GB2296604A - Electric device - Google Patents

Electric device Download PDF

Info

Publication number
GB2296604A
GB2296604A GB9526253A GB9526253A GB2296604A GB 2296604 A GB2296604 A GB 2296604A GB 9526253 A GB9526253 A GB 9526253A GB 9526253 A GB9526253 A GB 9526253A GB 2296604 A GB2296604 A GB 2296604A
Authority
GB
United Kingdom
Prior art keywords
circuit boards
electric device
heat
housing parts
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9526253A
Other languages
English (en)
Other versions
GB9526253D0 (en
Inventor
Markus Harsch
Karl Schupp
Peter Jares
Dieter Karr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB9526253D0 publication Critical patent/GB9526253D0/en
Publication of GB2296604A publication Critical patent/GB2296604A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Control Of Electric Motors In General (AREA)
GB9526253A 1994-12-24 1995-12-21 Electric device Withdrawn GB2296604A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4446594A DE4446594A1 (de) 1994-12-24 1994-12-24 Elektrisches Gerät

Publications (2)

Publication Number Publication Date
GB9526253D0 GB9526253D0 (en) 1996-02-21
GB2296604A true GB2296604A (en) 1996-07-03

Family

ID=6537118

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9526253A Withdrawn GB2296604A (en) 1994-12-24 1995-12-21 Electric device

Country Status (5)

Country Link
JP (1) JPH08236893A (enEXAMPLES)
KR (1) KR960028747A (enEXAMPLES)
DE (1) DE4446594A1 (enEXAMPLES)
GB (1) GB2296604A (enEXAMPLES)
IT (2) IT1282804B1 (enEXAMPLES)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2152053A3 (en) * 2008-08-07 2010-11-03 Arcadyan Technology Corp. Fixing heat dissipating unit and electronic device having fixing heat dissipating unit
EP1672464A3 (en) * 2004-12-15 2010-12-15 NEC Corporation Mobile terminal device and method for radiating heat therefrom

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
DE29819349U1 (de) * 1998-10-30 1999-12-09 Siemens AG, 80333 München Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung
KR100441568B1 (ko) * 2001-11-16 2004-07-23 한스타 디스플레이 코퍼레이션 열소산 구조물
EP2180774B1 (en) * 2008-10-21 2013-08-07 Moxa Inc. Heat-dissipating structure for expansion board architecture
JP5161192B2 (ja) * 2009-11-06 2013-03-13 三菱電機株式会社 パワー回路配線構造
JP5652453B2 (ja) 2012-09-28 2015-01-14 株式会社村田製作所 複合モジュールおよびこれを備えた電子機器
JP5765357B2 (ja) * 2013-03-22 2015-08-19 カシオ計算機株式会社 回路基板構造、及び電子機器
JP7072387B2 (ja) * 2018-01-11 2022-05-20 長野日本無線株式会社 基板連結装置及び基板連結方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1081526A (en) * 1965-05-17 1967-08-31 Standard Telephones Cables Ltd Housing assembly for circuit boards
GB1604368A (en) * 1978-05-31 1981-12-09 Ard Tech Ass Eng Printed circuit board support system
GB2137422A (en) * 1983-03-30 1984-10-03 Ferranti Plc Printed circuit board
GB2192758A (en) * 1986-07-18 1988-01-20 Anamartic Ltd Package for wafer scale integrated circuits

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1081526A (en) * 1965-05-17 1967-08-31 Standard Telephones Cables Ltd Housing assembly for circuit boards
GB1604368A (en) * 1978-05-31 1981-12-09 Ard Tech Ass Eng Printed circuit board support system
GB2137422A (en) * 1983-03-30 1984-10-03 Ferranti Plc Printed circuit board
GB2192758A (en) * 1986-07-18 1988-01-20 Anamartic Ltd Package for wafer scale integrated circuits

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1672464A3 (en) * 2004-12-15 2010-12-15 NEC Corporation Mobile terminal device and method for radiating heat therefrom
US7903422B2 (en) 2004-12-15 2011-03-08 Nec Corporation Mobile terminal device and method for radiating heat therefrom
EP2365414A1 (en) * 2004-12-15 2011-09-14 NEC Corporation Mobile terminal device and method for radiating heat therefrom
EP2365415A1 (en) * 2004-12-15 2011-09-14 NEC Corporation Mobile terminal device and method for radiating heat therefrom
EP2152053A3 (en) * 2008-08-07 2010-11-03 Arcadyan Technology Corp. Fixing heat dissipating unit and electronic device having fixing heat dissipating unit

Also Published As

Publication number Publication date
ITMI950829U3 (it) 1997-06-02
ITMI950829V0 (it) 1995-12-01
KR960028747A (ko) 1996-07-22
JPH08236893A (ja) 1996-09-13
IT1282804B1 (it) 1998-03-31
ITMI952531A3 (it) 1996-06-24
ITMI952531A1 (it) 1997-06-01
GB9526253D0 (en) 1996-02-21
ITMI952531A0 (enEXAMPLES) 1995-12-01
DE4446594A1 (de) 1996-06-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)