CN101689524A - Device and method for exposing wafers to a liquid - Google Patents
Device and method for exposing wafers to a liquid Download PDFInfo
- Publication number
- CN101689524A CN101689524A CN200880016481A CN200880016481A CN101689524A CN 101689524 A CN101689524 A CN 101689524A CN 200880016481 A CN200880016481 A CN 200880016481A CN 200880016481 A CN200880016481 A CN 200880016481A CN 101689524 A CN101689524 A CN 101689524A
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- equipment
- wafer
- liquid
- maintenance
- conveyer belt
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- 239000007788 liquid Substances 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title abstract description 9
- 235000012431 wafers Nutrition 0.000 title description 106
- 238000012423 maintenance Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 238000013016 damping Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 229920001821 foam rubber Polymers 0.000 claims description 2
- 239000007779 soft material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 241000397426 Centroberyx lineatus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
- B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
- B65G49/0409—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length
- B65G49/0413—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance through the bath
- B65G49/0418—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance through the bath chain or belt conveyors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
- B65G15/30—Belts or like endless load-carriers
- B65G15/32—Belts or like endless load-carriers made of rubber or plastics
- B65G15/42—Belts or like endless load-carriers made of rubber or plastics having ribs, ridges, or other surface projections
- B65G15/44—Belts or like endless load-carriers made of rubber or plastics having ribs, ridges, or other surface projections for impelling the loads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
- B65G17/06—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface having a load-carrying surface formed by a series of interconnected, e.g. longitudinal, links, plates, or platforms
- B65G17/063—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface having a load-carrying surface formed by a series of interconnected, e.g. longitudinal, links, plates, or platforms the load carrying surface being formed by profiles, rods, bars, rollers or the like attached to more than one traction element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention relates to a method and device for exposing a solar cell wafer to a liquid. The device comprises a container filled with the liquid, a transportation device for transporting the wafer through the liquid and a carrier device for carrying the wafer together with the transportation device.
Description
Technical field
The present invention relates to a kind of equipment and method of making wafer place liquid cruelly of being used for.
Background technology
In the manufacture process of solar cell wafer, wafer need be placed different liquid cruelly, for example etching solution, rinsing liquid, utilize water to wait to clean.
Several known method and apparatus that are used for wafer is placed cruelly liquid are arranged.Now, use the very big basin that is filled with liquid in many technologies of solar cell wafer production, wafer is immersed in the liquid in described basin.Many liquid have short relatively useful life, make to regularly replace a large amount of liquid, and this does not meet the requirements on environment and economically.
In addition, tend to make thinner wafer, and therefore wafer also becomes more frangible.Thin wafer is also lighter, and has risk, that is: in fact the light wafer that has relatively large surface area will swim on the liquid, and therefore making only has a surface to place liquid cruelly.Since liquid exposure mean with the contacting of silicon wafer in formed gas, thereby because bubble gathers on wafer surface and impel it further to float, so problem is more serious.
The purpose of this invention is to provide a kind of equipment and method that is used for wafer is placed cruelly liquid, wherein the amount of the liquid in the basin can reduce, and has therefore reduced the total flow of liquid.In addition, the purpose of this invention is to provide the thinner wafer of a kind of handled to avoid broken equipment and method.In addition, all to place liquid cruelly be very important on two surfaces of guaranteeing wafer.At last, the objective of the invention is to remove the wafer that breaks and not interrupt operation.
Summary of the invention
The present invention relates to a kind of device that is used for solar cell wafer is placed cruelly liquid, comprising:
Container, this vessel filling has liquid;
Conveying equipment, this conveying equipment is used for wafer transport is passed liquid; And
Maintenance equipment, this maintenance equipment are used for carrying with wafer and with wafer with conveying equipment and are immersed in liquid, wherein should have the cross section of T shape basically by maintenance equipment.
In one aspect of the invention, maintenance equipment has the cross section that roughly forms two T shapes that are right after each other.
In one aspect of the invention, conveying equipment and/or maintenance equipment comprise and are used to allow liquid around wafer cycles and guarantee good eyelet, mesh or other opening that mixes of liquid of wafer above and below.
In one aspect of the invention, maintenance equipment is fastened to conveying equipment.
In one aspect of the invention, conveying equipment comprises that the wafer that will break is pushed to the wiping arrangement of an end of liquid container.
In one aspect of the invention, maintenance equipment is on conveying equipment, it forms and makes the rapid bending of moving direction of conveying equipment automatically wafer is loaded on one or more conveyer belt or from one or more conveyer belt to unload, and conveyer belt is preferably to move wafer with the same or analogous speed of conveying equipment.Like this, can avoid adopting traditional pick-and-place automation, so that reduce cost of investment and wafer breakage.
In one aspect of the invention, this equipment comprises the guiding device that prevents that wafer from laterad skidding off from the position.
In one aspect of the invention, this equipment comprises fluid control device, and the relative flow of liquid of near symmetrical is provided with the above and below at wafer.
In one aspect of the invention, maintenance equipment has the hard wear-resisting polished surface towards wafer, and the material of back is more soft material, for example foam rubber etc., so that provide the vibration damping contact for wafer.
Description of drawings
Describe embodiments of the invention in detail hereinafter with reference to accompanying drawing, wherein:
Fig. 1 illustrates the first embodiment of the present invention;
Fig. 2 illustrates the second embodiment of the present invention;
Fig. 3 illustrates the third embodiment of the present invention;
Fig. 4 a and 4b illustrate the details of the load bearing equipment among Fig. 2;
Fig. 5 illustrates the details of the load bearing equipment among Fig. 3;
Fig. 6 illustrates the details of the load bearing equipment of the fourth embodiment of the present invention;
Fig. 7 illustrates the fifth embodiment of the present invention;
Fig. 8 is the enlarged drawing of some details among Fig. 7;
Fig. 9 illustrates the sixth embodiment of the present invention; And
Figure 10 illustrates the conveying equipment with wiping arrangement.
Embodiment
First embodiment
First embodiment of equipment 1 of the present invention is described now with reference to Fig. 1.Equipment 1 comprises the container 2 that is filled with liquid 3.Container 2 is shallow, to reduce the amount of employed liquid 3.
Equipment 1 also comprises and is used for the conveying equipment 4 that transfer wafers 5 is passed liquid.Conveying equipment 4 comprises the conveyer belt 41 with load bearing equipment 42, and load bearing equipment is set to carry the wafer 5 between load bearing equipment 42 to pass liquid with conveyer belt.Conveying equipment 4 also comprises (not shown) such as the backing roll that is used to support and drive conveyer belt 41 and passes liquid, drive unit.
Conveyer belt 41 first side 11 of slave unit 1 on the direction of arrow A that is immersed in shown in Fig. 1 in the liquid moves to second side 12.Wafer 5 is placed on first side 11 of conveyer belt 41, for example carries from the conveyer belt (not shown) of front and comes, and remove from second side 12 of conveyer belt 41, for example is transported to (not shown) on next bar conveyer belt.Show wafer and be transported in the liquid with angle [alpha], with respect to liquid surface, this angle [alpha] exceeds 0.5 degree.Like this, guaranteed that the front end of wafer inserted in the wafer before the rear end, and therefore, wafer can overcome surface tension, and not have to destroy the active force of wafer.
Should be noted that, the band that conveyer belt 41 is preferably continuous, this will make further detailed description thereof in other embodiments of the invention.
First embodiment 1 also comprises the submergence equipment 6 that is used for guaranteeing wafer is immersed into liquid, and therefore feasible both sides with wafer all place liquid cruelly.Submergence equipment 6 comprises spray appliance 60A, and this spray appliance has and is used at conveyer belt 41 near 11 places, first side nozzle 61 to the wafer spraying liquid when being immersed into liquid.
By spraying to wafer 5, reduced the surface tension of liquid level, increased the weight above the wafer, and avoided wafer to swim on the liquid surface, and therefore, guaranteed that two surfaces of wafer place liquid cruelly.
Second embodiment
Second embodiment of equipment 1 of the present invention is described now with reference to Fig. 2, Fig. 4 a and Fig. 4 b.Second embodiment comprises many and the first embodiment components identical, and uses identical Reference numeral herein.Therefore, will can not describe those elements in detail herein.
In a second embodiment, arrange conveying equipment 4, thereby turn back to first end 11 from second end 12 by the following of container 2 by roller 7.For conveying equipment 4 being remained in the controlled location of liquid internal, conveying equipment can comprise guide line or guiding device, and it is pulled into conveying equipment downwards in the liquid or from top promotion conveying equipment.
In a second embodiment, realize the function of submergence equipment 6 and load bearing equipment 42, maintenance equipment promptly is set is used for the conveying equipment transfer wafers and is used for wafer is immersed into liquid by keeping equipment 60B.Maintenance equipment 60B has the roughly cross section of T shape, and comprises base component 62B and the cross member 64B that is fixed on the upper end of base component 62B.The lower end of base component 62B is fixed to conveyer belt 41.
Referring now to Fig. 4 b.Wafer 5 is placed on the sloping portion near the roller 7 on first side 11 of conveyer belt 41.Wafer 5 will slide at the direction upper edge conveyer belt shown in the arrow B 41, till the front end 13 of wafer 5 runs into the base component 62B of the first maintenance equipment 60B.When conveyer belt 41 was moved further, second kept equipment 60B to pass through (as the left side the 4b with the aid of pictures) from the top of roller 7, and keeps the rear end 14 of wafer 5.
Therefore, keep equipment 60B that the function of the load bearing equipment of first embodiment is provided, this is because keep transporting wafer 5 together in company with conveying equipment 4 between the equipment 60B at two.In addition, keep equipment 60B that the function of the submergence equipment of first embodiment is provided, this is because wafer 5 is pushed down in the liquid together with conveying equipment 4 by cross member 64B, therefore makes the end face of wafer 5 also place liquid cruelly.
The 3rd embodiment
The 3rd embodiment of equipment 1 of the present invention is described now with reference to Fig. 3 and Fig. 5.The 3rd embodiment comprises many and the first embodiment components identical, and uses identical Reference numeral herein.Therefore, will can not describe those elements in detail herein.
In the 3rd embodiment, arrange conveying equipment 4 by means of roller 7, to turn back to first end 11 from second end 12 by the top of container 2.
In the 3rd embodiment, realize the function of submergence equipment 6 and load bearing equipment 42 by keeping equipment 60C, that is: maintenance equipment is set is used for the conveying equipment transfer wafers and is used for wafer is immersed into liquid.Maintenance equipment 60C has that to basically form be two T shape cross sections that are right after each other, and is fixed to the upper end orientation of conveyer belt with the base component 62C that is directed upwards towards and its.Maintenance equipment 60C also comprises the first cross member 64C and the second cross member 66C that is fixed to the core of base component 62C of the lower end that is fixed to base component 62C, as shown in Figure 5.
According to second embodiment in similar mode, utilize the sloping portion of conveyer belt 41 that wafer 5 is fixed on the maintenance equipment 60C.Maintenance equipment 60C remains on the end of wafer 5 between the first cross member 64C and second cross member 60, as shown in Figure 5.
The advantage of the 3rd embodiment is that conveyer belt 41 itself needn't be immersed in the liquid, keeps equipment 60C and wafer to be submerged just enough together.
The 4th embodiment
The 4th embodiment of equipment 1 of the present invention is described now with reference to Fig. 6.The 4th embodiment comprises many and the first embodiment components identical, and uses identical Reference numeral herein.Therefore, will can not describe those elements in detail herein.
In the 4th embodiment, arrange conveying equipment 4 according to the method identical with second embodiment; That is to say, turn back to first end 11 from second end 12 by the following of container 2.
In the 4th embodiment, realize the function of submergence equipment 6 and load bearing equipment 42 by keeping equipment 60D, that is: maintenance equipment is set is used for the conveying equipment transfer wafers and is used for wafer is immersed into liquid.Maintenance equipment 60D comprises tappet (tappet) 62D and the heading tape 64D (representing by the dotted line Fig. 6) that gives prominence to from conveyer belt 41.Such as the same in the 3rd embodiment shown in Figure 3, heading tape 64D bores a hole, and perhaps alternately only is made up of many ropes or line, and arranges by circular pattern on container.The function of heading tape 64D can also realize by means of the durable bar that is installed on the bathtub upper fixed thing or be installed on the bottom.
Wafer is placed on the conveyer belt 41 between two tappet 62D on first side 11 of equipment 1.When conveyer belt 41 moved, heading tape 64D will be near conveyer belt 41, and when carrying by liquid, tappet 62D will be bonded in the eyelet of heading tape 64D.
Therefore, keep equipment 60D that the function of the load bearing equipment of first embodiment is provided, this be because between two tappet 62D with conveying equipment 4 transfer wafers 5.In addition, keep equipment 60D that the function of the submergence equipment of first embodiment is provided, this is because by heading tape 64D wafer 5 is pushed down in the liquid, therefore makes the end face of wafer 5 also place liquid cruelly.
The 5th embodiment
The 5th embodiment of equipment 1 of the present invention is described now with reference to Fig. 7.The 5th embodiment comprises many and the first embodiment components identical, and uses identical Reference numeral herein.Therefore, will can not describe those elements in detail herein.
In the 5th embodiment, arrange conveying equipment 4 by the method identical with the 3rd embodiment; That is to say, turn back to first end 11 from second end 12 by the top of container 2.
In the 5th embodiment, realize the function of submergence equipment 6 and load bearing equipment 42 by keeping equipment 60E, that is: maintenance equipment is set is used for the conveying equipment transfer wafers and is used for wafer is immersed into liquid.Maintenance equipment 60E has the cross section that is substantially shaped as dovetail joint, and wherein the end of wafer 5 holds and remains among the opening 62E of wedge shape.Described open wedge preferably has rounded edges.Preferably, open wedge is spacious for wafer, in order to avoid wafer is stuck in the opening.
At this moment, conveying equipment 6 comprises two independent conveyer belts 41, and each conveyer belt is positioned on the respective side of the container 2 that accommodates liquid 3.Between conveyer belt 41, keeping being furnished with three maintenance equipment 60E on the bar 64E.Keeping bar 64E to be fixed in each end on the conveyer belt 41 and with conveyer belt moves.Like this, can carry three wafers 5 to pass liquid abreast.
The 5th embodiment also comprises the escapement 70 that is used for providing sufficient distance between parallel wafer 5.Escapement 70 comprises the distance bar 72 that is fixed between the conveyer belt 41, and this distance bar has spacer element 74, and it is suitable for receiving wafer 5 between described spacer element 74, thereby prevents that wafer from moving to the side (perpendicular to arrow A).Distance bar shown in Fig. 8 comprises six spacer elements 74.In addition, an escapement 70 (note, for clarity, omitted rightmost escapement 70 in Fig. 7 and 8) is all arranged on each side of each maintenance bar 64E.
Should be noted that, keep equipment 60E to bore a hole, to allow liquid around wafer cycles.Maintenance equipment 60E should have firm polished surface (being cut in the maintenance equipment to avoid wafer) in theory on the soft relatively material (to reduce the impact to wafer) in open wedge inside.
The 6th embodiment
The 6th embodiment of equipment 1 of the present invention is described now with reference to Fig. 9.The 6th embodiment comprises many and the foregoing description components identical, and uses identical Reference numeral herein.Therefore, will can not describe those elements in detail herein.
In the 6th embodiment, by means of roller 7 conveying equipment 4 is set, to turn back to first end 11 from second end 12 by the following of container 2.
In the 6th embodiment, realize the function of submergence equipment 6 by bar apparatus 60F.Bar apparatus 60F comprises many bar 62F of the lower face that is positioned at conveyer belt 41 tops and is preferably placed at liquid 3.Bar apparatus 60F also can be included in the lip-deep guide rod 64F that is arranged on liquid 3 near first end, 11 places of equipment 1, along throughput direction wafer is imported in the liquid, as shown in Figure 9.Like this, can stop any floating of wafer by bar apparatus 60F, and guarantee that wafer is immersed in the liquid.
Should be noted that in Fig. 9, bar 62F and guide rod 64F are provided with perpendicular to throughput direction (arrow A), certain bar apparatus 60F can be parallel to conveyer belt 41 and be provided with.In addition, bar apparatus 60F can also be set to grid or similar arrangements structure---and key character is to guide wafer so that wafer is immersed in the liquid.
Replacement scheme
Provide above-mentioned detailed description to illustrate and describe the preferred embodiments of the present invention especially.Yet described explanation never makes the present invention be limited to certain embodiments.Should be noted that, can be in conjunction with several characteristic from above different embodiment.
In the above-described embodiments, clearly, keep each wafer individually by maintenance equipment.In addition, during passing the liquid conveying, wafer is remained on the horizontal level.
For example, above-mentioned all submergence equipment and conveying equipment can comprise and be used to the eyelet, mesh, passage or other opening that allow liquid to center on wafer cycles.In addition, above-mentioned all embodiment can comprise guiding device, pass liquid with guiding wafer on the direction of arrow A.Guiding device can be fixed to conveying equipment or be fixed to container.
Should be noted that, can utilize the flexibility of LED reverse mounting type to come on wafer, to obtain better to clamp.This is to realize by form the interval that is slightly less than wafer length between maintenance equipment, so that wafer is carried with case of bending.
In addition, can wafer 5 is laterally inserted in maintenance equipment 60B, 60C, 64D, and do not use second end 14 of the conveyer belt 41 of inclination by maintenance equipment 60B locking wafer.
Conveying equipment shown in Figure 10 4 comprises from the outstanding downwards wiping arrangement 80 of conveyer belt.The purposes of wiping arrangement 80 is bottoms of wiping or brushing liquid container 2, so that can with from breaking of dropping of conveying equipment wafer shift an end of container onto, and the wafer that will break in an easy manner takes out from container afterwards, and can interrupt operation.Should be noted that,, can use wiping arrangement no matter which side of conveying equipment has maintenance equipment.
Extremely thin wafer may be below wafer and above the relative velocity of liquid dissimilate and stride across in the situation that the pressure reduction of wafer increases and break.Therefore, can by below the wafer and above provide the flow of liquid of near symmetrical to distribute mode design and arrange conveying equipment and maintenance equipment.For example, can with wafer top and/or below or similarly the plate on the device be fixed on the container, to move the relative mobile of liquid in the time control container made at conveying equipment and maintenance equipment.
Claims (9)
1. be used for solar cell wafer is placed cruelly the equipment of liquid, comprise:
Container, described vessel filling has liquid;
Conveying equipment, described conveying equipment is used for wafer transport is passed liquid; And
Maintenance equipment, described maintenance equipment are used for transporting wafer and wafer being immersed in liquid with described conveying equipment, and wherein said maintenance equipment has the cross section of T shape basically.
2. equipment according to claim 1 is characterized in that, described maintenance equipment has the cross section that is substantially shaped as two T shapes that are right after each other.
3. according to each described equipment among the claim 1-2, it is characterized in that described conveying equipment and/or maintenance equipment comprise and is used to allow liquid around wafer cycles and guarantee good eyelet, mesh or other opening that mixes of liquid of wafer above and below.
4. according to each described equipment among the claim 1-3, it is characterized in that described maintenance equipment is fastened to described conveying equipment.
5. according to each described equipment among the claim 1-4, it is characterized in that described conveying equipment comprises that the wafer that will break is pushed to the wiping arrangement of an end of described liquid container.
6. equipment according to claim 4, it is characterized in that, described maintenance equipment is on described conveying equipment, it forms and makes the rapid bending energy of moving direction of described conveying equipment be enough in automatically wafer to be loaded on one or more conveyer belt or above one or more conveyer belt to unload, and described conveyer belt is preferably to move wafer with the same or analogous speed of described conveying equipment.
7. according to each described equipment among the claim 1-6, it is characterized in that described equipment comprises guiding device, from the position, laterad skid off to prevent wafer.
8. according to each described equipment among the claim 1-7, it is characterized in that described equipment comprises fluid control device, the relative flow of liquid of near symmetrical is provided with the above and below at wafer.
9. according to each described equipment among the claim 1-8, it is characterized in that, described maintenance equipment has the hard wear-resisting polished surface towards wafer, and the material of back is than soft material, for example foam rubber etc., so that the contact of vibration damping is provided for wafer.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US93871007P | 2007-05-18 | 2007-05-18 | |
| GB0709619.1 | 2007-05-18 | ||
| GB0709619A GB2449309A (en) | 2007-05-18 | 2007-05-18 | A method for exposing a solar cell wafer to a liquid |
| US60/938,710 | 2007-05-18 | ||
| PCT/NO2008/000170 WO2008143518A1 (en) | 2007-05-18 | 2008-05-15 | Device and method for exposing wafers to a liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101689524A true CN101689524A (en) | 2010-03-31 |
| CN101689524B CN101689524B (en) | 2011-09-28 |
Family
ID=38234724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800164818A Expired - Fee Related CN101689524B (en) | 2007-05-18 | 2008-05-15 | Device and method for exposing wafers to a liquid |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR20100022477A (en) |
| CN (1) | CN101689524B (en) |
| DE (1) | DE112008001312T5 (en) |
| GB (1) | GB2449309A (en) |
| WO (1) | WO2008143518A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104221138A (en) * | 2012-01-26 | 2014-12-17 | 新格拉斯光伏有限公司 | Apparatus and method for treating plate-shaped craft items |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2009123450A1 (en) * | 2008-04-01 | 2009-10-08 | Stichting Energieonderzoek Centrum Nederland | Arrangement and method for etching silicon wafer |
| GB2459124A (en) * | 2008-04-10 | 2009-10-14 | Rec Solar As | Wafer holder for electroplating apparatus |
| DE102008034505B4 (en) * | 2008-07-24 | 2013-04-18 | Stangl Semiconductor Equipment Ag | Devices and methods for processing and handling process material |
| DE102011050324A1 (en) * | 2011-05-12 | 2012-11-29 | Roth & Rau Ag | Substrate transport module, loading and unloading system and transport method for substrates in a substrate processing plant |
| DE102012209902A1 (en) | 2012-06-13 | 2013-12-19 | Singulus Stangl Solar Gmbh | Method for treating silicon rods with e.g. water during manufacturing polycrystalline silicon ingots in process reactor, involves transporting semiconductor rods by endless chains, and treating semiconductor rods with liquid or gas |
| CN102807064A (en) * | 2012-09-04 | 2012-12-05 | 昆山市圣吉川工业自动化设备有限公司 | Conveying belt with steel bar |
| FR3049940B1 (en) * | 2016-04-06 | 2018-04-13 | Saint- Gobain Glass France | SUPPORT DEVICE FOR GLASS SHEET IN PARTICULAR IN A WASHING PLANT |
| FR3049943B1 (en) * | 2016-04-06 | 2020-08-28 | Saint Gobain | DEVICE FOR CONVEYING AND HOLDING SHEETS OF GLASS, IN PARTICULAR IN A WASHING INSTALLATION, AND PROCESS FOR IMPLEMENTATION |
| CA2968115A1 (en) * | 2017-05-24 | 2018-11-24 | Steven Kelley | Spiral conveyor system for immersing items in a liquid |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4635788A (en) * | 1984-07-12 | 1987-01-13 | Cincinnati Milacron Inc. | Conveyor |
| JPS6342131A (en) * | 1986-08-08 | 1988-02-23 | Nec Corp | Treating device for semiconductor wafer |
| JP3200876B2 (en) * | 1991-07-12 | 2001-08-20 | セイコーエプソン株式会社 | Circuit board cleaning method and cleaning apparatus |
| JPH08115862A (en) * | 1994-10-13 | 1996-05-07 | Hitachi Ltd | Developing device |
| AU772539B2 (en) * | 1999-07-29 | 2004-04-29 | Kaneka Corporation | Method for cleaning photovoltaic module and cleaning apparatus |
| JP2001170583A (en) * | 1999-12-15 | 2001-06-26 | Kanegafuchi Chem Ind Co Ltd | Ultrasonic washing apparatus and ultrasonic washing method |
| JP4046492B2 (en) * | 2000-10-23 | 2008-02-13 | シャープ株式会社 | Solar cell manufacturing equipment |
| JP2002203800A (en) * | 2000-10-30 | 2002-07-19 | Canon Inc | Wafer cassette, device using the same and liquid phase growth method |
| JP2004210440A (en) * | 2002-12-27 | 2004-07-29 | Ishikawajima Harima Heavy Ind Co Ltd | Carrying device for platy member |
| DE20321702U1 (en) * | 2003-05-07 | 2008-12-24 | Universität Konstanz | Device for texturing surfaces of silicon wafers |
-
2007
- 2007-05-18 GB GB0709619A patent/GB2449309A/en not_active Withdrawn
-
2008
- 2008-05-15 CN CN2008800164818A patent/CN101689524B/en not_active Expired - Fee Related
- 2008-05-15 KR KR1020097026527A patent/KR20100022477A/en not_active Application Discontinuation
- 2008-05-15 WO PCT/NO2008/000170 patent/WO2008143518A1/en active Application Filing
- 2008-05-15 DE DE112008001312T patent/DE112008001312T5/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104221138A (en) * | 2012-01-26 | 2014-12-17 | 新格拉斯光伏有限公司 | Apparatus and method for treating plate-shaped craft items |
| CN104221138B (en) * | 2012-01-26 | 2016-09-07 | 新格拉斯光伏有限公司 | For processing the device and method of en plaque technique article |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101689524B (en) | 2011-09-28 |
| GB2449309A (en) | 2008-11-19 |
| WO2008143518A1 (en) | 2008-11-27 |
| KR20100022477A (en) | 2010-03-02 |
| DE112008001312T5 (en) | 2010-04-22 |
| GB0709619D0 (en) | 2007-06-27 |
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