GB1142382A - Housing assembly for circuit boards - Google Patents

Abstract

1,142,382. Electrical assemblies. STANDARD TELEPHONES & CABLES Ltd. 17 June, 1966, No. 27095/66. Heading H1R. A mounting assembly for circuit boards includes a plurality of distinct frames and an adjustable clamp adapted to urge together the frames, the circuit boards being inserted between pairs of adjacent frames. As shown in the plan view of Fig. 1, a plurality of open aluminium frames 1 are mounted on tie rods 2 and mounting plates 12 carrying circuit boards 13 are inserted in the channels between the recessed ledge 14 of one frame and the rear 15 of the adjacent frame. After the plates have been inserted the nuts 9 are tightened so that the whole assembly is clamped together. Accurate location between frames is ensured by spigots 5 and matching recesses 6 and fins 4 for cooling are provided. Components 18, 19 are mounted on the circuit boards or plates as shown and if the components are large the adjacent frame 21 functions as a spacer. The circuit boards are provided with printed tabs of conductive material along one edge thereof, Fig. 6 (not shown) which co-operate with a number of spring contacts in an insulating connector unit, Figs. 4, 5 (not shown), mounted in a recess in a mounting plate 12, which units are also provided with protruding contacts. A triple bank assembly may be provided by in effect connecting three frames in series to form a unitary structure, Figs. 7, 8 (not shown). Fig. 9 shows a different form of frame for a single bank assembly, conductive tabs on a circuit board fitting into a clip 44. The circuit board is held between the ledge 48 on the front of one frame and the rear surface 49 of the next frame. The frame may be composed of two unconnected parts, Fig. 10 (not shown), on which a circuit board sits and to which is connected a detachable connector unit. Other forms of rectangular frames, open and closed are illustrated in Figs. 11, 12, 13 (not shown), for a single bank and Figs. 14, 15 (not shown), for multiple banks of boards. The circuit boards may be multilayer with interconnection of the components by means of plates through holes. By suitable dimensioning of the frames boards of differing thicknesses may be accommodated, Fig. 22 (not shown). The assembly may itself be mounted on a board, Fig. 23 (not shown).