GB1474504A - Process for producing pre-oriented continuous yarns - Google Patents

Process for producing pre-oriented continuous yarns

Info

Publication number
GB1474504A
GB1474504A GB3762975A GB3762975A GB1474504A GB 1474504 A GB1474504 A GB 1474504A GB 3762975 A GB3762975 A GB 3762975A GB 3762975 A GB3762975 A GB 3762975A GB 1474504 A GB1474504 A GB 1474504A
Authority
GB
United Kingdom
Prior art keywords
boards
sheets
printed
circuits
outpunched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3762975A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEA Group AG
Original Assignee
Metallgesellschaft AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metallgesellschaft AG filed Critical Metallgesellschaft AG
Publication of GB1474504A publication Critical patent/GB1474504A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

1474504 Printed circuits NORTHERN ELECTRIC CO Ltd 12 Sept 1975 [23 Sept 1974] 37629/75 Heading H1R Printed circuit boards 10 of e.g. GRP having circuits printed thereon at 12 and locating holes 15 and handling apertures outpunched, are formed in multiple from a sheet 11; the periphery of each board being delineated by a shear line 14. The printed circuits 12 are formed by coating, masking and etching, and using holes 15 for location the boards 10 are outpunched in a press against a spring plate, which returns the boards into the apertures in which they are retained by frictional adhesion. Thereafter the sheets 11 are stacked and heated at a predetermined temperature under weighting pressure for flattening, and allowed to cool under pressure. Then the copper circuitry is protected by a layer of natural resin deposited from alcohol solution, and the sheets with boards in situ are translated to assembly stations where components are automatically or manually inserted, and to wave soldering stations for connection and fixture. The boards are pressed out mechanically while the surrounding sheet is held stationary. The synthetic resin of the sheets is capable of thermosoftening over a defined temperature range and may be e.g. bischlorophenyl A resin.
GB3762975A 1974-09-23 1975-09-12 Process for producing pre-oriented continuous yarns Expired GB1474504A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA209,786A CA1009027A (en) 1974-09-23 1974-09-23 Method of producing printed circuit boards in multiple units

Publications (1)

Publication Number Publication Date
GB1474504A true GB1474504A (en) 1977-05-25

Family

ID=4101198

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3762975A Expired GB1474504A (en) 1974-09-23 1975-09-12 Process for producing pre-oriented continuous yarns

Country Status (7)

Country Link
JP (1) JPS51136176A (en)
CA (1) CA1009027A (en)
DE (1) DE2541667A1 (en)
FR (1) FR2285784A1 (en)
GB (1) GB1474504A (en)
NL (1) NL7511148A (en)
SE (1) SE7510670L (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2278733A (en) * 1993-05-31 1994-12-07 Sankyo Seiki Seisakusho Kk Production of printed wiring boards
CN103817745A (en) * 2014-02-24 2014-05-28 昆山苏杭电路板有限公司 Small-unit printed board punching process

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181090A (en) * 1983-03-30 1984-10-15 日本メクトロン株式会社 Method of producing circuit board
NL1016701C2 (en) * 2000-11-24 2002-05-27 Fico Bv Removal of sections with electronic components from flat support, by partially removing section, replacing it in support and then removing whilst rinsing with liquid
DE102015116563A1 (en) 2015-09-30 2017-03-30 Valeo Schalter Und Sensoren Gmbh Method for producing electronic components for sensors of a motor vehicle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2278733A (en) * 1993-05-31 1994-12-07 Sankyo Seiki Seisakusho Kk Production of printed wiring boards
CN103817745A (en) * 2014-02-24 2014-05-28 昆山苏杭电路板有限公司 Small-unit printed board punching process
CN103817745B (en) * 2014-02-24 2016-05-25 昆山苏杭电路板有限公司 Junior unit printed board punching technique

Also Published As

Publication number Publication date
SE7510670L (en) 1976-03-24
JPS556318B2 (en) 1980-02-15
FR2285784A1 (en) 1976-04-16
NL7511148A (en) 1976-03-25
DE2541667A1 (en) 1976-04-08
JPS51136176A (en) 1976-11-25
CA1009027A (en) 1977-04-26

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee