CN103817745B - Junior unit printed board punching technique - Google Patents
Junior unit printed board punching technique Download PDFInfo
- Publication number
- CN103817745B CN103817745B CN201410062169.XA CN201410062169A CN103817745B CN 103817745 B CN103817745 B CN 103817745B CN 201410062169 A CN201410062169 A CN 201410062169A CN 103817745 B CN103817745 B CN 103817745B
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- China
- Prior art keywords
- junior unit
- unit printed
- printed circuit
- board
- circuit board
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- Structure Of Printed Boards (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a kind of junior unit printed board punching technique, after the printed circuit board distributing in some junior unit printed boards has been produced, need to carry out sharp processing time, adopt three molds to carry out Punching Technology: the waste material that first washes away some junior unit printed board surroundings on described printed circuit board with first set mould; Then use the second mold by die-cut some junior unit printed boards, but these some junior unit printed board indwellings are in situ; Finally with the 3rd mold, the art border of described printed circuit board periphery is removed. Adopt junior unit printed board punching technique of the present invention, can make the very easy of follow-up electronic assemblies change, to the various junior unit printed circuit boards of rectangle, square or other irregular contours, all can be applied, production efficiency has improved several times, and the automation of junior unit printed circuit board is mounted becomes possibility.
Description
Technical field
The present invention relates to a kind of junior unit printed board punching technique.
Background technology
Have many portable electric appts, printed circuit board used is small-sized, hasOnly have several square centimeters of several square centimeters or zero points, and electronics unit to be installed thereonDevice and debugging, realizes specific electric function, can only manual operations, very notConvenient, and can not realize and the automated job such as automatically mount.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of junior unit printed board punchingTechnique, is combined into the whole of a suitable dimension size by small size unit printed circuit boardBody, facilitates the follow-up components and parts installation and debugging of carrying out greatly thereon, realizes automationOperation, has improved labor productivity greatly.
The present invention for the technical scheme that solves its technical problem and adopt is: Yi Zhong littleUnit printed board punching technique, the printed circuit board distributing in some junior unit printed boardsAfter production completes, need to carry out sharp processing time, adopt three molds to carry out die-cut addingWork: first wash away some junior unit printed boards on described printed circuit board with first set mouldThe waste material of surrounding; Then use the second mold by die-cut some junior unit printed boards, butThese some junior unit printed board indwellings are in situ; Finally use the 3rd mold by instituteStating the art border of printed circuit board periphery removes.
The invention has the beneficial effects as follows: adopt junior unit printed board punching work of the present inventionSkill, what can make that follow-up electronic assemblies becomes is very easy, to rectangle, square or itsHis irregular contour various junior unit printed circuit boards, all can be applied, rawProduce efficiency and improved several times, the automation of junior unit printed circuit board being mounted become canEnergy.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
1---printed circuit board 2---junior unit printed board
3---waste material 4---art border
Detailed description of the invention
By reference to the accompanying drawings, the present invention is elaborated, but protection scope of the present invention is notBe limited to following embodiment, in every case with the present patent application the scope of the claims and descriptionThe simple equivalence of doing changes and modifies, all still belong to patent covering scope of the present invention itIn.
As shown in Figure 1, a kind of junior unit printed board punching technique, at some junior unitsAfter the printed circuit board 1 that printed board 2 distributes has been produced, need to carry out sharp processingTime, adopt three molds to carry out Punching Technology: first to wash away and print electricity with first set mouldThe waste material 3 of some junior unit printed board surroundings on the plate of road; Then will with the second moldSome junior unit printed boards are die-cut, but these some junior unit printed board indwellings are in original positionPlace; Finally use the 3rd mold by the art border 4 of described printed circuit board peripheryRemove, form jigsaw profile, but some junior unit printed boards still concora crush originallyOn position. Like this, several independently single junior unit printed board be still embedded in greatlyIn printed board, shape is in aggregates, makes follow-up electronic assemblies can realize automated job.
Claims (1)
1. a junior unit printed board punching technique, is characterized in that, some littleThe printed circuit board (1) that unit printed board (2) distributes need to enter after having producedWhen row sharp processing, adopt three molds to carry out Punching Technology: first to use first set mouldWash away the waste material (3) of some junior unit printed board surroundings on described printed circuit board; SoAfter use the second mold by die-cut some junior unit printed boards, but these some junior units printMaking sheet indwelling is in situ; Finally use the 3rd mold by outside described printed circuit boardThe art border (4) enclosing is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410062169.XA CN103817745B (en) | 2014-02-24 | 2014-02-24 | Junior unit printed board punching technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410062169.XA CN103817745B (en) | 2014-02-24 | 2014-02-24 | Junior unit printed board punching technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103817745A CN103817745A (en) | 2014-05-28 |
| CN103817745B true CN103817745B (en) | 2016-05-25 |
Family
ID=50753165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410062169.XA Active CN103817745B (en) | 2014-02-24 | 2014-02-24 | Junior unit printed board punching technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103817745B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992629B (en) * | 2015-05-29 | 2020-09-04 | 深圳市奥拓电子股份有限公司 | Display screen lamp panel and splicing method thereof |
| CN106851995A (en) * | 2017-04-10 | 2017-06-13 | 昆山苏杭电路板有限公司 | The high-accuracy multi-joint removable processing method for filling unit printed board |
| CN108200724B (en) * | 2018-01-15 | 2020-01-21 | 深圳市实锐泰科技有限公司 | Flexible printed board forming method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1474504A (en) * | 1974-09-23 | 1977-05-25 | Metallgesellschaft Ag | Process for producing pre-oriented continuous yarns |
| CN1958249A (en) * | 2005-11-02 | 2007-05-09 | 上海华仕德电路技术有限公司 | Method for die cutting flexible circuit board |
| CN101686604A (en) * | 2008-09-24 | 2010-03-31 | 比亚迪股份有限公司 | Flexible printed circuit whole board punching method |
| CN102223763A (en) * | 2010-04-16 | 2011-10-19 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of connecting sheet circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2943305B2 (en) * | 1990-10-11 | 1999-08-30 | 松下電器産業株式会社 | Manufacturing method of printed wiring board |
-
2014
- 2014-02-24 CN CN201410062169.XA patent/CN103817745B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1474504A (en) * | 1974-09-23 | 1977-05-25 | Metallgesellschaft Ag | Process for producing pre-oriented continuous yarns |
| CN1958249A (en) * | 2005-11-02 | 2007-05-09 | 上海华仕德电路技术有限公司 | Method for die cutting flexible circuit board |
| CN101686604A (en) * | 2008-09-24 | 2010-03-31 | 比亚迪股份有限公司 | Flexible printed circuit whole board punching method |
| CN102223763A (en) * | 2010-04-16 | 2011-10-19 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of connecting sheet circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103817745A (en) | 2014-05-28 |
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