GB2253629A - One component type liquid photo solder-resist ink composition - Google Patents

One component type liquid photo solder-resist ink composition Download PDF

Info

Publication number
GB2253629A
GB2253629A GB9200702A GB9200702A GB2253629A GB 2253629 A GB2253629 A GB 2253629A GB 9200702 A GB9200702 A GB 9200702A GB 9200702 A GB9200702 A GB 9200702A GB 2253629 A GB2253629 A GB 2253629A
Authority
GB
United Kingdom
Prior art keywords
parts
acid
meta
resin
reaction product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9200702A
Other languages
English (en)
Other versions
GB9200702D0 (en
Inventor
Mineo Nouchi
Isao Morooka
Yoichi Oba
Yamahiro Iwasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Research Laboratory Co Ltd
Original Assignee
Asahi Chemical Research Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Research Laboratory Co Ltd filed Critical Asahi Chemical Research Laboratory Co Ltd
Publication of GB9200702D0 publication Critical patent/GB9200702D0/en
Publication of GB2253629A publication Critical patent/GB2253629A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/144—Polymers containing more than one epoxy group per molecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
GB9200702A 1991-03-11 1992-01-14 One component type liquid photo solder-resist ink composition Withdrawn GB2253629A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6948991A JP2988736B2 (ja) 1991-03-11 1991-03-11 一液型感光性熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
GB9200702D0 GB9200702D0 (en) 1992-03-11
GB2253629A true GB2253629A (en) 1992-09-16

Family

ID=13404174

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9200702A Withdrawn GB2253629A (en) 1991-03-11 1992-01-14 One component type liquid photo solder-resist ink composition

Country Status (2)

Country Link
JP (1) JP2988736B2 (ja)
GB (1) GB2253629A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2266721A (en) * 1992-03-26 1993-11-10 Sericol Ltd Radiation curable compounds and compositions
EP0587189A2 (en) * 1992-09-10 1994-03-16 Nippon Shokubai Co., Ltd. A solder resist ink composition
EP0632079A1 (de) * 1993-07-02 1995-01-04 Ciba-Geigy Ag Epoxyacrylate
EP0747770A2 (en) * 1995-06-06 1996-12-11 Taiyo Ink Manufacturing Co. Ltd. One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3980483A (en) * 1972-04-24 1976-09-14 Nippon Oil Seal Industry Co., Ltd. Photocurable composition
GB2175908A (en) * 1985-04-19 1986-12-10 Taiyo Ink Mfg Co Ltd Photo-setting compositions
EP0273729A2 (en) * 1986-12-26 1988-07-06 Kabushiki Kaisha Toshiba Solder resist ink composition
EP0292219A2 (en) * 1987-05-21 1988-11-23 AT&T Corp. Printed circuit board fabrication
EP0306273A2 (en) * 1987-09-02 1989-03-08 Arakawa Chemical Industries, Limited Alkaline developable liquid photoimageable solder resist ink composition
US4948700A (en) * 1988-08-04 1990-08-14 Fuji Photo Film Co., Ltd. Liquid light-sensitive resinous composition
GB2235925A (en) * 1989-09-12 1991-03-20 Sericol Group Ltd Photocurable compositions suitable for use in solder mask inks

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3980483A (en) * 1972-04-24 1976-09-14 Nippon Oil Seal Industry Co., Ltd. Photocurable composition
GB2175908A (en) * 1985-04-19 1986-12-10 Taiyo Ink Mfg Co Ltd Photo-setting compositions
EP0273729A2 (en) * 1986-12-26 1988-07-06 Kabushiki Kaisha Toshiba Solder resist ink composition
EP0292219A2 (en) * 1987-05-21 1988-11-23 AT&T Corp. Printed circuit board fabrication
EP0306273A2 (en) * 1987-09-02 1989-03-08 Arakawa Chemical Industries, Limited Alkaline developable liquid photoimageable solder resist ink composition
US4948700A (en) * 1988-08-04 1990-08-14 Fuji Photo Film Co., Ltd. Liquid light-sensitive resinous composition
GB2235925A (en) * 1989-09-12 1991-03-20 Sericol Group Ltd Photocurable compositions suitable for use in solder mask inks

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2266721A (en) * 1992-03-26 1993-11-10 Sericol Ltd Radiation curable compounds and compositions
EP0587189A2 (en) * 1992-09-10 1994-03-16 Nippon Shokubai Co., Ltd. A solder resist ink composition
EP0587189A3 (en) * 1992-09-10 1994-08-10 Nippon Catalytic Chem Ind A solder resist ink composition
US6015651A (en) * 1992-09-10 2000-01-18 Nippon Shokubai Co., Ltd. Solder resist ink composition of a novolak-epoxy resin
EP0632079A1 (de) * 1993-07-02 1995-01-04 Ciba-Geigy Ag Epoxyacrylate
US5576399A (en) * 1993-07-02 1996-11-19 Ciba-Geigy Corporation Epoxy acrylates
CN1052245C (zh) * 1993-07-02 2000-05-10 希巴特殊化学控股公司 含羧基环氧丙烯酸酯及其制备方法和用途
US6479596B1 (en) 1993-07-02 2002-11-12 Vantico, Inc. Epoxy acrylates
EP0747770A2 (en) * 1995-06-06 1996-12-11 Taiyo Ink Manufacturing Co. Ltd. One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof
EP0747770A3 (en) * 1995-06-06 1997-04-23 Taiyo Ink Mfg Co Ltd Photosensitive composition for solder mask, single mixture, developable in aqueous alkaline media and method of manufacturing printed circuits using this composition
US5741622A (en) * 1995-06-06 1998-04-21 Taiyo Ink Manufacturing Co., Ltd. One-package photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof

Also Published As

Publication number Publication date
JP2988736B2 (ja) 1999-12-13
GB9200702D0 (en) 1992-03-11
JPH04281454A (ja) 1992-10-07

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Legal Events

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)