GB1457809A - Composite printed circuit board fas - Google Patents

Composite printed circuit board fas

Info

Publication number
GB1457809A
GB1457809A GB1338174A GB1338174A GB1457809A GB 1457809 A GB1457809 A GB 1457809A GB 1338174 A GB1338174 A GB 1338174A GB 1338174 A GB1338174 A GB 1338174A GB 1457809 A GB1457809 A GB 1457809A
Authority
GB
United Kingdom
Prior art keywords
board
metal
insulant
upset
adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1338174A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1457809A publication Critical patent/GB1457809A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1457809 Printed circuit component assemblies RCA CORPORATION 26 March 1974 [28 March 1973] 13381/74 Heading H1R A printed circuit comprises an insulant board 2 of e.g. fibreglass-epoxy to which is laminated and riveted a sheet metal e.g. sheet or aluminium board 6 having a laminar portion 8 and periphery 10 upturned into mounting flange 24 with an opening 12 therein exposing an area 14 of the insulant board. The latter is perforated at 6 for the lead wires of e.g. resistors, capacitors, transistors or transformers and at 8 to receive sockets of plug in modules or circuit boards. The underside 20 has a network of printed conductors 22 to which the leads are soldered, and metallized ground plane and screen areas 23. The upper side may have conductors 25 interconnecting the holes 16 and may be insulatedly located on metal board 6. The latter is also upset into a metal screen 26 adjacent the opening 12, and may have standoffs 28 mounting e.g. power transistors for cooling. Openings 30 surround perforations 16 to prevent shortcircuiting of the leads. Other standoffs 32 for heat generating units may be formed adjacent the edges of the metal board for heat generating components with an adjacent upset shield 34. In a modification (Figs. 4, 5 not shown) the metal board may cover a laterally disposed portion of the insulant board with upset shield flanges also serving to mount heat generating components on brackets. Lead openings may be provided and slots e.g. for canned electrolytic capacitors may be provided in the insulant board. A rectangular opening through the superimposed insulant and metal boards may have adjacent upset metal flanges to mount and ventilate high dissipation resistors. A modified mount for heat dissipating components comprises (Fig. 6 not shown) a Z shaped upset of the metal board, the horizontal leg of which supports a resistor with leads extending downwardly to engage apertures of the insulant board.
GB1338174A 1973-03-28 1974-03-26 Composite printed circuit board fas Expired GB1457809A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34566773A 1973-03-28 1973-03-28

Publications (1)

Publication Number Publication Date
GB1457809A true GB1457809A (en) 1976-12-08

Family

ID=23355976

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1338174A Expired GB1457809A (en) 1973-03-28 1974-03-26 Composite printed circuit board fas

Country Status (9)

Country Link
JP (1) JPS49129159A (en)
BR (1) BR7402329D0 (en)
CA (1) CA991315A (en)
DE (1) DE2413826A1 (en)
FR (1) FR2223933B1 (en)
GB (1) GB1457809A (en)
IT (1) IT1008331B (en)
NL (1) NL7404139A (en)
SE (1) SE393021B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2165399A (en) * 1984-10-09 1986-04-09 Alps Electric Co Ltd Printed circuit substrate support structures
DE3726170A1 (en) * 1986-08-07 1988-02-18 Sharp Kk ELECTRONIC DEVICE WITH FLEXIBLE CIRCUIT CARD
WO2001087033A2 (en) * 2000-05-09 2001-11-15 Sony Computer Entertainment Inc. Electronic device
WO2001093324A2 (en) * 2000-05-30 2001-12-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Substrate adapted to accommodate a circuit configuration and method for producing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT348018B (en) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich CARRIER PLATE
WO1993006705A1 (en) * 1991-09-21 1993-04-01 Robert Bosch Gmbh Electrical device, especially switching and control device for motor vehicles
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2165399A (en) * 1984-10-09 1986-04-09 Alps Electric Co Ltd Printed circuit substrate support structures
DE3726170A1 (en) * 1986-08-07 1988-02-18 Sharp Kk ELECTRONIC DEVICE WITH FLEXIBLE CIRCUIT CARD
US4901193A (en) * 1986-08-07 1990-02-13 Sharp Kabushiki Kaisha Construction of fitting flexible board within electronic apparatus
WO2001087033A2 (en) * 2000-05-09 2001-11-15 Sony Computer Entertainment Inc. Electronic device
WO2001087033A3 (en) * 2000-05-09 2002-06-27 Sony Computer Entertainment Inc Electronic device
AU768926B2 (en) * 2000-05-09 2004-01-08 Sony Computer Entertainment Inc. Electronic device
WO2001093324A2 (en) * 2000-05-30 2001-12-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Substrate adapted to accommodate a circuit configuration and method for producing the same
WO2001093324A3 (en) * 2000-05-30 2002-04-04 Eupec Gmbh & Co Kg Substrate adapted to accommodate a circuit configuration and method for producing the same
US6858807B2 (en) 2000-05-30 2005-02-22 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh Substrate for receiving a circuit configuration and method for producing the substrate

Also Published As

Publication number Publication date
FR2223933B1 (en) 1979-07-27
IT1008331B (en) 1976-11-10
CA991315A (en) 1976-06-15
BR7402329D0 (en) 1974-11-19
AU6718574A (en) 1975-10-02
DE2413826A1 (en) 1974-10-10
SE393021B (en) 1977-04-25
FR2223933A1 (en) 1974-10-25
JPS49129159A (en) 1974-12-11
NL7404139A (en) 1974-10-01

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee