GB1081526A - Housing assembly for circuit boards - Google Patents
Housing assembly for circuit boardsInfo
- Publication number
- GB1081526A GB1081526A GB2068965A GB2068965A GB1081526A GB 1081526 A GB1081526 A GB 1081526A GB 2068965 A GB2068965 A GB 2068965A GB 2068965 A GB2068965 A GB 2068965A GB 1081526 A GB1081526 A GB 1081526A
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit boards
- corrugations
- board
- plates
- side members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1424—Card cages
Abstract
1,081,526. Component assemblies. STANDARD TELEPHONES & CABLES Ltd. May 13, 1966 [May 17, 1965], No. 20689/65. Heading H1R. In a housing for circuit boards 8, such as printed circuit boards, having components 10 mounted thereon, two corrugated Al side members 4 shaped to provide cooling fins 22 are located in spaced parallel planes between Al end plates 1. Each board 8 is attached to a plate 9 of good heat-conducting metal and is inserted between opposite corrugations in side members 4; when oversize components 11 are carried on a board 8, the next adjacent corrugations receive a metal spacing frame 12. When the board assembly is complete, nuts 15 on tie rods 13 are tightened to compress the corrugations against the plates 9. This arrangement is mounted between lower and upper trays (5, 16, Fig. 2, not shown), being bolted thereto by vertical tie-rods 6. In a modification (Fig. 3, not shown), the heat conducting plates overlap the circuit boards, the overlap portions being received in the corrugations.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2068965A GB1081526A (en) | 1965-05-17 | 1965-05-17 | Housing assembly for circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2068965A GB1081526A (en) | 1965-05-17 | 1965-05-17 | Housing assembly for circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1081526A true GB1081526A (en) | 1967-08-31 |
Family
ID=10150048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2068965A Expired GB1081526A (en) | 1965-05-17 | 1965-05-17 | Housing assembly for circuit boards |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1081526A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2514601A1 (en) * | 1981-10-13 | 1983-04-15 | Socapex | Thermal contacts to dissipate printed circuit board component heat - has water-cooled, base-plate heat-sink metal heat drain layers adjacent to components |
EP0090714A1 (en) * | 1982-03-26 | 1983-10-05 | Socapex | System for electrical connection and heat evacuation by conduction for electronic components |
EP0091847A1 (en) * | 1982-03-26 | 1983-10-19 | Socapex | Connector for a substrate, and electrical connection and convection cooling system utilizing such a connector |
EP0270844A1 (en) * | 1986-11-18 | 1988-06-15 | Siemens Aktiengesellschaft | Casing, especially a drawing assembly for housing circuit boards |
GB2296604A (en) * | 1994-12-24 | 1996-07-03 | Bosch Gmbh Robert | Electric device |
-
1965
- 1965-05-17 GB GB2068965A patent/GB1081526A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2514601A1 (en) * | 1981-10-13 | 1983-04-15 | Socapex | Thermal contacts to dissipate printed circuit board component heat - has water-cooled, base-plate heat-sink metal heat drain layers adjacent to components |
EP0090714A1 (en) * | 1982-03-26 | 1983-10-05 | Socapex | System for electrical connection and heat evacuation by conduction for electronic components |
EP0091847A1 (en) * | 1982-03-26 | 1983-10-19 | Socapex | Connector for a substrate, and electrical connection and convection cooling system utilizing such a connector |
EP0270844A1 (en) * | 1986-11-18 | 1988-06-15 | Siemens Aktiengesellschaft | Casing, especially a drawing assembly for housing circuit boards |
GB2296604A (en) * | 1994-12-24 | 1996-07-03 | Bosch Gmbh Robert | Electric device |
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