clamps 6 under the elastic tension effect that extension spring 53 was applyed, can upwards carry and draw tensioning motion plate 50 with electrically conductive anchor clamps 4 goes up for the flexible line way board tensioning in go up between electrically conductive anchor clamps 4 and the lower electrically conductive anchor clamps 6 and keep level and smooth, and then improve the electroplating homogeneity of flexible line way board.
As a preferred structure, the supporting frame 2 is an inverted "U" shaped supporting frame, and the conductive frame 3 is fixedly connected to two arms of the supporting frame 2.
Regarding the specific positions of the two vertical slots 20, in the present embodiment, the two vertical slots 20 are respectively opened on the two arms of the supporting frame 2. Further, the vertical slot 20 is near the lower end of the arm of the support frame 2.
In order to be better clamped at the outer side of the supporting frame 2, in this embodiment, the limiting block 52 is shaped like a circular cake.
Preferably, two tension springs 53 are connected between the tensioning moving plate 50 and the conductive frame 3, and the two tension springs 53 are respectively close to two ends of the tensioning moving plate 50. Wherein, based on the cooperation of the two tension springs 53, the elastic tension can be stably applied to the tensioning moving plate 50, thereby ensuring the uniform tension of the left and right sides.
In order to place the tension springs 53, in this embodiment, two accommodating notches 54 are formed at a connection portion between the tensioning moving plate 50 and the conductive frame 3, and the two tension springs 53 are respectively disposed in the two accommodating notches 54.
Compared with the prior art, in the embodiment, the tensioning device can automatically tension the circuit board after clamping the circuit board during electroplating, the tensioning device is flatly connected with the conductive frame through the carrier U-shaped frame to conduct electricity to the lower clamp, so that the lower clamp is flatly connected with the conductive clamp through the up-and-down sliding boss, the spring plays a role in automatic tensioning, when the circuit board is installed on a manipulator or a mechanism, the conductive clamp is flatly and automatically pressed down, and when the circuit board is clamped, the lead clamp is flatly and automatically tensioned, so that the circuit board is always kept in a tensioned state in the circuit board electroplating process, and the uniformity of the surface of the circuit board can be higher during electroplating the circuit board.
The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and all modifications, equivalent replacements, or improvements made within the technical scope of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a flexible high-order circuit board is electroplated and is moved and carry hanger, its characterized in that, including crossbeam (1), the front end of crossbeam (1) is equipped with support frame (2), the lower extreme of support frame (2) is fixed with electrically conductive frame (3), be equipped with a plurality of electrically conductive anchor clamps (4) and a plurality of electrically conductive anchor clamps (6) down on electrically conductive frame (3), go up electrically conductive anchor clamps (4) with electrically conductive anchor clamps (6) are used for the upper and lower both ends of centre gripping flexible line board (100) respectively down, the rear end of crossbeam (1) is equipped with running gear (7) and leading electric mechanism (8), leading electric mechanism (8) crossbeam (1) support frame (2) with electrically conductive frame (3) electrical contact in proper order, go up electrically conductive anchor clamps (4) with down electrically conductive anchor clamps (6) all with electrically conductive frame (3) electrical contact.
2. The flexible high-order circuit board electroplating transfer rack as claimed in claim 1, wherein the upper conductive clamp (4) and the lower conductive clamp (6) are both arranged on the front side of the conductive frame (3).
3. The flexible high-order circuit board electroplating transfer rack as claimed in claim 1, wherein a tensioning device (5) is connected between the upper conductive clamp (4) and the upper end of the conductive frame (3).
4. The flexible high-order circuit board electroplating transfer rack as claimed in claim 1, wherein an auxiliary conductive mechanism (9) is arranged on the cross beam (1), and the upper conductive clamp (4) and the lower conductive clamp (6) are both connected to the auxiliary conductive mechanism (9) through a wire (10).
5. The flexible high-order circuit board electroplating transfer rack according to claim 1, wherein a teflon coating is sprayed on the conductive frame (3).
6. The electroplating transfer rack for the flexible high-order circuit board according to claim 1, wherein the support frame (2) is an inverted U-shaped support frame, and the upper end of the support frame (2) is fixed to the front end of the cross beam (1) through a bolt.
7. The flexible high-order circuit board electroplating transfer rack as claimed in claim 1, wherein a H-shaped frame (11) is fixed at the rear end of the cross beam (1), and the main conducting mechanism (8) and the traveling mechanism (7) are respectively arranged at the upper end and the lower end of the H-shaped frame (11).
8. The electroplating transfer rack for the flexible high-order circuit board according to claim 1, wherein two vertical guide posts (30) are fixed at the lower end of the conductive frame (3), and the two vertical guide posts (30) are respectively close to the left end and the right end of the conductive frame (3).
9. The electroplating transfer rack for the flexible high-order circuit board according to claim 7, wherein an inverted U-shaped buckle groove (12) is fixed at the rear end of the I-shaped frame (11), a plurality of anti-reverse fins (120) capable of being turned over are arranged in the buckle groove (12), the anti-reverse fins (120) are arranged in an inclined manner, and an included angle between the anti-reverse fins (120) and the movement direction of the electroplating transfer rack is an acute angle.
10. The electroplating transfer rack for the flexible high-order circuit board according to claim 9, wherein the upper end of the anti-reverse fin (120) is rotatably fitted with the side wall of the fastening groove (12), and the lower end of the anti-reverse fin (120) extends out below the fastening groove (12).
CN202220841243.8U 2022-04-13 2022-04-13 Electroplating transfer hanging tool for flexible high-order circuit board Active CN218059275U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220841243.8U CN218059275U (en) 2022-04-13 2022-04-13 Electroplating transfer hanging tool for flexible high-order circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220841243.8U CN218059275U (en) 2022-04-13 2022-04-13 Electroplating transfer hanging tool for flexible high-order circuit board

Publications (1)

Publication Number Publication Date
CN218059275U true CN218059275U (en) 2022-12-16

Family

ID=84417371

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220841243.8U Active CN218059275U (en) 2022-04-13 2022-04-13 Electroplating transfer hanging tool for flexible high-order circuit board

Country Status (1)

Country Link
CN (1) CN218059275U (en)

Similar Documents

Publication Publication Date Title
JP2009532586A (en) Electrolytic copper plating method
CN101318390A (en) Remelting plating Sn material and electronic component using the same
CN218059275U (en) Electroplating transfer hanging tool for flexible high-order circuit board
US20040132299A1 (en) Method for depositing lead-free tin alloy
CN217869142U (en) Auxiliary conductive mechanism
KR20210007802A (en) Clamp horizontal cycle continuous movable plating apparatus
CN217026123U (en) Tensioning device for electroplating transfer hanging tool
CA2405573A1 (en) Electrical contact element made of an elastic material
KR910004846A (en) Electrodeposition of Palladium Films
TWI681084B (en) Tin alloy plating solution
CN216550793U (en) Clamp for electroplating device
CN114892225A (en) Plating solution for electroplating gold on nickel coating and method for electroplating gold on nickel coating, gold-plated part and application
CN114775026A (en) Electroplating transfer rack for flexible high-order circuit board
CN217026122U (en) Lower conductive clamp with sealing performance
CN213295553U (en) Transfer device, matching structure and electroplating system
JP2008133533A (en) Gold-silver alloy plating liquid
CN214193487U (en) Electroplating cathode conductive device capable of reducing friction resistance
CN114277425A (en) Light automatic clamping device for electric conduction and application thereof
CN110396711B (en) Clamping steel band is electroplated to semiconductor
CN114164480A (en) Automatic clamping device for electric conduction and application thereof
CN114959849A (en) Power connection device, electroplating clamp and electroplating equipment
WO2008081490A1 (en) Gripping device and clamping pincers with double cathode contact on both sides of a dielectric substratum to be electroplated
CN113564675A (en) A electrically conductive clamp and coating machine for coating machine
CN219430167U (en) Integrated electroplating flower basket clamp
CN218710976U (en) Clamping and conveying assembly

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant