MY131675A - Process for producing printed wiring board - Google Patents

Process for producing printed wiring board

Info

Publication number
MY131675A
MY131675A MYPI9401363A MY131675A MY 131675 A MY131675 A MY 131675A MY PI9401363 A MYPI9401363 A MY PI9401363A MY 131675 A MY131675 A MY 131675A
Authority
MY
Malaysia
Prior art keywords
printed wiring
wiring boards
portions
similar
another
Prior art date
Application number
Other languages
English (en)
Inventor
Tatsuya Horiuchi
Original Assignee
Sankyo Seiki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Seisakusho Kk filed Critical Sankyo Seiki Seisakusho Kk
Publication of MY131675A publication Critical patent/MY131675A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
MYPI9401363 1993-05-31 1994-05-30 Process for producing printed wiring board MY131675A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14973293A JPH06338671A (ja) 1993-05-31 1993-05-31 プリント基板の製造方法

Publications (1)

Publication Number Publication Date
MY131675A true MY131675A (en) 2007-08-30

Family

ID=15481608

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9401363 MY131675A (en) 1993-05-31 1994-05-30 Process for producing printed wiring board

Country Status (4)

Country Link
JP (1) JPH06338671A (enExample)
GB (1) GB2278733A (enExample)
MY (1) MY131675A (enExample)
TW (1) TW246762B (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1009027A (en) * 1974-09-23 1977-04-26 Matthew J. Walsh Method of producing printed circuit boards in multiple units
JPS6074594A (ja) * 1983-09-30 1985-04-26 日立電子株式会社 ハイブリッドｉｃ用小片基板の製造方法
JPS61187292A (ja) * 1985-02-14 1986-08-20 三菱電機株式会社 電子部品の製造方法
JPS62257787A (ja) * 1986-04-30 1987-11-10 富士通株式会社 モジユ−ルプリント板の多数個取り方法

Also Published As

Publication number Publication date
GB9410718D0 (en) 1994-07-13
JPH06338671A (ja) 1994-12-06
GB2278733A (en) 1994-12-07
TW246762B (enExample) 1995-05-01

Similar Documents

Publication Publication Date Title
EP0351034A3 (en) Process for producing printed wiring boards
EP0247575A3 (en) Multilayer printed wiring board and method for producing the same
ES2068442T3 (es) Metodo y aparato para cortar segmentos sucesivos de material de lamina con continuacion de corte.
EP0405369A3 (en) Process for producing copperclad laminate
EP0963021A4 (en) CIRCUIT BOARD FOR BUSBAR AND MANUFACTURING METHOD
SG94696A1 (en) Laminated board and process for production thereof
MX9504785A (es) Metodo y dispositivo para producir correa plastica orientada, y correa producida mediante estos.
EP0782378A3 (en) Electronic component mounting apparatus and method
MY131675A (en) Process for producing printed wiring board
ZA966391B (en) A method of producing lignocellulosic boards.
EP0472158A3 (en) Process for producing a printed wiring board
ZA966392B (en) A method of continuous production of lignocellulosic boards.
GB2227124B (en) Wiring board and process for producing the same
EP0908559B8 (en) Nonwoven reinforcement for printed wiring base board and process for producing the same
TW345688B (en) Electron beam-writing apparatus and method
ZA966388B (en) A method for producing lignocellulosic boards.
EP0335565A3 (en) Process for producing printed wiring board
AU2408392A (en) Process for producing plastic laminates from continuously fed bands
MY120238A (en) Electronic apparatus
JPS5326477A (en) Scrap press
GB9324795D0 (en) A circuit board production process
AU579620B2 (en) Process for producing metal-laminated base material for printed circuit boards
JPS5738079A (en) Communication system for emergency news
ES2024868A6 (es) Cabezal automatico para la insercion de lenguetas en placas de circuito impreso.
MX9600616A (es) Metodo para cambiar un dispositivo de montaje de produccion.