SE393021B - PRINTED COMPOSITE CIRCUIT CARD - Google Patents

PRINTED COMPOSITE CIRCUIT CARD

Info

Publication number
SE393021B
SE393021B SE7404048A SE7404048A SE393021B SE 393021 B SE393021 B SE 393021B SE 7404048 A SE7404048 A SE 7404048A SE 7404048 A SE7404048 A SE 7404048A SE 393021 B SE393021 B SE 393021B
Authority
SE
Sweden
Prior art keywords
circuit card
composite circuit
printed composite
printed
card
Prior art date
Application number
SE7404048A
Other languages
Swedish (sv)
Inventor
L P Thomas
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of SE393021B publication Critical patent/SE393021B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
SE7404048A 1973-03-28 1974-03-26 PRINTED COMPOSITE CIRCUIT CARD SE393021B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34566773A 1973-03-28 1973-03-28

Publications (1)

Publication Number Publication Date
SE393021B true SE393021B (en) 1977-04-25

Family

ID=23355976

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7404048A SE393021B (en) 1973-03-28 1974-03-26 PRINTED COMPOSITE CIRCUIT CARD

Country Status (9)

Country Link
JP (1) JPS49129159A (en)
BR (1) BR7402329D0 (en)
CA (1) CA991315A (en)
DE (1) DE2413826A1 (en)
FR (1) FR2223933B1 (en)
GB (1) GB1457809A (en)
IT (1) IT1008331B (en)
NL (1) NL7404139A (en)
SE (1) SE393021B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT348018B (en) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich CARRIER PLATE
JPH0412714Y2 (en) * 1984-10-09 1992-03-26
JPH041750Y2 (en) * 1986-08-07 1992-01-21
JPH06503210A (en) 1991-09-21 1994-04-07 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical devices, especially switching and control devices for vehicles
JP3315969B2 (en) * 2000-05-09 2002-08-19 株式会社ソニー・コンピュータエンタテインメント Electronics
DE10026743C1 (en) * 2000-05-30 2002-01-03 Eupec Gmbh & Co Kg Substrate for receiving a circuit arrangement
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking

Also Published As

Publication number Publication date
IT1008331B (en) 1976-11-10
FR2223933B1 (en) 1979-07-27
BR7402329D0 (en) 1974-11-19
CA991315A (en) 1976-06-15
AU6718574A (en) 1975-10-02
GB1457809A (en) 1976-12-08
FR2223933A1 (en) 1974-10-25
DE2413826A1 (en) 1974-10-10
NL7404139A (en) 1974-10-01
JPS49129159A (en) 1974-12-11

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