FR2223933A1 - - Google Patents

Info

Publication number
FR2223933A1
FR2223933A1 FR7410103A FR7410103A FR2223933A1 FR 2223933 A1 FR2223933 A1 FR 2223933A1 FR 7410103 A FR7410103 A FR 7410103A FR 7410103 A FR7410103 A FR 7410103A FR 2223933 A1 FR2223933 A1 FR 2223933A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7410103A
Other languages
French (fr)
Other versions
FR2223933B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2223933A1 publication Critical patent/FR2223933A1/fr
Application granted granted Critical
Publication of FR2223933B1 publication Critical patent/FR2223933B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
FR7410103A 1973-03-28 1974-03-25 Expired FR2223933B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34566773A 1973-03-28 1973-03-28

Publications (2)

Publication Number Publication Date
FR2223933A1 true FR2223933A1 (en) 1974-10-25
FR2223933B1 FR2223933B1 (en) 1979-07-27

Family

ID=23355976

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7410103A Expired FR2223933B1 (en) 1973-03-28 1974-03-25

Country Status (9)

Country Link
JP (1) JPS49129159A (en)
BR (1) BR7402329D0 (en)
CA (1) CA991315A (en)
DE (1) DE2413826A1 (en)
FR (1) FR2223933B1 (en)
GB (1) GB1457809A (en)
IT (1) IT1008331B (en)
NL (1) NL7404139A (en)
SE (1) SE393021B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2308276A1 (en) * 1975-04-16 1976-11-12 Siemens Ag SUPPORT PLATE FOR MOUNTING HIGH FREQUENCY COMPONENTS, ESPECIALLY FOR WIDE BAND AMPLIFIERS
WO1993006705A1 (en) * 1991-09-21 1993-04-01 Robert Bosch Gmbh Electrical device, especially switching and control device for motor vehicles
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412714Y2 (en) * 1984-10-09 1992-03-26
JPH041750Y2 (en) * 1986-08-07 1992-01-21
JP3315969B2 (en) * 2000-05-09 2002-08-19 株式会社ソニー・コンピュータエンタテインメント Electronics
DE10026743C1 (en) * 2000-05-30 2002-01-03 Eupec Gmbh & Co Kg Substrate for receiving a circuit arrangement

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2308276A1 (en) * 1975-04-16 1976-11-12 Siemens Ag SUPPORT PLATE FOR MOUNTING HIGH FREQUENCY COMPONENTS, ESPECIALLY FOR WIDE BAND AMPLIFIERS
WO1993006705A1 (en) * 1991-09-21 1993-04-01 Robert Bosch Gmbh Electrical device, especially switching and control device for motor vehicles
US6222732B1 (en) 1991-09-21 2001-04-24 Robert Bosch Gmbh Electrical device, in particular a switching and control unit for motor vehicles
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking

Also Published As

Publication number Publication date
IT1008331B (en) 1976-11-10
FR2223933B1 (en) 1979-07-27
BR7402329D0 (en) 1974-11-19
CA991315A (en) 1976-06-15
AU6718574A (en) 1975-10-02
GB1457809A (en) 1976-12-08
DE2413826A1 (en) 1974-10-10
NL7404139A (en) 1974-10-01
SE393021B (en) 1977-04-25
JPS49129159A (en) 1974-12-11

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Legal Events

Date Code Title Description
ST Notification of lapse