GB1312404A - Modular electronic system - Google Patents
Modular electronic systemInfo
- Publication number
- GB1312404A GB1312404A GB3392471A GB3392471A GB1312404A GB 1312404 A GB1312404 A GB 1312404A GB 3392471 A GB3392471 A GB 3392471A GB 3392471 A GB3392471 A GB 3392471A GB 1312404 A GB1312404 A GB 1312404A
- Authority
- GB
- United Kingdom
- Prior art keywords
- units
- apertures
- boards
- duct
- cooling medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002826 coolant Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
1312404 Mounting electrical equipment SINGER CO 20 July 1971 [22 Oct 1970] 33924/71 Heading H1R A modular electronic system comprises stacked electronic units 11, a front mounting plate 13, and a rear mounting plate 18. Each unit 11 has a hollow metal frame 20, e.g. of aluminium, having apertures 27, 28 and slots 29a, 29b, 32a, 32b connecting the apertures with the hollow interior. A heat conductive structural member 31 may also be provided. When stacked, the units form ducts 66, 67, 68 by virtue of apertures 28, the hollow frame interiors, and apertures 27 respectively. A cooling medium, supplied through orifice 14, flows through duct 66 and then in parallel through the ducts 67. During its passage through each duct 67 the cooling medium removes heat generated by the electronic circuits via metallic sheets 41, 35. The sheets, preferably of copper, are bonded to the metal frames by adhesive 44. Circuit boards 33, 39 are in turn bonded to the metallic sheets via electrical insulating means 37, 42 respectively, heat generated by the circuitry passing via means 37, 42 to the metallic sheets. The cooling medium exits via duct 68 and orifice 69. Units 11 each have male contacts mounted on border member 25, the contacts engaging with female contacts mounted on an interconnection board at the base of the system housing (Figs. 2-4, not shown). The male contacts have a width, perpendicular to the component carrying surfaces of boards 33, 39, considerably in excess of their thickness. The co-operating female contacts are tight fitting with respect to thickness but loose fitting with respect to width to allow movement of the units between the front and rear plates 13, 18 and to take up any dimensional inaccuracies. In some instances two separate interconnecting boards (50), (52), (Fig. 3, not shown), may be used, the boards being electrically connected by means of a flexible wiring tape (53) passing through a dummy unit (54). The units and the front and rear mounting plates are held together by arms (19), (Fig. 1, not shown), hinged to rear plate 18, the arms engaging upper notches 21 of the metal frames, the lower notches 21 engaging lower guide rods.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8287370A | 1970-10-22 | 1970-10-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1312404A true GB1312404A (en) | 1973-04-04 |
Family
ID=22173994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3392471A Expired GB1312404A (en) | 1970-10-22 | 1971-07-20 | Modular electronic system |
Country Status (9)
Country | Link |
---|---|
US (1) | US3648113A (en) |
JP (1) | JPS526462B1 (en) |
CA (1) | CA923213A (en) |
DE (1) | DE2152541C3 (en) |
FR (1) | FR2109696A5 (en) |
GB (1) | GB1312404A (en) |
IL (1) | IL37186A (en) |
IT (1) | IT938913B (en) |
SE (1) | SE369573B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2441315A1 (en) * | 1978-11-11 | 1980-06-06 | Ferranti Ltd | ASSEMBLY OF ELECTRICAL CIRCUITS |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6508824A (en) * | 1964-07-08 | 1966-01-10 | ||
DE2062666A1 (en) * | 1970-12-19 | 1972-07-06 | Bbc Brown Boveri & Cie | Power converter system constructed from building blocks |
FR2157094A5 (en) * | 1971-10-18 | 1973-06-01 | Thomson Csf | |
JPS4994507A (en) * | 1973-01-17 | 1974-09-07 | ||
DE2335735A1 (en) * | 1973-07-13 | 1975-01-30 | Forster Electronic Gmbh | TEXT EDITING DEVICE FOR REMOTE CONTROLLED TYPINGWRITERS |
US3956673A (en) * | 1974-02-14 | 1976-05-11 | Lockheed Aircraft Corporation | Printed circuit modules cooled by rack with forced air |
US3904933A (en) * | 1974-10-23 | 1975-09-09 | Control Data Corp | Cooling apparatus for electronic modules |
US4006388A (en) * | 1975-03-03 | 1977-02-01 | Hughes Aircraft Company | Thermally controlled electronic system package |
DE2536957C2 (en) * | 1975-08-20 | 1983-05-11 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Electronic component |
US4122508A (en) * | 1977-09-06 | 1978-10-24 | Altec Corporation | Modular printed circuit board assembly having cooling means incorporated therein |
US4135225A (en) * | 1977-09-19 | 1979-01-16 | Welsh James W | Pivotal structural enclosure |
US4186422A (en) * | 1978-08-01 | 1980-01-29 | The Singer Company | Modular electronic system with cooling means and stackable electronic circuit unit therefor |
US4283754A (en) * | 1979-03-26 | 1981-08-11 | Bunker Ramo Corporation | Cooling system for multiwafer high density circuit |
US4503483A (en) * | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
DE3536963A1 (en) * | 1985-10-17 | 1987-04-23 | Diehl Gmbh & Co | ASSEMBLY ARRANGEMENT |
FR2651636B1 (en) * | 1989-09-06 | 1996-08-02 | Segem | MODULAR ELECTRONIC CONTAINER WITH INCORPORATED VENTILATION. |
US5014904A (en) * | 1990-01-16 | 1991-05-14 | Cray Research, Inc. | Board-mounted thermal path connector and cold plate |
US5099254A (en) * | 1990-03-22 | 1992-03-24 | Raytheon Company | Modular transmitter and antenna array system |
US5159529A (en) * | 1991-05-15 | 1992-10-27 | International Business Machines Corporation | Composite liquid cooled plate for electronic equipment |
US5274530A (en) * | 1992-05-29 | 1993-12-28 | Anderson William B | Module for protecting and cooling computer chip die mounted on a thin film substrate and a chassis for conduction cooling of such modules |
US5343359A (en) * | 1992-11-19 | 1994-08-30 | Cray Research, Inc. | Apparatus for cooling daughter boards |
JP2658805B2 (en) * | 1993-06-30 | 1997-09-30 | 日本電気株式会社 | Electromagnetic shield housing |
US5767443A (en) * | 1993-07-10 | 1998-06-16 | Micron Technology, Inc. | Multi-die encapsulation device |
US5482109A (en) * | 1994-03-15 | 1996-01-09 | E-Systems, Inc. | Modular heat exchanger |
US5473508A (en) * | 1994-05-31 | 1995-12-05 | At&T Global Information Solutions Company | Focused CPU air cooling system including high efficiency heat exchanger |
DE19514545A1 (en) * | 1995-04-20 | 1996-10-24 | Daimler Benz Ag | Micro-cooling device for multiple microelectronic components |
SE9502498D0 (en) * | 1995-07-07 | 1995-07-07 | Volvo Penta Ab | Cooling or heat-sensitive components |
US5726857A (en) * | 1996-02-22 | 1998-03-10 | Cray Research, Inc. | Apparatus and method for mounting edge connectors within a circuit module |
US5740018A (en) * | 1996-02-29 | 1998-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Environmentally controlled circuit pack and cabinet |
US5761035A (en) * | 1996-06-28 | 1998-06-02 | Motorola, Inc. | Circuit board apparatus and method for spray-cooling a circuit board |
US6252302B1 (en) | 1996-09-19 | 2001-06-26 | Warren M. Farnworth | Heat transfer material for an improved die edge contacting socket |
US5886872A (en) * | 1997-04-23 | 1999-03-23 | Compaq Computer Corporation | Pivotable support and heat sink apparatus removably connectable without tools to a computer processor |
US6169247B1 (en) * | 1998-06-11 | 2001-01-02 | Lucent Technologies Inc. | Enclosure for electronic components |
US6297960B1 (en) * | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
EP0992430A3 (en) | 1998-10-07 | 2000-09-13 | Negesat Di Boer Fabrizio & C. SNC | Housing providing cooling for equipment aboard aircraft or spacecraft |
US7019244B2 (en) * | 2002-04-20 | 2006-03-28 | Hewlett-Packard Development Company, L.P. | Electrostatic precipitator |
FR2845821B1 (en) * | 2002-10-11 | 2005-12-02 | Thales Sa | ELECTRONIC SUBSTRATE OF A THREE-DIMENSIONAL ELECTRONIC MODULE HAVING A HIGH THERMAL DISSIPATION POWER AND ELECTRONIC MODULE |
DE202004006552U1 (en) * | 2004-04-26 | 2004-07-08 | Knürr AG | Cooling system for device and network cabinets |
ATE393475T1 (en) * | 2004-11-24 | 2008-05-15 | Danfoss Silicon Power Gmbh | FLOW DISTRIBUTION MODULE AND STACK OF FLOW DISTRIBUTION MODULES |
US8274792B2 (en) | 2005-09-06 | 2012-09-25 | Beyond Blades Ltd. | 3-dimensional multi-layered modular computer architecture |
US7671801B2 (en) * | 2005-09-19 | 2010-03-02 | Raytheon Company | Armor for an electronically scanned array |
US7324336B2 (en) * | 2005-09-27 | 2008-01-29 | Lockheed Martin Corporation | Flow through cooling assemblies for conduction-cooled circuit modules |
US7365974B2 (en) * | 2005-10-14 | 2008-04-29 | Smiths Aerospace Llc | Method for electronics equipment cooling having improved EMI control and reduced weight |
US7365976B2 (en) * | 2006-03-24 | 2008-04-29 | Fujitsu Limited | Electronic apparatus |
FR2905556B1 (en) * | 2006-08-30 | 2009-06-26 | Thales Sa | ELECTRONIC BAY ASSOCIATING NATURAL CONVECTION AND FORCE AIR CIRCULATION FOR ITS COOLING |
US7995346B2 (en) * | 2008-03-06 | 2011-08-09 | Northrop Grumman Systems Corporation | Ruggedized, self aligning, sliding air seal for removable electronic units |
FR2934906B1 (en) * | 2008-08-05 | 2010-09-03 | Thales Sa | ON-BOARD CALCULATOR EQUIPPED WITH AN AUTONOMOUS AERAULIC COOLING DEVICE |
US8279597B2 (en) | 2010-05-27 | 2012-10-02 | International Business Machines Corporation | Heatsink allowing in-situ maintenance in a stackable module |
US8174826B2 (en) | 2010-05-27 | 2012-05-08 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
US8358503B2 (en) | 2010-05-28 | 2013-01-22 | International Business Machines Corporation | Stackable module for energy-efficient computing systems |
US8179674B2 (en) | 2010-05-28 | 2012-05-15 | International Business Machines Corporation | Scalable space-optimized and energy-efficient computing system |
US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
US20120170224A1 (en) * | 2010-12-29 | 2012-07-05 | Src, Inc. | Circuit board frame with integral heat sink for enhanced thermal transfer |
US11421921B2 (en) | 2012-09-07 | 2022-08-23 | David Lane Smith | Cooling electronic devices installed in a subsurface environment |
WO2014039212A1 (en) | 2012-09-07 | 2014-03-13 | David Smith | Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment |
TWI507772B (en) | 2013-06-26 | 2015-11-11 | E Ink Holdings Inc | Electronic apparatus |
US9826640B2 (en) | 2013-06-26 | 2017-11-21 | E Ink Holdings Inc. | Electronic apparatus |
US9426931B2 (en) | 2014-02-07 | 2016-08-23 | Lockheed Martin Corporation | Fluid-flow-through cooling of circuit boards |
US9357670B2 (en) | 2014-02-18 | 2016-05-31 | Lockheed Martin Corporation | Efficient heat transfer from conduction-cooled circuit cards |
US11191186B2 (en) | 2014-06-24 | 2021-11-30 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
US9699939B2 (en) | 2014-06-24 | 2017-07-04 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
US11744041B2 (en) | 2014-06-24 | 2023-08-29 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
US9408332B2 (en) | 2014-06-24 | 2016-08-02 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
US9258926B2 (en) | 2014-06-24 | 2016-02-09 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
US9560789B2 (en) | 2014-06-24 | 2017-01-31 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
US10017073B2 (en) | 2016-03-09 | 2018-07-10 | Ford Global Technologies, Llc | Coolant channels for power module assemblies |
US9950628B2 (en) * | 2016-03-09 | 2018-04-24 | Ford Global Technologies, Llc | Power-module assembly with dummy module |
US9961808B2 (en) | 2016-03-09 | 2018-05-01 | Ford Global Technologies, Llc | Power electronics system |
US11502349B2 (en) | 2020-08-31 | 2022-11-15 | Borgwarner, Inc. | Cooling manifold assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3124720A (en) * | 1964-03-10 | Modular electronic assemblies with cooling means | ||
US2942856A (en) * | 1959-01-13 | 1960-06-28 | Kenneth E Woodward | Fluid-cooled electrical module assembly |
US3395318A (en) * | 1967-02-13 | 1968-07-30 | Gen Precision Inc | Circuit board card arrangement for the interconnection of electronic components |
-
1970
- 1970-10-22 US US3648113D patent/US3648113A/en not_active Expired - Lifetime
-
1971
- 1971-06-29 IL IL3718671A patent/IL37186A/en unknown
- 1971-07-02 CA CA117273A patent/CA923213A/en not_active Expired
- 1971-07-20 GB GB3392471A patent/GB1312404A/en not_active Expired
- 1971-08-16 FR FR7129820A patent/FR2109696A5/fr not_active Expired
- 1971-08-19 JP JP6265171A patent/JPS526462B1/ja active Pending
- 1971-10-01 IT IT2939471A patent/IT938913B/en active
- 1971-10-21 SE SE1338071A patent/SE369573B/xx unknown
- 1971-10-21 DE DE2152541A patent/DE2152541C3/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2441315A1 (en) * | 1978-11-11 | 1980-06-06 | Ferranti Ltd | ASSEMBLY OF ELECTRICAL CIRCUITS |
Also Published As
Publication number | Publication date |
---|---|
US3648113A (en) | 1972-03-07 |
JPS526462B1 (en) | 1977-02-22 |
SE369573B (en) | 1974-09-02 |
FR2109696A5 (en) | 1972-05-26 |
DE2152541B2 (en) | 1974-03-07 |
IL37186A0 (en) | 1971-08-25 |
IT938913B (en) | 1973-02-10 |
DE2152541C3 (en) | 1974-09-26 |
JPS477969A (en) | 1972-04-27 |
IL37186A (en) | 1974-01-14 |
DE2152541A1 (en) | 1972-08-31 |
CA923213A (en) | 1973-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PE20 | Patent expired after termination of 20 years |