GB1522408A - Gang bonding interconnect tape for semiconductive devices and method of making same - Google Patents

Gang bonding interconnect tape for semiconductive devices and method of making same

Info

Publication number
GB1522408A
GB1522408A GB27684/76A GB2768476A GB1522408A GB 1522408 A GB1522408 A GB 1522408A GB 27684/76 A GB27684/76 A GB 27684/76A GB 2768476 A GB2768476 A GB 2768476A GB 1522408 A GB1522408 A GB 1522408A
Authority
GB
United Kingdom
Prior art keywords
tape
lead
holes
die
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB27684/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of GB1522408A publication Critical patent/GB1522408A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB27684/76A 1975-07-07 1976-07-02 Gang bonding interconnect tape for semiconductive devices and method of making same Expired GB1522408A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59347775A 1975-07-07 1975-07-07

Publications (1)

Publication Number Publication Date
GB1522408A true GB1522408A (en) 1978-08-23

Family

ID=24374872

Family Applications (1)

Application Number Title Priority Date Filing Date
GB27684/76A Expired GB1522408A (en) 1975-07-07 1976-07-02 Gang bonding interconnect tape for semiconductive devices and method of making same

Country Status (6)

Country Link
JP (1) JPS6053463B2 (enrdf_load_stackoverflow)
BR (1) BR7603581A (enrdf_load_stackoverflow)
CA (1) CA1052912A (enrdf_load_stackoverflow)
DE (1) DE2630269A1 (enrdf_load_stackoverflow)
FR (1) FR2317853A1 (enrdf_load_stackoverflow)
GB (1) GB1522408A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137805A (en) * 1982-11-19 1984-10-10 Stanley Bracey Chip Carrier
GB2205683A (en) * 1987-04-08 1988-12-14 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same
US5038251A (en) * 1987-04-08 1991-08-06 Casio Computer Co., Ltd. Electronic apparatus and a method for manufacturing the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231154A (en) * 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
US4505225A (en) * 1983-08-31 1985-03-19 National Semiconductor Corporation Self-aligning apparatus for semiconductor lead frame processing means
DE3685125D1 (de) * 1985-01-31 1992-06-11 Hitachi Ltd Magnetischer blasenspeichermodul.
EP0213575B1 (en) * 1985-08-23 1992-10-21 Nec Corporation Method of manufacturing a semiconductor device employing a film carrier tape

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
DE2414297C3 (de) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137805A (en) * 1982-11-19 1984-10-10 Stanley Bracey Chip Carrier
GB2205683A (en) * 1987-04-08 1988-12-14 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same
GB2205683B (en) * 1987-04-08 1990-08-22 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same
US5038251A (en) * 1987-04-08 1991-08-06 Casio Computer Co., Ltd. Electronic apparatus and a method for manufacturing the same

Also Published As

Publication number Publication date
BR7603581A (pt) 1977-06-28
CA1052912A (en) 1979-04-17
JPS6053463B2 (ja) 1985-11-26
DE2630269A1 (de) 1977-01-27
JPS5210076A (en) 1977-01-26
FR2317853A1 (fr) 1977-02-04
FR2317853B1 (enrdf_load_stackoverflow) 1982-03-12

Similar Documents

Publication Publication Date Title
US3968563A (en) Precision registration system for leads
US4049903A (en) Circuit film strip and manufacturing method
JPS5826828B2 (ja) テ−プキヤリアの製造方法
GB1522408A (en) Gang bonding interconnect tape for semiconductive devices and method of making same
JPS5834952A (ja) 半導体装置用テ−プキヤリア
GB1471163A (en) Information marked microcircuit device and a method for fabricating the same
GB1476888A (en) Method for making printed circuitry
GB1261039A (en) Improvements relating to printed circuit assemblies
JPS5718347A (en) Mounting structure of ic
JPS5599731A (en) Method of assembling electronic device and lead frame used for assembly
JP2852703B2 (ja) フィルムキャリア
JPH021864Y2 (enrdf_load_stackoverflow)
JPS62186569A (ja) 電界効果型トランジスタの製造方法
GB1278927A (en) A method of manufacturing a lead frame for a semiconductor device
JPS5261480A (en) Production of lead frame for ic
JPS6046059A (ja) リ−ド・フレ−ム
JPS63263748A (ja) 半導体装置及びその製造方法
JPH02278785A (ja) フレキシブル回路基板
GB1320124A (en) Micro electronic circuits
JPS57130457A (en) Mass assembling method of semiconductor device
JPH039543A (ja) テープキャリアの製造方法
JPS57181143A (en) Manufacture of semiconductor device
GB1291236A (en) Improvements in or relating to magnetic alloys
JPH01147846A (ja) Ｉｃ用リードフレームの製造方法
JPH0396072U (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee