GB2278733A - Production of printed wiring boards - Google Patents

Production of printed wiring boards Download PDF

Info

Publication number
GB2278733A
GB2278733A GB9410718A GB9410718A GB2278733A GB 2278733 A GB2278733 A GB 2278733A GB 9410718 A GB9410718 A GB 9410718A GB 9410718 A GB9410718 A GB 9410718A GB 2278733 A GB2278733 A GB 2278733A
Authority
GB
United Kingdom
Prior art keywords
printed wiring
wiring boards
portions
cutting
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9410718A
Other languages
English (en)
Other versions
GB9410718D0 (en
Inventor
Tatsuya Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Publication of GB9410718D0 publication Critical patent/GB9410718D0/en
Publication of GB2278733A publication Critical patent/GB2278733A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
GB9410718A 1993-05-31 1994-05-27 Production of printed wiring boards Withdrawn GB2278733A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14973293A JPH06338671A (ja) 1993-05-31 1993-05-31 プリント基板の製造方法

Publications (2)

Publication Number Publication Date
GB9410718D0 GB9410718D0 (en) 1994-07-13
GB2278733A true GB2278733A (en) 1994-12-07

Family

ID=15481608

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9410718A Withdrawn GB2278733A (en) 1993-05-31 1994-05-27 Production of printed wiring boards

Country Status (4)

Country Link
JP (1) JPH06338671A (enExample)
GB (1) GB2278733A (enExample)
MY (1) MY131675A (enExample)
TW (1) TW246762B (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1474504A (en) * 1974-09-23 1977-05-25 Metallgesellschaft Ag Process for producing pre-oriented continuous yarns

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074594A (ja) * 1983-09-30 1985-04-26 日立電子株式会社 ハイブリッドｉｃ用小片基板の製造方法
JPS61187292A (ja) * 1985-02-14 1986-08-20 三菱電機株式会社 電子部品の製造方法
JPS62257787A (ja) * 1986-04-30 1987-11-10 富士通株式会社 モジユ−ルプリント板の多数個取り方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1474504A (en) * 1974-09-23 1977-05-25 Metallgesellschaft Ag Process for producing pre-oriented continuous yarns

Also Published As

Publication number Publication date
MY131675A (en) 2007-08-30
TW246762B (enExample) 1995-05-01
JPH06338671A (ja) 1994-12-06
GB9410718D0 (en) 1994-07-13

Similar Documents

Publication Publication Date Title
GB2278733A (en) Production of printed wiring boards
US5233754A (en) Method for forming perforations on a printed circuit board
JPH06291459A (ja) 印刷配線板の製造方法
US5152054A (en) Method of making film carrier structure for integrated circuit tape automated bonding
JP3245231B2 (ja) フラットケーブル回路の製造方法
US6751861B2 (en) Printed circuit board manufacturing method
KR102842555B1 (ko) 멤브레인스티커 제조방법
JP2943305B2 (ja) プリント配線板の製造方法
US6585024B1 (en) Positioning target for laminated printed circuit board
JP2005223266A (ja) 基板の端面スルーホール製造方法
JP2641958B2 (ja) 金属基板の固定ねじ用孔の構造及びその加工方法
JPH0851267A (ja) 回路基板及びその製造方法
JPH0745975Y2 (ja) 多面取り基板
US20070111595A1 (en) Printed circuit board
JPH0770808B2 (ja) 端面スルーホール基板の切断方法
JPH1197822A (ja) フレキシブルプリント配線板
JP2000225597A (ja) プリント配線基板用切断工具
JPH04254392A (ja) プリント配線板
JPH0936505A (ja) フレキシブルプリント基板原板
JPH06333443A (ja) スリット加工方法及び金型
JP3116404B2 (ja) プリント配線板の製造方法
JPH1051084A (ja) 分割型プリント配線板及びその製造方法
JPS59118231A (ja) プリント回路板用の打抜金型
KR940027638A (ko) 펀칭(Punching)을 이용한 인쇄회로기판(PCB) 제조방법
JPH08197499A (ja) プリント配線板の打抜法

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)