GB1593235A - Methods and apparatus for making scribed circuit boards - Google Patents

Methods and apparatus for making scribed circuit boards Download PDF

Info

Publication number
GB1593235A
GB1593235A GB9957/78A GB995778A GB1593235A GB 1593235 A GB1593235 A GB 1593235A GB 9957/78 A GB9957/78 A GB 9957/78A GB 995778 A GB995778 A GB 995778A GB 1593235 A GB1593235 A GB 1593235A
Authority
GB
United Kingdom
Prior art keywords
conductor
gate
feed
stylus
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB9957/78A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of GB1593235A publication Critical patent/GB1593235A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB9957/78A 1977-08-09 1978-03-14 Methods and apparatus for making scribed circuit boards Expired GB1593235A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82315377A 1977-08-09 1977-08-09

Publications (1)

Publication Number Publication Date
GB1593235A true GB1593235A (en) 1981-07-15

Family

ID=25237948

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9957/78A Expired GB1593235A (en) 1977-08-09 1978-03-14 Methods and apparatus for making scribed circuit boards

Country Status (14)

Country Link
JP (1) JPS5430470A (de)
AT (1) AT377890B (de)
AU (1) AU508357B2 (de)
BR (1) BR7707302A (de)
CA (1) CA1102924A (de)
CH (1) CH629058A5 (de)
DE (1) DE2811458C2 (de)
FR (1) FR2400304A1 (de)
GB (1) GB1593235A (de)
IL (1) IL54283A (de)
IT (1) IT1155890B (de)
NL (1) NL7806258A (de)
SE (1) SE429702B (de)
ZA (1) ZA775455B (de)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3624627A1 (de) * 1985-07-19 1987-01-29 Kollmorgen Tech Corp Verfahren zum herstellen von drahtgeschriebenen leiterplatten
DE3624630A1 (de) * 1985-07-19 1987-02-19 Kollmorgen Tech Corp Verfahren zum herstellen von schaltungsplatten
GB2181982A (en) * 1985-08-09 1987-05-07 Kollmorgen Tech Corp Ultrasonic stylus of wire scribing head
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8413316B2 (en) 2007-09-18 2013-04-09 Hid Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US8646675B2 (en) 2004-11-02 2014-02-11 Hid Global Gmbh Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
EP2704186A1 (de) * 2012-08-27 2014-03-05 Garreth Finlay Verfahren zum Verlegen eines Drahtleiters auf einem Träger und zum Anschließen desselben an einem Chip

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507855A1 (fr) * 1981-06-11 1982-12-17 Kurganov Vladimir Tete de distribution d'une machine de cablage automatique
FR2509950A1 (fr) * 1981-07-16 1983-01-21 Egorenkov Arvit Dispositif pour le montage d'un cable sur une plaque
JPS59186851A (ja) * 1983-04-04 1984-10-23 Kataoka Kikai Seisakusho:Kk シ−ト巻取り準備装置
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
JP2612038B2 (ja) * 1988-06-22 1997-05-21 大日本印刷株式会社 小巻き用ボビンへのフイルム接着装置
JP2672925B2 (ja) * 1992-08-26 1997-11-05 ワイケイケイ株式会社 テープ状体の自動巻取機

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE663052A (de) * 1964-04-27
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (de) * 1970-03-05 1980-12-17
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3624630A1 (de) * 1985-07-19 1987-02-19 Kollmorgen Tech Corp Verfahren zum herstellen von schaltungsplatten
DE3624627A1 (de) * 1985-07-19 1987-01-29 Kollmorgen Tech Corp Verfahren zum herstellen von drahtgeschriebenen leiterplatten
GB2181982A (en) * 1985-08-09 1987-05-07 Kollmorgen Tech Corp Ultrasonic stylus of wire scribing head
GB2181982B (en) * 1985-08-09 1989-07-26 Kollmorgen Tech Corp Ultrasonic stylus position stabilizer
US8646675B2 (en) 2004-11-02 2014-02-11 Hid Global Gmbh Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8091208B2 (en) 2006-09-26 2012-01-10 David Finn Method of forming an inlay substrate having an antenna wire
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
US8413316B2 (en) 2007-09-18 2013-04-09 Hid Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate
EP2704186A1 (de) * 2012-08-27 2014-03-05 Garreth Finlay Verfahren zum Verlegen eines Drahtleiters auf einem Träger und zum Anschließen desselben an einem Chip
WO2014032970A1 (en) * 2012-08-27 2014-03-06 Garreth Finlay Method for laying a wire conductor onto a substrate and for connecting it to a chip

Also Published As

Publication number Publication date
SE429702B (sv) 1983-09-19
FR2400304B1 (de) 1982-02-12
IT7848473A0 (it) 1978-03-17
AT377890B (de) 1985-05-10
CH629058A5 (en) 1982-03-31
ZA775455B (en) 1978-07-26
AU3026177A (en) 1979-05-10
AU508357B2 (en) 1980-03-20
CA1102924A (en) 1981-06-09
IL54283A0 (en) 1978-06-15
IT1155890B (it) 1987-01-28
NL7806258A (nl) 1979-02-13
BR7707302A (pt) 1979-05-29
IL54283A (en) 1980-07-31
DE2811458C2 (de) 1983-12-29
SE7802720L (sv) 1979-02-10
FR2400304A1 (fr) 1979-03-09
JPS5430470A (en) 1979-03-06
DE2811458A1 (de) 1979-02-15
ATA183578A (de) 1984-09-15
JPS618596B2 (de) 1986-03-15

Similar Documents

Publication Publication Date Title
GB1593235A (en) Methods and apparatus for making scribed circuit boards
US4450623A (en) Process for the manufacture of circuit boards
US4693778A (en) Apparatus for making scribed circuit boards and circuit board modifications
US3342972A (en) Welding electrode assembly
US3204081A (en) Seam follower with arc scanning
US3700156A (en) Bonding head for bonding beam leaded devices to a substrate
GB1375536A (de)
CN109262692A (zh) 一种用于pcb板切割机的切割装置
US5653380A (en) Wire bonding apparatus and wire bonding method
US4505225A (en) Self-aligning apparatus for semiconductor lead frame processing means
GB2124835A (en) Current printed circuit boards
US3231967A (en) Wiring apparatus having improved wire-feeding means
JP2000094232A (ja) 高さ調整機構及びそれを用いたチップ実装装置
US3920949A (en) Beam leaded device welding machine
CN211152357U (zh) 一种自动化油墨粘涂设备
JP2849477B2 (ja) Ｉｃ部品の実装方法
JP2556918B2 (ja) Ｉｃ部品実装方法及びその装置
GB2100196A (en) Electrostatic recording head a method for manufacturing the same and an apparatus for practising this method
GB1308217A (en) Bonding
CN220445296U (zh) 一种辅助激光锡焊加工装置
US3504717A (en) Apparatus for cutting a continuously moving strip of material
JPH05245626A (ja) 溶融金属の噴流波高さ測定装置
JPH04219942A (ja) Ｉｃ部品のリード接合方法
JPH04165693A (ja) 導電性接着膜の圧着方法およびその装置
JPH07112117B2 (ja) 電子部品の搭載装置

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960314