GB2449309A - A method for exposing a solar cell wafer to a liquid - Google Patents

A method for exposing a solar cell wafer to a liquid Download PDF

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Publication number
GB2449309A
GB2449309A GB0709619A GB0709619A GB2449309A GB 2449309 A GB2449309 A GB 2449309A GB 0709619 A GB0709619 A GB 0709619A GB 0709619 A GB0709619 A GB 0709619A GB 2449309 A GB2449309 A GB 2449309A
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United Kingdom
Prior art keywords
wafer
liquid
transportation
wafers
holding
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0709619A
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GB0709619D0 (en
Inventor
Erik Sauar
Robertus Antonius Steeman
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Renewable Energy Corp ASA
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Renewable Energy Corp ASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renewable Energy Corp ASA filed Critical Renewable Energy Corp ASA
Priority to GB0709619A priority Critical patent/GB2449309A/en
Publication of GB0709619D0 publication Critical patent/GB0709619D0/en
Priority to CN2008800164818A priority patent/CN101689524B/en
Priority to DE112008001312T priority patent/DE112008001312T5/en
Priority to PCT/NO2008/000170 priority patent/WO2008143518A1/en
Priority to KR1020097026527A priority patent/KR20100022477A/en
Publication of GB2449309A publication Critical patent/GB2449309A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30—Belts or like endless load-carriers
    • B65G15/32—Belts or like endless load-carriers made of rubber or plastics
    • B65G15/42—Belts or like endless load-carriers made of rubber or plastics having ribs, ridges, or other surface projections
    • B65G15/44—Belts or like endless load-carriers made of rubber or plastics having ribs, ridges, or other surface projections for impelling the loads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/06—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface having a load-carrying surface formed by a series of interconnected, e.g. longitudinal, links, plates, or platforms
    • B65G17/063—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface having a load-carrying surface formed by a series of interconnected, e.g. longitudinal, links, plates, or platforms the load carrying surface being formed by profiles, rods, bars, rollers or the like attached to more than one traction element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
    • B65G49/0409—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length
    • B65G49/0413—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance through the bath
    • B65G49/0418—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance through the bath chain or belt conveyors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a method and device 1 for exposing a solar cell wafer 5 to a liquid. The device comprises a container 2 filled with the liquid 3, and a transportation device 4 (41) for example, a mesh or perforated band made of PMMA or PVDF passing over rollers which in turn may pass over or under the container. The transportation device transports the wafer 5 through the liquid 3. A spraying device (Figure 1, 60A) may be used to ensure the wafer is submerged in the liquid. Alternatively, there may be a combined carrier and submerging device in the form of a T shaped holding device (Figure 4a, 60B).

Description

24493Q9
DEVICE AND METHOD FOR EXPOSING WAFERS TO A LIQUID
FIELD OF THE iNVENTION
The present invention relates to a device and method for exposing wafers to a liquid.
BACKGROIJND OF THE INVENTION
During the manufacturing of solar cell wafers, there is a need for exposing the wafers to different liquids, such as etching solutions, rinsing solutions, washing by means of water etc. There are several known methods and devices for exposing the wafers to liquid.
Today, many of the processes in solar cell wafer production uses large tubs filled with liquid, where the wafers are submerged into the liquid. Many liquids have a relatively short life time, which causes that a large amount of liquid must be replaced periodically, which is environmentally and economically undesired.
Moreover, there is a trend towards making the wafers thinner and consequently they also become more fragile. Thin wafers are also lighter, and there is a risk that light wafers having a relative large surface area actually will float in the liquid, thereby causing that only one surface get exposed to the liquid. For liquid exposure that implies gas formation in the contact with silicon wafers, this problem is even larger as the bubbles will accumulate on the wafer surfaces and contribute to a further uplift.
The object of the present invention is to provide a device and method for exposing wafers to a liquid where the volume of the liquid tub can be reduced, thereby reducing the overall Consumption of liquid. Moreover, it is an object of the present invention to provide a device and method where thinner wafers are handled gently so that breakage is avoided. Further, it is important to ensure that both surfaces of the wafer are exposed to the liquid. Finally, it is an object of the present innovation to be able to remove broken wafers without interrupting operation.
SUMMAjy OF THE INVENTION
The present invention relates to a method for exposing a solar cell wafer to a liquid, comprising the following steps: a) placing the wafer on a transportation device; and b) transporting the wafer through the liquid by means of the transportation device that moves together with the wafer through the liquid.
Preferably, the method comprises the following step: c) submerging the wafer into the liquid.
In one embodiment, step c) is performed by moving the wafer downwards into the liquid. The movement is caused by holding devices or other arrangements which causes that the wafer is held submerged into the liquid during the transport through the liquid.
In another embodiment, step c) is performed by spraying a liquid Onto the upper 0 surface of the wafer. In this way the liquid sprayed onto the upper surface of the wafer will cause the wafer to be submerged into the liquid.
The present invention also relates to a device for exposing a solar cell wafer to a liquid, comprising: -a container filled with the liquid; -a transportation device for transporting the wafer through the liquid; and -a carrier device for carrying the wafer together with the transportation device.
In a preferred embodiment, the device further comprises a submerging device for ensuring that the wafer is submerged into the liquid. The main purpose of the submerging device is to ensure that both sides of the wafer are exposed to the liquid.
In one embodiment the submerging device is a spraying device for spraying the liquid onto the upper surface of the wafer.
In another alternative embodiment the submerging device is a holding device for holding the wafer close to the transportation band.
In another alternative embodiment the submerging device is or includes a bar device for preventing the wafers from floating.
In an aspect of the present invention, the holding device has a substantially T-shaped cross section.
In an aspect of the present invention, the holding device has a cross section substantially formed as two T's placed on top of each other.
In an aspect of the present invention, the holding device comprises a tappet that is protruding from the transportation belt and a second belt to be engaged with the tappets of the transportation belt for enclosing the wafer through the transportation through the liquid.
In an aspect of the present invention, the transportation device and/or holding device comprises perforations, meshes or other openings for allowing the liquid to circulate around the wafer and to ensure good mixing between the liquid above and below the wafers.
In an aspect of the present invention, the holding device is fastened to the transportation device.
In an aspect of the present invention, the transportation device comprises wiping means to push broken wafers to one end of the liquid container.
In an aspect of the present invention, the holding device on the transportation device is shaped so that a strong bending of the movement direction of the transportation device can be used to automatically load and unload wafers from or to one or several transportation band(s), band(s) that preferably are moving the wafers at the same or a similar speed as the transportation device.
in an aspect of the present invention, it comprises guiding means to prevent the wafers from sliding out of position sideways.
In an aspect of the present invention, it comprises fluid control means to provide a near-symmetrical relative liquid flow above and below the wafer.
In an aspect of the present invention, the holding device has a hard-wearing, polished surface towards the wafer while the material behind is softer such as foamed rubber etc. in order to provide a dampened touch for the wafer.
It is furthermore the purpose of the present invention, that the holding device on the transportation device is shaped so that it automatically can load and unload wafers from or to one or several conveyor belt(s), preferably moving the wafers at the same or a similar speed as the transportation device. In this way conventional pick-and-place robots can be avoided so that both investment costs and wafer breakage is reduced.
DETAILED DESCRIPTION
Embodiments according to the present invention will be described in detail below with reference to the enclosed drawings, where: Fig. I illustrates a first embodiment of the invention; Fig. 2 illustrates a second embodiment of the invention; Fig. 3 illustrates a third embodiment of the invention; Fig. 4a and 4b illustrate details of the carrier devices in fig. 2; Fig. 5 illustrates details of the carrier devices in fig. 3; Fig. 6 illustrates details of the carrier devices of a fourth embodiment of the invention; Fig. 7 illustrates the fifth embodiment of the invention; Fig. 8 is an enlargement of some details in fig. 7; Fig. 9 illustrates the sixth embodiment of the invention; and Fig 10 illustrates a transportation device having wiping means.
First embodiment The first embodiment of the device I according to the present invention will now be described with reference to fig. 1. The device I comprises a container 2 filled with a liquid 3. The container 2 is shallow to reduce the volume of the liquid 3 that is used.
The device 1 further comprises a transportation device 4 for transporting a wafer 5 through the liquid. The transportation device 4 comprises a transportation band 41 with carrier devices 42 to provide that the wafer 5 located between the carrier devices 42 is carried together with the transportation band through the liquid. The transportation device 4 further comprises supporting rollers, driving means etc (not shown) for Supporting and driving the transportation band 41 through the liquid.
In fig. I it is shown that the transportation band 41 moves submerged into the liquid from a first side 11 to a second side 12 of the device 1, in the direction of the arrow A. The wafer 5 is put on the transportation band at the first side 11, for example transferred from a previous conveyor belt (not shown) and is removed from the transportation band 41 at the second side 12, for example transferred to a next conveyor belt (not shown). It is shown that the wafer is transported into the liquid at an angle a, which is exceeding 0,5 degrees in relation to the liquid surface. In this way it is ensured that the front end of the wafer is inserted into the wafer before the rear end, and consequently, the wafer can break the surface tension without a force that could break the wafers.
It should be noted that the transportation band 41 preferably is a continuous band, which will be described in further detail in relation to the other embodiments of the invention.
The first embodiment I further comprises a submerging device 6 for ensuring that the wafer is submerged into the liquid and thereby providing that both sides of the wafer will be exposed to the liquid. The submerging device 6 comprises a spraying device 60A with a spraying nozzle 61 for spraying the liquid towards the wafer as the transportation band 41 is submerged into the liquid near the first side 11.
By spraying the wafer 5, the surface tension of the liquid surface is reduced, the weight over the wafer is increased and it is avoided that the wafer will float on the surface of the liquid, and consequently, it is ensured that both surfaces of the wafer will be exposed to the liquid.
The transportation band 41 is made of any suitable material, such as chemically resistant materials like PMMA or PVDF which are acid proof. Moreover, the transportation band 41 and/or carrier device 42 has perforations, meshes or other openings to allow the liquid to circulate between the transportation band 41 and the two sides of the wafer 5.
Second embodiment The second embodiment of the device I according to the present invention will now be described with reference to fig. 2, fig. 4a and fig. 4b. The second embodiment comprises many of same elements as in the first embodiment, and the same reference numbers are used here. Those elements will therefore not be described in detail here.
In the second embodiment, the transportation device 4 is arranged by means of rollers 7 to pass under the container 2 from the second end 12 back to the first end 11. To keep the transportation device 4 in a controlled position within the liquid, the transportation device may include guiding lines or devices, which either pulls the transportation device down into the liquid or pushes it from above.
In the second embodiment, the functions of the submerging device 6 and the carrier device 42 are achieved by means of a holding device 60B. The holding device 60B has a substantially T-shaped cross-section, comprising a base member 62B and a cross member 64B fastened to an upper end of the base member 62B. A lower end of the base member 62B is fastened to the transportation band 41.
It is now referred to fig. 4b. A wafer 5 is put on a sloping part of the transportation band 41 near a roller 7 on the first side 11. The wafer 5 will glide along the transportation band 41 in the direction shown by arrow B until a front end 13 of the wafer 5 meets the base member 62B of a first holding device 60B. As the transportation band 41 moves further, a second holding device 60B (as seen to the left in fig. 4b) will pass over the roller 7 and hold a rear end 14 of the wafer 5.
Consequently, the holding device 60B provides the function of the carrier device of the first embodiment since the wafer 5 is carried between two holding devices 60 B along with the transportation device 4. Moreover, the holding device 60B provides the function of the submerging device of the first embodiment since the wafer 5 is forced downwards into the liquid together with the transportation device 4 by means of the cross members 64B, thereby providing that the upper surface of the wafer S also is exposed to liquid.
Third embodiment The third embodiment of the device I according to the present invention will now be described with reference to fig. 3 and fig. 5. The third embodiment comprises many of same elements as in the first embodiment, and the same reference numbers are used here. Those elements will therefore not be described in detail here.
In the third embodiment the transportation device 4 is arranged by means of rollers 7 to pass over the container 2 from the second end 12 back to the first end 11 In the third embodiment, the functions of the submerging device 6 and the carrier device 42 are achieved by means of a holding device 60C. The holding device 60C has a cross section substantially formed as two T's placed on top of each other, oriented with a base member 62C pointing upwards and with its upper end fastened to the transportation band. The holding device 60C further comprises a first cross member 64C fastened to a lower end of the base member 62C and a second cross member 66C fastened to the central part of the base member 62C, as shown in fig. 5.
The wafer 5 is fastened to the holding device 60C in similar way as in the second embodiment, by utilizing a sloping part of the transportation band 41. The holding device 60C is holding the end of a wafer 5 between the first cross member 64C and the second cross member 60, as shown in fig. 5.
The holding device 60C provides the function of the carrier device of the first embodiment since the wafer 5 is carried between two holding devices 60C along with the transportation device 4. Moreover, the holding device 60C provides the function of the submerging device of the first embodiment since the wafer 5 is forced downwards into the liquid by means of the first and second cross members 64C, 66C, thereby providing that the upper surface of the wafer S is exposed to liquid.
One advantage with the third embodiment is that the transportation band 41 itself must not necessarily be submerged into the liquid, it is sufficient that the holding devices 60C are submerged together with the wafers.
Fourth embodiment The fourth embodiment of the device I according to the present invention will now be described with reference to fig. 6. The fourth embodiment comprises many of same elements as in the first embodiment, and the same reference numbers are used here. Those elements will therefore not be described in detail here.
In the fourth embodiment, the transportation device 4 is arranged in the same way as in the second embodiment; that is to pass under the container 2 from the second end 12 back tothe first end 11.
In the fourth embodiment, the functions of the submerging device 6 and the carrier device 42 are achieved by means of a holding device 60D. The holding device 60D comprises a tappet 62D protruding from transportation band 41 and a top belt 64D (indicated by a dashed line in fig. 6). The top belt 64D is perforated or alternatively consist only of multiple strings or lines, and is arranged in a loop over the container, such as in the third embodiment shown in fig. 3. The function of the top belt 64D may also be achieved by means of permanent bars mounted on fixtures above the bath or mounted to the bottom.
The wafer 5 is put on the transportation band 41 between two tappets 62D on the first side 1] of the device I. As the transportation band 41 moves, the top belt 64D will get closer to the transportation band 41 and during the transportation through the liquid, the tappets 62D will be engaged in the perforations of the top belt 64 D. Consequently, the holding device 60D provides the function of the carrier device of the first embodiment since the wafer 5 is carried between the two tappets 62D along with the transportation device 4. Moreover, the holding device 60D provides the function of the submerging device of the first embodiment since the wafer 5 is forced downwards into the liquid by means of the top belt 64D, thereby providing that the upper surface of the wafer 5 is exposed to liquid.
Fifth embodiment The fifth embodiment of the device I according to the present invention will now be described with reference to fig. 7. The fifth embodiment comprises many of same elements as in the first embodiment, and the same reference numbers are used here.
Those elements will therefore not be described in detail here.
In the fifth embodiment, the transportation device 4 is arranged in the same way as in the third embodiment; that is to pass over the container 2 from the second end 12 back to the first end 11.
In the fifth embodiment, the functions of the submerging device 6 and the carrier device 42 are achieved by means of a holding device 60E. The holding device 60E has a cross section substantially formed as a dove tail joint, where the end of the wafer 5 is received and held by a wedge-shaped opening 62E. The wedge shaped opening has preferably rounded edges. The wedge shaped opening is preferably spacious with regard to the wafer to avoid that the wafer is stuck in the opening.
Here, the transportation device 6 comprises two separate transportation bands 41, each of which is located on the respective side of the container 2 containing the liquid 3. Between the transportation bands 41 three and three holding devices 60E are arranged on a holding bar 64E. The holding bar 64E is in each end fixed to the transportation band 41 and moves together with the transportation band. In this way, three and three wafers 5 can be transported through the liquid in parallel.
The fifth embodiment further comprises a distance arrangement 70 for providing sufficient distance between the parallel wafers 5. The distance arrangement 70 comprises a distance bar 72 fastened between the transportation bands 41, having distance elements 74 adapted to receive a wafer 5 between the distance elements 74, thereby preventing the wafers from moving sideways (perpendicular to arrow A). In fig. 8 it is shown that the distance bar comprises six distance elements 74.
Moreover, there are one distance arrangement 70 on each side of each holding bar 64E (note that the rightmost distance arrangement 70 is omitted for clarity in fig. 7 and 8).
The holding device 60E provides the function of the carrier device of the first embodiment since the wafer 5 is carried between two holding devices 60E along fastened to the transportation device 4. Moreover, the holding device 60E provides the function of the submerging device of the first embodiment since the wafer 5 is forced downwards into the liquid by means of its dove-tail shape.
It should be noted that the holding devices 60E are perforated to allow the liquid to circulate around the wafer. The holding device 60E should ideally have a strong, polished surface (to avoid the wafers cutting into it) over a relatively soft material (to minimize impact on the wafers) inside the wedge shaped openings.
xth embodiment The sixth embodiment of the device 1 according to the present invention will now be described with reference to fig. 9. The sixth embodiment comprises many of same elements as in the above embodiments, and the same reference numbers are used here. Those elements will therefore not be described in detail here.
In the sixth embodiment, the transportation device 4 is arranged by means of rollers 7 to pass under the container 2 from the second end 12 back to the first end 11.
In the sixth embodiment, the functions of the submerging device 6 is achieved by means of a bar device 60F. The bar device 60F comprises a plurality of bars 62F located over the transportation band 41 and preferably below the surface of the liquid 3. The bar device 60F can also comprise guiding bars 64F provided above the surface of the liquid 3 near the first end II of the device 1, to guide the wafers along the transportation into the liquid, as shown in fig. 9. In this way, any floating of the wafers will be obstructed by the bar device 60F and it is ensured that the wafers are submerged into the liquid.
It should be noted that in fig. 9 the bars 62F and guiding bars 64F are located perpendicular to the transportation direction (arrow A), it would of course be possible to have the bar device 60F arranged in parallel to the transportation band 41. Moreover1 the bar device 60F can also be provides as a grating or similar arrangement -the important feature is to guide the wafers so that they are submerged in the liquid.
Aitrnatives The abovementioned detailed description is especially provided to illustrate and to describe preferred embodiments of the invention. However, the description is by no means limiting the invention to the specific embodiments. It should be noted that it would be possible to combine several features from the different embodiments above.
is For example, all the above described submerging devices and transportation devices can comprise perforations, meshes, channels or other openings for allowing the liquid to circulate around the wafer. Further, all the embodiments above may comprise guiding means to guide the wafers in the direction of arrow A through the liquid. The guiding means can be fastened to the transportation device or to the container.
It should be noted that the flexibility of thin wafers can be utilized to get a better grip on the wafer This is achieved by making the distance between the holding devices somewhat smaller than the length of the wafer, so that the wafer is transported in a bent state.
Moreover, it would be possible to insert the wafers 5 transversely into the holding device 60B, 60C, 64D instead of using a sloping transportation band 41 to lock the second end 14 of the wafer by means of the holding device 60B.
In fig. 10 it is shown that the transportation device 4 comprises wiping means 80 that is protruding downwards from the transportation band. The purpose of the wiping means 80 is to wipe or brush the bottom of the liquid container 2 so that broken wafers that have fallen off the transportation device can be pushed to one end of the container and thereafter be removed from the container in an easy way, without disturbing the operation. It should be noted that the wiping means can be used regardless of which side of the transportation device having the holding devices.
Very thin wafers may potentially break in a situation where the relative liquid fluid flow velocity below and above the wafer become different and a pressure difference arises across the wafer. Consequently, the transportation device and holding device can be designed and arranged in a way that provides a near symmetrical liquid flow pattern below and above the wafer. For example, can plates above and/or below the wafer or similar means be fixed to the container to control the relative fluid flow in the container as the transportation device and holding devices moves.

Claims (19)

1. Method for exposing a solar cell wafer to a liquid, comprising the following steps: a) placing the wafer on a transportation device; and b) transporting the wafer through the liquid by means of the transportation device that moves together with the wafer through the liquid.
2. Method according to claim 1, characterized in that the method further comprises the following step: c) submerging the wafer into the liquid.
3. Method according to claim 2, characterized in that step C) is performed by moving the wafer downwards into the liquid at an angle a exceeding 0,5 degrees in relation to the liquid surface.
4 Method according to claim 2, characterized in that step c) is performed by spraying a liquid onto the upper surface of the wafer.
5. Device for exposing a solar cell wafer to a liquid, comprising: -a container filled with the liquid; -a transportation device for transporting the wafer through the liquid; and -a carrier device for carrying the wafer together with the transportation device.
6. Device according to claim 5, characterized in that it further comprises a submerging device for ensuring that the wafer is submerged into the liquid.
7. Device according to claim 6, characterized in that the submerging device is a spraying device for spraying the liquid onto the upper surface of the wafer.
8. Device according to claim 5, characterized in that the submerging device and the carrier device are formed by a holding device for holding the wafer close to the transportation device.
9. Device according to claim 5, characterized in that the submerging device is a bar device for preventing the wafers from floating.
10. Device according to above claim 8, characterized in that the holding device has a substantially T-shaped cross section.
11. Device according to claim 8, characterized in that the holding device has a cross section substantially formed as two T's placed on top of each other.
12. Device according to claim 8 characterized in that the holding device comprises a tappet protruding from the transportation device and a second belt to be engaged with the tappets of the transportation device for enclosing the wafer through the transportation through the liquid.
13. Device according to claim 5, characterized in that the transportation device and/or holding device comprises perforations, meshes or other openings for allowing the liquid to circulate around the wafer and to ensure good mixing between the liquid above and below the wafers.
14 Device according to claim 8, characterized in that the holding device is fastened to the transportation device.
15. Device according to any of claim 5-14, characterized in that the transportation device comprises wiping means to push broken wafers to one end of the liquid container.
16. Device according to any of claim 5-15, characterized in that the holding device on the transportation device is shaped so that a strong bending of the movement direction of the transportation device can be used to automatically load and unload wafers from or to one or several transportation band(s), band(s) that preferably are moving the wafers at the same or a similar speed as the transportation device.
17. Device according to any of claim 5-17, characterized in that it comprises guiding means to prevent the wafers from sliding out of position sideways.
18. Device according to any of claim 5-18, characterized in that it comprises fluid control means to provide a near-symmetrical relative liquid flow above and below the wafer.
19. Device according to claim 5, characterized in that the holding device has a hard-wearing, polished surface towards the wafer while the material behind is softer such as foamed rubber etc. in order to provide a dampened touch for the wafer.
GB0709619A 2007-05-18 2007-05-18 A method for exposing a solar cell wafer to a liquid Withdrawn GB2449309A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB0709619A GB2449309A (en) 2007-05-18 2007-05-18 A method for exposing a solar cell wafer to a liquid
CN2008800164818A CN101689524B (en) 2007-05-18 2008-05-15 Device and method for exposing wafers to a liquid
DE112008001312T DE112008001312T5 (en) 2007-05-18 2008-05-15 Apparatus and method for exposing wafers to a liquid
PCT/NO2008/000170 WO2008143518A1 (en) 2007-05-18 2008-05-15 Device and method for exposing wafers to a liquid
KR1020097026527A KR20100022477A (en) 2007-05-18 2008-05-15 Device and method for exposing wafers to a liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0709619A GB2449309A (en) 2007-05-18 2007-05-18 A method for exposing a solar cell wafer to a liquid

Publications (2)

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GB0709619D0 GB0709619D0 (en) 2007-06-27
GB2449309A true GB2449309A (en) 2008-11-19

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GB0709619A Withdrawn GB2449309A (en) 2007-05-18 2007-05-18 A method for exposing a solar cell wafer to a liquid

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KR (1) KR20100022477A (en)
CN (1) CN101689524B (en)
DE (1) DE112008001312T5 (en)
GB (1) GB2449309A (en)
WO (1) WO2008143518A1 (en)

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Also Published As

Publication number Publication date
KR20100022477A (en) 2010-03-02
WO2008143518A1 (en) 2008-11-27
CN101689524B (en) 2011-09-28
GB0709619D0 (en) 2007-06-27
CN101689524A (en) 2010-03-31
DE112008001312T5 (en) 2010-04-22

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