GB2032686A - MOS device with U-shaped groove - Google Patents

MOS device with U-shaped groove Download PDF

Info

Publication number
GB2032686A
GB2032686A GB7932015A GB7932015A GB2032686A GB 2032686 A GB2032686 A GB 2032686A GB 7932015 A GB7932015 A GB 7932015A GB 7932015 A GB7932015 A GB 7932015A GB 2032686 A GB2032686 A GB 2032686A
Authority
GB
United Kingdom
Prior art keywords
recess
layer
semiconductor device
mos
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7932015A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Microsystems Holding Corp
Original Assignee
American Microsystems Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Microsystems Holding Corp filed Critical American Microsystems Holding Corp
Publication of GB2032686A publication Critical patent/GB2032686A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42356Disposition, e.g. buried gate electrode
    • H01L29/4236Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827Vertical transistors

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
GB7932015A 1978-10-05 1979-09-14 MOS device with U-shaped groove Withdrawn GB2032686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94881478A 1978-10-05 1978-10-05

Publications (1)

Publication Number Publication Date
GB2032686A true GB2032686A (en) 1980-05-08

Family

ID=25488272

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7932015A Withdrawn GB2032686A (en) 1978-10-05 1979-09-14 MOS device with U-shaped groove

Country Status (7)

Country Link
JP (1) JPS5552273A (fr)
CA (1) CA1115426A (fr)
DE (1) DE2931272A1 (fr)
FR (1) FR2438342A1 (fr)
GB (1) GB2032686A (fr)
IT (1) IT1123772B (fr)
NL (1) NL7905402A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001099185A2 (fr) * 2000-06-19 2001-12-27 Infineon Technologies North America Corp. Dispositif de tranchee verticale de circuit integre et son procede de production
US6495883B2 (en) 2001-02-06 2002-12-17 Denso Corporation Trench gate type semiconductor device and method of manufacturing

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4449285A (en) * 1981-08-19 1984-05-22 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Method for producing a vertical channel transistor
US4546367A (en) * 1982-06-21 1985-10-08 Eaton Corporation Lateral bidirectional notch FET with extended gate insulator
JPS598375A (ja) * 1982-07-05 1984-01-17 Matsushita Electronics Corp 縦型構造電界効果トランジスタ
US5034785A (en) * 1986-03-24 1991-07-23 Siliconix Incorporated Planar vertical channel DMOS structure
US4767722A (en) * 1986-03-24 1988-08-30 Siliconix Incorporated Method for making planar vertical channel DMOS structures

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001099185A2 (fr) * 2000-06-19 2001-12-27 Infineon Technologies North America Corp. Dispositif de tranchee verticale de circuit integre et son procede de production
WO2001099185A3 (fr) * 2000-06-19 2002-03-28 Infineon Technologies Corp Dispositif de tranchee verticale de circuit integre et son procede de production
US6495883B2 (en) 2001-02-06 2002-12-17 Denso Corporation Trench gate type semiconductor device and method of manufacturing

Also Published As

Publication number Publication date
DE2931272A1 (de) 1980-04-24
FR2438342A1 (fr) 1980-04-30
NL7905402A (nl) 1980-04-09
CA1115426A (fr) 1981-12-29
JPS5552273A (en) 1980-04-16
IT7926258A0 (it) 1979-10-04
IT1123772B (it) 1986-04-30

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)