GB2205683B - An electronic apparatus and a method for manufacturing the same - Google Patents

An electronic apparatus and a method for manufacturing the same

Info

Publication number
GB2205683B
GB2205683B GB8808217A GB8808217A GB2205683B GB 2205683 B GB2205683 B GB 2205683B GB 8808217 A GB8808217 A GB 8808217A GB 8808217 A GB8808217 A GB 8808217A GB 2205683 B GB2205683 B GB 2205683B
Authority
GB
United Kingdom
Prior art keywords
manufacturing
same
electronic apparatus
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8808217A
Other versions
GB2205683A (en
GB8808217D0 (en
Inventor
Yoshinobu Sugiyama
Shohei Sawada
Takashi Hinooka
Kaoru Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62252361A external-priority patent/JPH0195596A/en
Priority claimed from JP62274930A external-priority patent/JP2521990B2/en
Priority claimed from JP62276439A external-priority patent/JPH01119099A/en
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of GB8808217D0 publication Critical patent/GB8808217D0/en
Publication of GB2205683A publication Critical patent/GB2205683A/en
Application granted granted Critical
Publication of GB2205683B publication Critical patent/GB2205683B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
    • G06F15/0216—Constructional details or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/216—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for button or coin cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/002—Legends replaceable; adaptable
    • H01H2219/01—Liquid crystal
    • H01H2219/011—Liquid crystal with integrated photo- or thermovoltaic cell as power supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2231/00—Applications
    • H01H2231/05—Card, e.g. credit card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
GB8808217A 1987-04-08 1988-04-08 An electronic apparatus and a method for manufacturing the same Expired - Fee Related GB2205683B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP8657287 1987-04-08
JP62252361A JPH0195596A (en) 1987-10-08 1987-10-08 Small-sized electronic equipment
JP62274930A JP2521990B2 (en) 1987-04-08 1987-10-30 Small electronic device and manufacturing method thereof
JP62276439A JPH01119099A (en) 1987-10-31 1987-10-31 Electronic instrument

Publications (3)

Publication Number Publication Date
GB8808217D0 GB8808217D0 (en) 1988-05-11
GB2205683A GB2205683A (en) 1988-12-14
GB2205683B true GB2205683B (en) 1990-08-22

Family

ID=27467281

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8808217A Expired - Fee Related GB2205683B (en) 1987-04-08 1988-04-08 An electronic apparatus and a method for manufacturing the same
GB8909117A Expired - Fee Related GB2217912B (en) 1987-04-08 1989-04-21 An electronic apparatus and a method for manufacturing the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB8909117A Expired - Fee Related GB2217912B (en) 1987-04-08 1989-04-21 An electronic apparatus and a method for manufacturing the same

Country Status (1)

Country Link
GB (2) GB2205683B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2664076A1 (en) * 1990-03-28 1992-01-03 Schlumberger Ind Sa METHOD FOR MANUFACTURING ELECTRONIC MEMORY CARD
KR101877569B1 (en) * 2012-03-05 2018-07-11 삼성에스디아이 주식회사 Secondary battery

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1522408A (en) * 1975-07-07 1978-08-23 Nat Semiconductor Corp Gang bonding interconnect tape for semiconductive devices and method of making same
GB2076223A (en) * 1980-05-20 1981-11-25 Gao Ges Automation Org A carrier element for an integrated circuit chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1522408A (en) * 1975-07-07 1978-08-23 Nat Semiconductor Corp Gang bonding interconnect tape for semiconductive devices and method of making same
GB2076223A (en) * 1980-05-20 1981-11-25 Gao Ges Automation Org A carrier element for an integrated circuit chip

Also Published As

Publication number Publication date
GB2205683A (en) 1988-12-14
GB8909117D0 (en) 1989-06-07
GB8808217D0 (en) 1988-05-11
GB2217912A (en) 1989-11-01
GB2217912B (en) 1990-08-22

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000408