GB9200702D0 - One component type liquid photo solder-resist ink composition - Google Patents

One component type liquid photo solder-resist ink composition

Info

Publication number
GB9200702D0
GB9200702D0 GB9200702A GB9200702A GB9200702D0 GB 9200702 D0 GB9200702 D0 GB 9200702D0 GB 9200702 A GB9200702 A GB 9200702A GB 9200702 A GB9200702 A GB 9200702A GB 9200702 D0 GB9200702 D0 GB 9200702D0
Authority
GB
United Kingdom
Prior art keywords
ink composition
type liquid
component type
resist ink
photo solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9200702A
Other versions
GB2253629A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Research Laboratory Co Ltd
Original Assignee
Asahi Chemical Research Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Research Laboratory Co Ltd filed Critical Asahi Chemical Research Laboratory Co Ltd
Publication of GB9200702D0 publication Critical patent/GB9200702D0/en
Publication of GB2253629A publication Critical patent/GB2253629A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/144—Polymers containing more than one epoxy group per molecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
GB9200702A 1991-03-11 1992-01-14 One component type liquid photo solder-resist ink composition Withdrawn GB2253629A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6948991A JP2988736B2 (en) 1991-03-11 1991-03-11 One-part photosensitive thermosetting resin composition

Publications (2)

Publication Number Publication Date
GB9200702D0 true GB9200702D0 (en) 1992-03-11
GB2253629A GB2253629A (en) 1992-09-16

Family

ID=13404174

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9200702A Withdrawn GB2253629A (en) 1991-03-11 1992-01-14 One component type liquid photo solder-resist ink composition

Country Status (2)

Country Link
JP (1) JP2988736B2 (en)
GB (1) GB2253629A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2266721A (en) * 1992-03-26 1993-11-10 Sericol Ltd Radiation curable compounds and compositions
KR0126118B1 (en) * 1992-09-10 1997-12-18 다나카 쇼소 A solder resist ink composition
TW270123B (en) * 1993-07-02 1996-02-11 Ciba Geigy
JP2718007B2 (en) * 1995-06-06 1998-02-25 太陽インキ製造株式会社 Alkali-developable one-pack type photo solder resist composition and method for manufacturing printed wiring board using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3980483A (en) * 1972-04-24 1976-09-14 Nippon Oil Seal Industry Co., Ltd. Photocurable composition
JPS61243869A (en) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk Resist ink composition
JPS63258975A (en) * 1986-12-26 1988-10-26 Toshiba Corp Solder resist ink composition
EP0292219A3 (en) * 1987-05-21 1989-10-11 AT&T Corp. Printed circuit board fabrication
JPS6462375A (en) * 1987-09-02 1989-03-08 Arakawa Chem Ind Liquid photosolder resist ink composition of alkali development type
JPH0823694B2 (en) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 Liquid photosensitive resin composition
GB2235925B (en) * 1989-09-12 1992-09-30 Sericol Group Ltd Photocurable compositions

Also Published As

Publication number Publication date
GB2253629A (en) 1992-09-16
JPH04281454A (en) 1992-10-07
JP2988736B2 (en) 1999-12-13

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)