JPS526462B1 - - Google Patents

Info

Publication number
JPS526462B1
JPS526462B1 JP6265171A JP6265171A JPS526462B1 JP S526462 B1 JPS526462 B1 JP S526462B1 JP 6265171 A JP6265171 A JP 6265171A JP 6265171 A JP6265171 A JP 6265171A JP S526462 B1 JPS526462 B1 JP S526462B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6265171A
Other versions
JPS477969A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS477969A publication Critical patent/JPS477969A/ja
Publication of JPS526462B1 publication Critical patent/JPS526462B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP6265171A 1970-10-22 1971-08-19 Pending JPS526462B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8287370A 1970-10-22 1970-10-22

Publications (2)

Publication Number Publication Date
JPS477969A JPS477969A (ja) 1972-04-27
JPS526462B1 true JPS526462B1 (ja) 1977-02-22

Family

ID=22173994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6265171A Pending JPS526462B1 (ja) 1970-10-22 1971-08-19

Country Status (9)

Country Link
US (1) US3648113A (ja)
JP (1) JPS526462B1 (ja)
CA (1) CA923213A (ja)
DE (1) DE2152541C3 (ja)
FR (1) FR2109696A5 (ja)
GB (1) GB1312404A (ja)
IL (1) IL37186A (ja)
IT (1) IT938913B (ja)
SE (1) SE369573B (ja)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6508824A (ja) * 1964-07-08 1966-01-10
DE2062666A1 (de) * 1970-12-19 1972-07-06 Bbc Brown Boveri & Cie Aus Bausteinen aufgebaute Stromrichteranlage
FR2157094A5 (ja) * 1971-10-18 1973-06-01 Thomson Csf
JPS4994507A (ja) * 1973-01-17 1974-09-07
DE2335735A1 (de) * 1973-07-13 1975-01-30 Forster Electronic Gmbh Textbearbeitungsgeraet fuer fernsteuerbare schreibmaschinen
US3956673A (en) * 1974-02-14 1976-05-11 Lockheed Aircraft Corporation Printed circuit modules cooled by rack with forced air
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
DE2536957C2 (de) * 1975-08-20 1983-05-11 Philips Patentverwaltung Gmbh, 2000 Hamburg Elektronisches Bauelement
US4122508A (en) * 1977-09-06 1978-10-24 Altec Corporation Modular printed circuit board assembly having cooling means incorporated therein
US4135225A (en) * 1977-09-19 1979-01-16 Welsh James W Pivotal structural enclosure
US4186422A (en) * 1978-08-01 1980-01-29 The Singer Company Modular electronic system with cooling means and stackable electronic circuit unit therefor
GB2033668B (en) * 1978-11-11 1983-01-06 Ferranti Ltd Circuit assemblies
US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
FR2651636B1 (fr) * 1989-09-06 1996-08-02 Segem Bac electronique modulaire a ventilation incorporee.
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
US5099254A (en) * 1990-03-22 1992-03-24 Raytheon Company Modular transmitter and antenna array system
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5274530A (en) * 1992-05-29 1993-12-28 Anderson William B Module for protecting and cooling computer chip die mounted on a thin film substrate and a chassis for conduction cooling of such modules
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
JP2658805B2 (ja) * 1993-06-30 1997-09-30 日本電気株式会社 電磁シールド用筐体
US5767443A (en) * 1993-07-10 1998-06-16 Micron Technology, Inc. Multi-die encapsulation device
US5482109A (en) * 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
US5473508A (en) * 1994-05-31 1995-12-05 At&T Global Information Solutions Company Focused CPU air cooling system including high efficiency heat exchanger
DE19514545A1 (de) * 1995-04-20 1996-10-24 Daimler Benz Ag Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen
SE9502498D0 (sv) * 1995-07-07 1995-07-07 Volvo Penta Ab Cooling of heat-sensitive components
US5726857A (en) * 1996-02-22 1998-03-10 Cray Research, Inc. Apparatus and method for mounting edge connectors within a circuit module
US5740018A (en) * 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
US5761035A (en) * 1996-06-28 1998-06-02 Motorola, Inc. Circuit board apparatus and method for spray-cooling a circuit board
US6252302B1 (en) 1996-09-19 2001-06-26 Warren M. Farnworth Heat transfer material for an improved die edge contacting socket
US5886872A (en) * 1997-04-23 1999-03-23 Compaq Computer Corporation Pivotable support and heat sink apparatus removably connectable without tools to a computer processor
US6169247B1 (en) * 1998-06-11 2001-01-02 Lucent Technologies Inc. Enclosure for electronic components
US6297960B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
EP0992430A3 (en) 1998-10-07 2000-09-13 Negesat Di Boer Fabrizio & C. SNC Housing providing cooling for equipment aboard aircraft or spacecraft
US7019244B2 (en) * 2002-04-20 2006-03-28 Hewlett-Packard Development Company, L.P. Electrostatic precipitator
FR2845821B1 (fr) * 2002-10-11 2005-12-02 Thales Sa Substrat electronique d'un module electronique a trois dimensions a fort pouvoir de dissipation thermique et module electronique
DE202004006552U1 (de) * 2004-04-26 2004-07-08 Knürr AG Kühlungssystem für Geräte- und Netzwerkschränke
US7835151B2 (en) * 2004-11-24 2010-11-16 Danfoss Silicon Power Gmbh Flow distribution module and a stack of flow distribution modules
KR20080067328A (ko) 2005-09-06 2008-07-18 비욘드 블라데스 리미티드 3ｄｍｃ 아키텍처
US7671801B2 (en) * 2005-09-19 2010-03-02 Raytheon Company Armor for an electronically scanned array
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
US7365974B2 (en) * 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
US7365976B2 (en) * 2006-03-24 2008-04-29 Fujitsu Limited Electronic apparatus
FR2905556B1 (fr) * 2006-08-30 2009-06-26 Thales Sa Baie electronique associant convection naturelle et circulation d'air force pour son refroidissement
US7995346B2 (en) * 2008-03-06 2011-08-09 Northrop Grumman Systems Corporation Ruggedized, self aligning, sliding air seal for removable electronic units
FR2934906B1 (fr) * 2008-08-05 2010-09-03 Thales Sa Calculateur embarque equipe d'un dispositif de refroidissement aeraulique autonome
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8174826B2 (en) * 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US8427828B2 (en) * 2010-07-20 2013-04-23 Themis Computer Printed circuit board module enclosure and apparatus using same
US20120170224A1 (en) * 2010-12-29 2012-07-05 Src, Inc. Circuit board frame with integral heat sink for enhanced thermal transfer
US11421921B2 (en) 2012-09-07 2022-08-23 David Lane Smith Cooling electronic devices installed in a subsurface environment
EP2893270A4 (en) 2012-09-07 2016-10-05 David Smith DEVICE AND METHOD FOR THE GEOTHERMAL COOLING OF ELECTRONIC DEVICES INSTALLED IN A SUB-ENVIRONMENTAL ENVIRONMENT
US9826640B2 (en) 2013-06-26 2017-11-21 E Ink Holdings Inc. Electronic apparatus
TWI507772B (zh) 2013-06-26 2015-11-11 E Ink Holdings Inc 電子裝置
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9357670B2 (en) 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
US9560789B2 (en) 2014-06-24 2017-01-31 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US11191186B2 (en) 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US11744041B2 (en) 2014-06-24 2023-08-29 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US9258926B2 (en) 2014-06-24 2016-02-09 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9408332B2 (en) 2014-06-24 2016-08-02 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9699939B2 (en) 2014-06-24 2017-07-04 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9961808B2 (en) 2016-03-09 2018-05-01 Ford Global Technologies, Llc Power electronics system
US9950628B2 (en) * 2016-03-09 2018-04-24 Ford Global Technologies, Llc Power-module assembly with dummy module
US10017073B2 (en) 2016-03-09 2018-07-10 Ford Global Technologies, Llc Coolant channels for power module assemblies
US11502349B2 (en) 2020-08-31 2022-11-15 Borgwarner, Inc. Cooling manifold assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3124720A (en) * 1964-03-10 Modular electronic assemblies with cooling means
US2942856A (en) * 1959-01-13 1960-06-28 Kenneth E Woodward Fluid-cooled electrical module assembly
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components

Also Published As

Publication number Publication date
IL37186A (en) 1974-01-14
US3648113A (en) 1972-03-07
DE2152541A1 (de) 1972-08-31
GB1312404A (en) 1973-04-04
DE2152541B2 (de) 1974-03-07
CA923213A (en) 1973-03-20
IL37186A0 (en) 1971-08-25
IT938913B (it) 1973-02-10
DE2152541C3 (de) 1974-09-26
FR2109696A5 (ja) 1972-05-26
JPS477969A (ja) 1972-04-27
SE369573B (ja) 1974-09-02

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