FR2317853A1 - Ruban d'interconnexion pour liaison d'ensemble de dispositifs semi-conducteurs et procede de fabrication d'un tel ruban - Google Patents

Ruban d'interconnexion pour liaison d'ensemble de dispositifs semi-conducteurs et procede de fabrication d'un tel ruban

Info

Publication number
FR2317853A1
FR2317853A1 FR7620574A FR7620574A FR2317853A1 FR 2317853 A1 FR2317853 A1 FR 2317853A1 FR 7620574 A FR7620574 A FR 7620574A FR 7620574 A FR7620574 A FR 7620574A FR 2317853 A1 FR2317853 A1 FR 2317853A1
Authority
FR
France
Prior art keywords
tape
manufacturing
assembly
semiconductor devices
interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7620574A
Other languages
English (en)
French (fr)
Other versions
FR2317853B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of FR2317853A1 publication Critical patent/FR2317853A1/fr
Application granted granted Critical
Publication of FR2317853B1 publication Critical patent/FR2317853B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7620574A 1975-07-07 1976-07-06 Ruban d'interconnexion pour liaison d'ensemble de dispositifs semi-conducteurs et procede de fabrication d'un tel ruban Granted FR2317853A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59347775A 1975-07-07 1975-07-07

Publications (2)

Publication Number Publication Date
FR2317853A1 true FR2317853A1 (fr) 1977-02-04
FR2317853B1 FR2317853B1 (enrdf_load_stackoverflow) 1982-03-12

Family

ID=24374872

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7620574A Granted FR2317853A1 (fr) 1975-07-07 1976-07-06 Ruban d'interconnexion pour liaison d'ensemble de dispositifs semi-conducteurs et procede de fabrication d'un tel ruban

Country Status (6)

Country Link
JP (1) JPS6053463B2 (enrdf_load_stackoverflow)
BR (1) BR7603581A (enrdf_load_stackoverflow)
CA (1) CA1052912A (enrdf_load_stackoverflow)
DE (1) DE2630269A1 (enrdf_load_stackoverflow)
FR (1) FR2317853A1 (enrdf_load_stackoverflow)
GB (1) GB1522408A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0013562A1 (en) * 1979-01-10 1980-07-23 International Business Machines Corporation Method of making electronic packages
FR2551584A1 (fr) * 1983-08-31 1985-03-08 Nat Semiconductor Corp Appareil d'alignement automatique pour dispositif de traitement de flans de connexions de semi-conducteurs
EP0213575A3 (en) * 1985-08-23 1987-11-25 Nec Corporation Method of manufacturing a semiconductor device employing a film carrier tape
EP0190642A3 (en) * 1985-01-31 1989-03-15 Hitachi, Ltd. Magnetic bubble memory module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
KR910004797B1 (ko) * 1987-04-08 1991-07-13 가시오 게이상기 가부시기가이샤 소형 전자기기 및 그 제조방법
GB2205683B (en) * 1987-04-08 1990-08-22 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
FR2212642A1 (enrdf_load_stackoverflow) * 1973-01-02 1974-07-26 Texas Instruments Inc
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
FR2212642A1 (enrdf_load_stackoverflow) * 1973-01-02 1974-07-26 Texas Instruments Inc
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0013562A1 (en) * 1979-01-10 1980-07-23 International Business Machines Corporation Method of making electronic packages
FR2551584A1 (fr) * 1983-08-31 1985-03-08 Nat Semiconductor Corp Appareil d'alignement automatique pour dispositif de traitement de flans de connexions de semi-conducteurs
EP0190642A3 (en) * 1985-01-31 1989-03-15 Hitachi, Ltd. Magnetic bubble memory module
EP0213575A3 (en) * 1985-08-23 1987-11-25 Nec Corporation Method of manufacturing a semiconductor device employing a film carrier tape

Also Published As

Publication number Publication date
BR7603581A (pt) 1977-06-28
CA1052912A (en) 1979-04-17
JPS6053463B2 (ja) 1985-11-26
GB1522408A (en) 1978-08-23
DE2630269A1 (de) 1977-01-27
JPS5210076A (en) 1977-01-26
FR2317853B1 (enrdf_load_stackoverflow) 1982-03-12

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