CN102084477A - Contacting device - Google Patents
Contacting device Download PDFInfo
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- CN102084477A CN102084477A CN200980112800XA CN200980112800A CN102084477A CN 102084477 A CN102084477 A CN 102084477A CN 200980112800X A CN200980112800X A CN 200980112800XA CN 200980112800 A CN200980112800 A CN 200980112800A CN 102084477 A CN102084477 A CN 102084477A
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- Prior art keywords
- pressure elements
- wafer
- main body
- conveying device
- basic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
- B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The present invention relates to a device for contacting a wafer during submersion in a liquid. The device comprises a main body fixed to a transportation device; an electrical contact for contacting the wafer and a pressure element for pressing the electrical contact towards the wafer.
Description
Technical field
The present invention relates to a kind of device that is used for the contact solar cell wafer.
Background technology
In UK patent application 0709619.1, a kind of device that is used for to the liquid exposure solar cell wafer has been described, comprise the container that is filled with liquid; Be used for the conveying device of transfer wafers by liquid; And be used for conveying device carry the carrying device of wafer.
In UK patent application 0719805.4, show a kind of be used for and comprise the liquid container that is filled with liquid at the device of the wafer of liquid submergence supply electric power at least in part; Comprise that the wafer that is used to carry submergence at least in part passes through the conveying device of the wafer carrying device of liquid; And the supply unit that is used for supplying electric power to wafer.
For example for example Ni, Cu, Sn and/or Ag are coated to therein in the electroplating technology of wafer and have used these announcements.
Challenge in this technology is to provide to wafer and electrically contacts and do not apply the strong mechanical force that may cause wafer fracture to wafer.In addition, need improve process speed for the large-scale production of solar cell.When electroplating, this is to realize by the current density that increase is applied to wafer, because the number of the metallic atom that deposits on wafer surface is directly proportional with the electric current that is applied to wafer.Yet, for current density, there is the upper limit, be called restriction diffusion current density I
L(I
L=(nFD
OxC
b)/δ).(with reference to the 97th page, M.Paunovic and M.Schlesinger, Fundamentals of Electrochemical Deposition, Second Ed., pp.97, John Wiley and Sons, 2006).I
LBe to make ion begin to become the current value of the limiting factor of overall reaction rates to the mass transport of electrode/solution interface.By being increased in the stirring at solution/electrode interface place, can become littler by this spy (Nernst) diffusion layer δ.In turn, this means I
LThe theoretical deposition speed of increase and metal can be increased.
The objective of the invention is to be improved to electrically contacting of wafer, thereby above condition can be satisfied.Particularly, this device makes it possible to stir from the same side turbulization when contact is applied to wafer, and wafer moves forward continuously by this technology at the same time.
Summary of the invention
The present invention relates to a kind of device that is used for contact wafer during being immersed in liquid, comprising:
-main body, described main body is fixed to conveying device;
-electric contact, described electric contact is used for contact wafer;
-pressure elements, described pressure elements is used for towards wafer by piezoelectric contacts and wafer.
In one aspect of the invention, electric contact is set on the pressure elements.
In one aspect of the invention, pressure elements is connected to main body movably.
In one aspect of the invention, pressure elements comprises float element.
In one aspect of the invention, main body comprises the groove of the end that is suitable for receiving wafer.
In one aspect of the invention, electric contact comprises contact protruding upward.
In one aspect of the invention, this contact protruding upward is connected to the Bussing connector that is used to be connected to busbar.
In one aspect of the invention, this contact protruding upward utilizes electric wire and is connected to Bussing connector.
In one aspect of the invention, this device comprises the several pressure elements that can independently move with independent float element.
Description of drawings
Describe embodiments of the invention in detail referring now to accompanying drawing, wherein:
Fig. 1 illustrates the perspective view of three holding devices that keep two wafers;
Fig. 2 illustrates the end view of Fig. 1;
Fig. 3 illustrates the enlarged side view of one of holding device among Fig. 2;
Fig. 4 illustrates the perspective view that one of holding device from Fig. 4 below is seen;
Fig. 5 illustrates the end view of the holding device among Fig. 2, has wherein omitted some parts;
Fig. 6 illustrates the perspective view of the holding device among Fig. 5;
Fig. 7 a illustrates the perspective view of second embodiment of holding device;
Fig. 7 b illustrates the end view of second embodiment;
Fig. 7 c illustrates the float element of second embodiment;
Fig. 7 d illustrates the front view of second embodiment;
Fig. 8 a illustrates the 3rd embodiment of holding device and the perspective view of busbar;
Fig. 8 b illustrates the holding device among Fig. 8 a and the end view of busbar;
Fig. 8 c illustrates the holding device among Fig. 8 a and the front view of busbar;
Fig. 8 d illustrates the perspective view of the 3rd embodiment, has wherein removed main body;
Fig. 8 e illustrates the front view of main body;
Fig. 9 illustrates the translucent perspective view of the 4th embodiment;
Figure 10 a illustrates the translucent perspective view of the 5th embodiment;
Figure 10 b illustrates the end view of the 5th embodiment of Figure 10 a.
Embodiment
With reference now to Fig. 1 and 2,, three holding device 10a, 10b shown in it and 10c.For example, holding device is installed on the conveying device (not shown), such as in above-mentioned announcement, describe those.A solar cell wafer 1a is maintained between holding device 10a and the 10b, and a solar cell wafer 1b is held between holding device 10b and the 10c.Therefore, provide holding device, on both sides, to keep an end of wafer.The loading and unloading of wafer to holding device have also been described in above-mentioned announcement.
Should be noted that, above-mentioned announcement has been described holding device 10 and has been fixed to continuous conveying device, wherein at the first end place of conveying device, between two holding devices, receive wafer continuously, and at the second end place of conveying device, discharge other wafers continuously from conveying device.During from the first end to the second end, carrying, wafer be exposed to for example be immersed in the liquid, the technology of plating etc.First holding device receives and keeps the front end of wafer, and second holding device receives and keep the rear end of wafer, and term " preceding " and " back " are with reference to throughput direction here.Therefore, each wafer is maintained between two holding devices 10.
With reference now to Fig. 3 and 4,, the corresponding holding device 10 with one of holding device 10a, 10b, 10c is shown.
Holding device 10 is included in the main body 12 that has basic open wedge 14a and 14b on each side.Basic open wedge 14a and 14b are suitable for receiving the end of wafer 1, as shown in FIG. 2.Groove 16 is provided in the bottom of main body 12, is used for holding device 10 is fastened to conveying device.
Main body 12 comprises the longitudinal opening 18 of qualification rotating shaft I-I as shown in FIG. 4.Opening 18 is provided in the bottom of main body 12.
In the groove that pressure elements 20 provides in main body 12 by removable or be pivotally connected to opening 18, thereby they can pivot around rotating shaft I-I.In Fig. 4, three couples of pressure elements 20a and 20b are shown are provided in the bottom of main body 12, wherein pressure elements 20a is provided at that go up in the left side and pressure elements 20b is provided on the right side.The pivot of pressure elements 20 connects can for example be provided by the straight pin 18a that inserts by the opening 18 and the corresponding opening (see figure 6) in the pressure elements 20 of main body 12.As shown here, pin 18a is public for two pressure elements 20a and 20b.
Pressure elements 20 comprises the float element of being made by the material of bodily light material 30.In the drawings, float element 30 is configured to provide in the peripheral openings the independent cylindrical float element 30 of (that is, being provided with apart from pin 18a certain distance ground).Float element 30 is will at the cylinder of the hollow of end place sealing and therefore they comprise air to realize maximum positive buoyancy.Structure 20a and 20b are preferably by making with respect to the material of electroplating liquid (for example, polypropylene) bodily light.30 size can be modified and/or 30 distances to axle 18 can be changed to realize from touching the desired power of wafer.Alternatively, can float element 20 be provided and provide a public float element for all pressure elements 20b for all pressure elements 20a as public float element.Alternatively, pressure elements can be incorporated as the part (that is the pressure elements of being made by the material of bodily light) of float element 20.
Therefore, when pressure elements was in this top or off-position, holding device kept wafer and electrically contacts for wafer provides simultaneously.When pressure elements it the bottom or open position in the time, can in holding device, receive wafer or discharge wafer from holding device.
In Fig. 5 and 6, Bussing connector 44 is shown is connected to the two electric contact 40 of right pressure elements 20a and left pressure elements 20b.Certainly, can also make a common bus connector be used for six all pressure elements.
Certainly, can use by each side surface to provide and electrically contact and/or be adjusted in distance between them more than three contacts 40 for wafer.
Can also utilize a continuous electric contact to substitute to be used for three of a side of wafer independently electric contacts 40.
Second embodiment
In Fig. 7 a-7d, second embodiment of holding device is shown.This holding device is represented by Reference numeral 110.A lot of details about second embodiment will here not describe in detail, because they are similar to above-mentioned those.
As describing ground in detail with reference to first embodiment, device 110 is included in the main body 112 that has basic open wedge 114a and 114b on each side.
The longitudinal opening 118 that provides in the bottom of main body 112 is provided main body 112.Pressure elements 120 is provided in the opening 118 and authorized pressure element 120 moves up with the substantially linear motion on the direction of arrow B.Pressure elements 120 is made by unsteady material, i.e. bodily light in employed liquid.Alternatively, pressure elements 120 comprises the float element (not shown) of for example incorporating in the body of pressure elements.Ideally, to incorporate the material in float element and 120 into be by making with respect to the material of employed liquid bodily light to pressure elements 120.
With reference now to Fig. 7 c,, pressure elements shown in it 120 is basic T shape (even reversing T shape top T shapes down), comprises basic vertically central unit 150 and basic horizontal cross member 152.
As seeing in Fig. 7 b and 7c that ground, float element 120 comprise element 121 protruding upward, basic T shape.121 restriction pressure elements 120 these the two kinds of motions up and down in opening 118 of T shape element.Basic T shape element 121 is corresponding to the basic vertically central unit 150 of pressure elements 120.
When pressure elements 120 was immersed in the liquid, its positive buoyancy caused that pressure elements moves up on the direction of arrow B, and therefore the wafer that provides in basic open wedge 114a and 114b will be provided electric contact 140.
Therefore, when pressure elements was in this top or off-position, holding device kept wafer and provides for wafer simultaneously electrically contacting.When pressure elements it the bottom or open position in the time, can in holding device, receive or discharge wafer from holding device.
The 3rd embodiment
In Fig. 8 a-8d, the 3rd embodiment of holding device is shown.This holding device is represented by Reference numeral 210.With a lot of details that here do not describe in detail about the 3rd embodiment, because they are similar to above-mentioned those.
As describing in detail with reference to first embodiment, device 210 is included in the main body 212 that has basic open wedge 214a and 214b on each side.
Recess or opening 218 (seeing Fig. 8 e) are set in the bottom of main body 212.Pressure elements 220 is provided in the opening 218.Three substantially cylindrical passages 219 are provided in the main body 212, as utilize the dash line signal in Fig. 8 c.Three substantially cylindrical bars 222 are provided in each passage 219.In their lower end, bar 222 is fixed to pressure elements 220.In their upper end, the knob 244 that bar 222 provides Bussing connector or made by electric conducting material.Knob 244 has basic spherical shape, and has the diameter bigger than bar 222.As see ground in Fig. 8 b and 8c, bar 222 is longer than passage 219.
Therefore, authorized pressure element 220 is with bar 222 and knob 244, mobile up and down with the substantially linear motion on the direction of arrow C.Pressure elements 222 restrictions that this motion is subjected to greater than the knob 244 of passage 219 and is subjected to meeting with the bottom that contacts main body 212.
Equally in this embodiment, pressure elements can be considered to be basic T shape, comprises basic vertically central unit 250 and basic horizontal cross member 252 (seeing Fig. 8 d).Here, basic vertically central unit 250 is corresponding to bar 222.Basic horizontal cross member 252 is corresponding to the pressure elements of fixed contact 240.
, provide basic horizontal cross member 252 equally here, on the direction that is parallel to basic vertically central unit, to push each wafer towards the upper surface of basic open wedge 214a, 214b.
Therefore, when pressure elements was in this top or off-position, holding device kept wafer and provides for wafer simultaneously electrically contacting.When pressure elements it the bottom or open position in the time, can in holding device, receive wafer or discharge wafer from holding device.In the 3rd embodiment, provide pressure elements 220 motion be not buoyancy.Originally, pressure elements 220 is in its lower position.When near the end 249 of busbar 248, bar 222 will be between bar process, and because inclined end portion 249, knob 244 will upwards be guided or be pushed.Therefore, the guiding that will on the direction of arrow C, make progress of bar and pressure elements, and electric contact 240 is with the surface of contact wafer.Certainly, busbar 248 will be arranged in suitable position on liquid.
Provide above-mentioned detailed description with signal and description the preferred embodiments of the present invention particularly.Yet this explanation is limited to specific embodiment with the present invention absolutely not.
The 4th embodiment
In Fig. 9, show the 4th embodiment of holding device.This holding device is represented by Reference numeral 310.A lot of details about the 3rd embodiment will here not describe in detail, because they are similar to above-mentioned those.
As describing ground in detail with reference to first embodiment, device 310 is included in the main body 312 that has basic open wedge 314a and 314b on each side.
Two recesses or opening 318 are provided in the bottom of main body 312.From the lower to the upper, two substantially cylindrical passages 319 are set substantially vertically in main body 312.The pressure elements 320 of two basic T shapes is provided, and each comprises basic vertically central unit 350 and basic horizontal cross member 352.Basic vertically central unit 350 comprises the bar 322 that is provided with by substantially cylindrical passage 219.Basic horizontal cross member 352 is connected to each bar 322.On the tip of each cross member 352 is pointed to, thereby form electric contact 340.
Therefore, provide basic horizontal cross member 252 on the direction that is parallel to basic vertically central unit, to push each wafer towards the upper surface of basic open wedge 214a, 214b.
In this embodiment, the two all conducts electricity basic horizontal cross member 352 and basic vertically central unit 350, thereby is formed into the electrical connection of power supply.
In their upper end, protrude from each passage 319, bar 322 provides a public magnetic Bussing connector 344.Magnetic Bussing connector 344 is configured to up be attracted when holding device is mobile below magnetic bus 348.Magnetic Bussing connector 344 and magnetic bus 348 also provide between pressure elements 320 and power supply and electrically contact.
Therefore, when holding device is mobile below bus 348, pressure elements 320 will move up with the substantially linear motion.Therefore, when pressure elements was in this top or off-position, holding device kept wafer and provides for wafer simultaneously electrically contacting.When pressure elements it the bottom or open position in the time, can in holding device, receive wafer or discharge wafer from holding device.
The 5th embodiment
In Figure 10 a and 10b, the 5th embodiment of holding device is shown.This holding device is represented by Reference numeral 410.A lot of details about the 5th embodiment will here not describe in detail, because they are similar to above-mentioned those.
As describing in detail with reference to first embodiment, device 410 is included in the main body 412 that has basic open wedge 414a and 414b on each side.
Opening 418 is set in main body 418.Opening 418 is combinations of the opening of the opening in the 4th embodiment and second embodiment.Opening 418 is included in the longitudinal opening 418a that is provided with on the longitudinal direction of bottom of main body, and two opening 418b that are provided with transverse to longitudinal opening.
In this embodiment, pressure elements 420 is similar to the pressure elements of the 4th embodiment, and will here not describe in detail.Pressure elements is provided among the transverse opening 418b of main body.In addition, pressure elements 420 comprises the buoyancy element 422 that is provided among the longitudinal opening 418a.Buoyancy element 422 is fixed to basic vertically central unit 450 or bar 422, and can move vertically in opening 418a.Therefore, when holding device was immersed in the liquid, buoyancy element 422 will upwards be pushed, and pressure apparatus will be pushed towards wafer.When holding device when liquid rises, buoyancy element 422 will down move, and can discharge wafer from holding device.
In this embodiment, the two all conducts electricity basic horizontal cross member 452 and basic vertically central unit 450, thereby is formed into the electrical connection of power supply.
Therefore, when pressure elements was in this top or off-position, holding device kept wafer and provides for wafer simultaneously electrically contacting.When pressure elements it the bottom or open position in the time, can in holding device, receive wafer or discharge wafer from holding device.
In the above-described embodiments, pressure elements can move with respect to main body.More specifically, pressure elements can be used to receive/discharge the open position of wafer and be used to keep and the off-position of contact wafer between move.In off-position, wafer is maintained between main body and the pressure elements.
Claims (15)
1. be used for conveying device by the liquid transfer wafers, wherein said conveying device was set for before the first end place receives wafer continuously and discharging described wafer they essentially horizontally is transported to the second end, and wherein said conveying device comprises at least two holding devices (10 that are used for keeping and electrically contacting each wafer during carrying by liquid between at least two contact devices; 110; 210)), wherein each holding device comprises:
-main body (12; 112; 212), described main body (12; 112; 212) comprise basic open wedge (14a, the 14b of the end that is used to receive each wafer; 114a, 114b; 214a, 214b);
-electric contact (40; 140; 240), described electric contact (40; 140; 240) be used to contact the end of each wafer, wherein said electric contact is connected to power supply;
-pressure elements (20; 120; 220), described pressure elements (20; 120; 220) be connected to described main body movably, be used for pushing described electric contact (40 towards the end of each wafer; 140; 240).
2. conveying device according to claim 1, wherein, described main body comprises basic open wedge (14a, a 14b on each side; 114a, 114b; 214a, 214b).
3. conveying device according to claim 1 and 2, wherein, described electric contact (40; 140; 240) be set at described pressure elements (20; 120; 220) on.
4. according to any one the described conveying device in the above claim, wherein, described pressure elements is set for towards described basic open wedge (14a, 14b; 114a, 114b; 214a, upper surface 214b) is pushed each wafer.
5. conveying device according to claim 4, wherein, described pressure elements is basic T shape, comprise basic vertically central unit and basic horizontal cross member, wherein said basic horizontal cross member is set on the direction that is parallel to described basic vertically central unit, towards described basic open wedge (14a, 14b; 114a, 114b; 214a, upper surface 214b) is pushed each wafer.
6. conveying device according to claim 5 wherein, provides described basic vertically central unit movably in by the passage of described main body.
7. conveying device according to claim 4, wherein, described pressure elements (20) utilizes the pin (18a) in the opening (18) be inserted in described main body and is pivotably connected to described main body.
8. conveying device according to claim 1, wherein, described electric contact (40; 140; 240) be used to be connected to the Bussing connector of busbar and be connected to described power supply.
9. conveying device according to claim 8, wherein, described electric contact (40; 140; 240) utilize the electric conductor that in passage, provides to be connected to described Bussing connector by described main body.
10. conveying device according to claim 3, wherein, described electric contact (40; 140; 240) protruding upward.
11. conveying device according to claim 1, wherein, described pressure elements is set at the opening (18 of described main body; 118; 218) in.
12. conveying device according to claim 1, wherein, described pressure elements comprises and being used for owing to buoyancy provides the float element of described pressure elements with respect to the motion of described main body.
13. conveying device according to claim 1, wherein, described pressure elements comprises and being used for owing to magnetic force provides the magnet of described pressure elements with respect to the motion of described main body.
14. device according to claim 1, wherein, described pressure elements (220) is connected to the bar (222) in the passage (219) that is arranged on movably in the described main body.
15. device according to claim 14, wherein, the Bussing connector (244) that has larger diameter than described bar (222) is connected in the end of described bar (222), and wherein tilts to cause the motion of described pressure elements (220) by the busbar that makes the described Bussing connector of guiding (244).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0806552.6 | 2008-04-10 | ||
| GB0806552A GB2459124A (en) | 2008-04-10 | 2008-04-10 | Wafer holder for electroplating apparatus |
| PCT/NO2009/000120 WO2009126043A2 (en) | 2008-04-10 | 2009-03-31 | Contacting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102084477A true CN102084477A (en) | 2011-06-01 |
Family
ID=39433444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980112800XA Pending CN102084477A (en) | 2008-04-10 | 2009-03-31 | Contacting device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110186424A1 (en) |
| JP (1) | JP2011516733A (en) |
| KR (1) | KR20110036793A (en) |
| CN (1) | CN102084477A (en) |
| DE (1) | DE112009000838T5 (en) |
| GB (1) | GB2459124A (en) |
| WO (1) | WO2009126043A2 (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB709619A (en) | 1951-12-14 | 1954-05-26 | Metro Cutanit Ltd | Improvements in or relating to securing a steel or other metallic part to another part of hard and difficult to work material, such as a shaft to a turbine wheel |
| GB719805A (en) | 1952-03-12 | 1954-12-08 | Babcock & Wilcox Ltd | Improvements in or relating to tubular heat exchanger walls |
| JPH0586498A (en) * | 1991-09-27 | 1993-04-06 | Olympic Co Ltd | Plating device |
| JPH08236605A (en) * | 1995-02-28 | 1996-09-13 | Komatsu Electron Metals Co Ltd | Semiconductor wafer case |
| US6251235B1 (en) * | 1999-03-30 | 2001-06-26 | Nutool, Inc. | Apparatus for forming an electrical contact with a semiconductor substrate |
| JP3284496B2 (en) * | 2000-08-09 | 2002-05-20 | 株式会社荏原製作所 | Plating apparatus and plating solution removal method |
| JP2002256498A (en) * | 2001-02-26 | 2002-09-11 | Tokyo Electron Ltd | Plating device and plating method |
| US6558750B2 (en) * | 2001-07-16 | 2003-05-06 | Technic Inc. | Method of processing and plating planar articles |
| US20040140217A1 (en) * | 2003-01-22 | 2004-07-22 | Applied Materials, Inc. | Noble metal contacts for plating applications |
| DE102004025827B3 (en) * | 2004-05-24 | 2005-06-30 | Höllmüller Maschinenbau GmbH | Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge |
| GB2449309A (en) * | 2007-05-18 | 2008-11-19 | Renewable Energy Corp Asa | A method for exposing a solar cell wafer to a liquid |
| GB2453560A (en) * | 2007-10-10 | 2009-04-15 | Renewable Energy Corp Asa | Wafer electroplating apparatus |
-
2008
- 2008-04-10 GB GB0806552A patent/GB2459124A/en not_active Withdrawn
-
2009
- 2009-03-31 JP JP2011503929A patent/JP2011516733A/en active Pending
- 2009-03-31 DE DE112009000838T patent/DE112009000838T5/en not_active Withdrawn
- 2009-03-31 CN CN200980112800XA patent/CN102084477A/en active Pending
- 2009-03-31 KR KR1020107025169A patent/KR20110036793A/en not_active Application Discontinuation
- 2009-03-31 WO PCT/NO2009/000120 patent/WO2009126043A2/en active Application Filing
- 2009-03-31 US US12/937,209 patent/US20110186424A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011516733A (en) | 2011-05-26 |
| DE112009000838T5 (en) | 2011-02-17 |
| US20110186424A1 (en) | 2011-08-04 |
| KR20110036793A (en) | 2011-04-11 |
| GB2459124A (en) | 2009-10-14 |
| WO2009126043A2 (en) | 2009-10-15 |
| GB0806552D0 (en) | 2008-05-14 |
| WO2009126043A3 (en) | 2009-12-23 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20110601 |
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| C20 | Patent right or utility model deemed to be abandoned or is abandoned |