DE2152541A1 - Modular electronic system - Google Patents

Modular electronic system

Info

Publication number
DE2152541A1
DE2152541A1 DE19712152541 DE2152541A DE2152541A1 DE 2152541 A1 DE2152541 A1 DE 2152541A1 DE 19712152541 DE19712152541 DE 19712152541 DE 2152541 A DE2152541 A DE 2152541A DE 2152541 A1 DE2152541 A1 DE 2152541A1
Authority
DE
Germany
Prior art keywords
electronic system
modular electronic
modular
system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19712152541
Other languages
German (de)
Other versions
DE2152541C3 (en
DE2152541B2 (en
Inventor
J Fred Rathjen
Lothar Laermer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singer Co
Original Assignee
Singer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US8287370A priority Critical
Application filed by Singer Co filed Critical Singer Co
Publication of DE2152541A1 publication Critical patent/DE2152541A1/en
Publication of DE2152541B2 publication Critical patent/DE2152541B2/de
Application granted granted Critical
Publication of DE2152541C3 publication Critical patent/DE2152541C3/de
Application status is Expired legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardized dimensions, e.g. 19-inch electronic racks
    • H05K7/20554Forced ventilation of a gaseous coolant
    • H05K7/20563Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
DE19712152541 1970-10-22 1971-10-21 Expired DE2152541C3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US8287370A true 1970-10-22 1970-10-22

Publications (3)

Publication Number Publication Date
DE2152541A1 true DE2152541A1 (en) 1972-08-31
DE2152541B2 DE2152541B2 (en) 1974-03-07
DE2152541C3 DE2152541C3 (en) 1974-09-26

Family

ID=22173994

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712152541 Expired DE2152541C3 (en) 1970-10-22 1971-10-21

Country Status (9)

Country Link
US (1) US3648113A (en)
JP (1) JPS526462B1 (en)
CA (1) CA923213A (en)
DE (1) DE2152541C3 (en)
FR (1) FR2109696A5 (en)
GB (1) GB1312404A (en)
IL (1) IL37186A (en)
IT (1) IT938913B (en)
SE (1) SE369573B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2945149A1 (en) * 1978-11-11 1980-05-29 Ferranti Ltd circuitry
DE3536963A1 (en) * 1985-10-17 1987-04-23 Diehl Gmbh & Co assembly arrangement
WO2005104642A1 (en) * 2004-04-26 2005-11-03 Knürr AG Cooling system for equipment and wiring cabinets and method for cooling equipment and wiring cabinets

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6508824A (en) * 1964-07-08 1966-01-10
DE2062666C3 (en) * 1970-12-19 1975-12-04 Brown, Boveri & Cie Ag, 6800 Mannheim
FR2157094A5 (en) * 1971-10-18 1973-06-01 Thomson Csf
DE2335735A1 (en) * 1973-07-13 1975-01-30 Forster Electronic Gmbh typewriters Textbearbeitungsgeraet for remote-controlled
US3956673A (en) * 1974-02-14 1976-05-11 Lockheed Aircraft Corporation Printed circuit modules cooled by rack with forced air
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
DE2536957C2 (en) * 1975-08-20 1983-05-11 Philips Patentverwaltung Gmbh, 2000 Hamburg, De
US4122508B1 (en) * 1977-09-06 1983-01-25
US4135225A (en) * 1977-09-19 1979-01-16 Welsh James W Pivotal structural enclosure
US4186422A (en) * 1978-08-01 1980-01-29 The Singer Company Modular electronic system with cooling means and stackable electronic circuit unit therefor
US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
FR2651636B1 (en) * 1989-09-06 1996-08-02 Segem Modular electronics Bac INCORPORATED ventilation.
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
US5099254A (en) * 1990-03-22 1992-03-24 Raytheon Company Modular transmitter and antenna array system
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5274530A (en) * 1992-05-29 1993-12-28 Anderson William B Module for protecting and cooling computer chip die mounted on a thin film substrate and a chassis for conduction cooling of such modules
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
JP2658805B2 (en) * 1993-06-30 1997-09-30 日本電気株式会社 For electromagnetic shielding enclosure
US5767443A (en) * 1993-07-10 1998-06-16 Micron Technology, Inc. Multi-die encapsulation device
US5482109A (en) * 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
US5473508A (en) * 1994-05-31 1995-12-05 At&T Global Information Solutions Company Focused CPU air cooling system including high efficiency heat exchanger
DE19514545A1 (en) * 1995-04-20 1996-10-24 Daimler Benz Ag Micro-cooling device for multiple microelectronic components
SE9502498D0 (en) * 1995-07-07 1995-07-07 Volvo Penta Ab Cooling of heat-sensitive components
US5726857A (en) * 1996-02-22 1998-03-10 Cray Research, Inc. Apparatus and method for mounting edge connectors within a circuit module
US5740018A (en) * 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
US5761035A (en) * 1996-06-28 1998-06-02 Motorola, Inc. Circuit board apparatus and method for spray-cooling a circuit board
US6252302B1 (en) 1996-09-19 2001-06-26 Warren M. Farnworth Heat transfer material for an improved die edge contacting socket
US5886872A (en) * 1997-04-23 1999-03-23 Compaq Computer Corporation Pivotable support and heat sink apparatus removably connectable without tools to a computer processor
US6169247B1 (en) * 1998-06-11 2001-01-02 Lucent Technologies Inc. Enclosure for electronic components
US6297960B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
EP0992430A3 (en) * 1998-10-07 2000-09-13 Negesat Di Boer Fabrizio & C. SNC Housing providing cooling for equipment aboard aircraft or spacecraft
US7019244B2 (en) * 2002-04-20 2006-03-28 Hewlett-Packard Development Company, L.P. Electrostatic precipitator
FR2845821B1 (en) * 2002-10-11 2005-12-02 Thales Sa Electronic substrate of a three-dimensional electronic module having a high thermal dissipation power and electronic module
WO2006056199A1 (en) * 2004-11-24 2006-06-01 Danfoss Silicon Power Gmbh A flow distribution module and a stack of flow distribution modules
EP1934668B1 (en) 2005-09-06 2016-03-16 Beyond Blades Ltd. 3-dimensional multi-layered modular computer architecture
US7671801B2 (en) * 2005-09-19 2010-03-02 Raytheon Company Armor for an electronically scanned array
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
US7365974B2 (en) * 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
US7365976B2 (en) * 2006-03-24 2008-04-29 Fujitsu Limited Electronic apparatus
FR2905556B1 (en) * 2006-08-30 2009-06-26 Thales Sa Electronic bay associating natural convection and force air circulation for its cooling
US7995346B2 (en) * 2008-03-06 2011-08-09 Northrop Grumman Systems Corporation Ruggedized, self aligning, sliding air seal for removable electronic units
FR2934906B1 (en) * 2008-08-05 2010-09-03 Thales Sa On-board calculator equipped with an autonomous aeraulic cooling device
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8427828B2 (en) * 2010-07-20 2013-04-23 Themis Computer Printed circuit board module enclosure and apparatus using same
US20120170224A1 (en) * 2010-12-29 2012-07-05 Src, Inc. Circuit board frame with integral heat sink for enhanced thermal transfer
US9593876B2 (en) 2012-09-07 2017-03-14 David Smith Cooling electronic devices installed in a subsurface environment
US9826640B2 (en) 2013-06-26 2017-11-21 E Ink Holdings Inc. Electronic apparatus
TWI507772B (en) 2013-06-26 2015-11-11 E Ink Holdings Inc Electronic apparatus
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9357670B2 (en) 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
US9408332B2 (en) 2014-06-24 2016-08-02 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9258926B2 (en) 2014-06-24 2016-02-09 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9560789B2 (en) 2014-06-24 2017-01-31 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9699939B2 (en) 2014-06-24 2017-07-04 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US10017073B2 (en) 2016-03-09 2018-07-10 Ford Global Technologies, Llc Coolant channels for power module assemblies
US9950628B2 (en) * 2016-03-09 2018-04-24 Ford Global Technologies, Llc Power-module assembly with dummy module
US9961808B2 (en) 2016-03-09 2018-05-01 Ford Global Technologies, Llc Power electronics system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3124720A (en) * 1964-03-10 Modular electronic assemblies with cooling means
US2942856A (en) * 1959-01-13 1960-06-28 Kenneth E Woodward Fluid-cooled electrical module assembly
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2945149A1 (en) * 1978-11-11 1980-05-29 Ferranti Ltd circuitry
DE3536963A1 (en) * 1985-10-17 1987-04-23 Diehl Gmbh & Co assembly arrangement
WO2005104642A1 (en) * 2004-04-26 2005-11-03 Knürr AG Cooling system for equipment and wiring cabinets and method for cooling equipment and wiring cabinets
US7254022B2 (en) 2004-04-26 2007-08-07 Knuerr Ag Cooling system for equipment and network cabinets and method for cooling equipment and network cabinets

Also Published As

Publication number Publication date
CA923213A1 (en)
JPS526462B1 (en) 1977-02-22
US3648113A (en) 1972-03-07
GB1312404A (en) 1973-04-04
CA923213A (en) 1973-03-20
SE369573B (en) 1974-09-02
DE2152541B2 (en) 1974-03-07
IT938913B (en) 1973-02-10
DE2152541C3 (en) 1974-09-26
FR2109696A5 (en) 1972-05-26
IL37186A (en) 1974-01-14
IL37186D0 (en) 1971-08-25

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
EGA New person/name/address of the applicant
8328 Change in the person/name/address of the agent

Free format text: OEDEKOVEN, W., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN