GB1493905A - Polishing semiconductor surfaces - Google Patents

Polishing semiconductor surfaces

Info

Publication number
GB1493905A
GB1493905A GB31056/76A GB3105676A GB1493905A GB 1493905 A GB1493905 A GB 1493905A GB 31056/76 A GB31056/76 A GB 31056/76A GB 3105676 A GB3105676 A GB 3105676A GB 1493905 A GB1493905 A GB 1493905A
Authority
GB
United Kingdom
Prior art keywords
polishing
aqueous
weight
hydrogen peroxide
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB31056/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of GB1493905A publication Critical patent/GB1493905A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
GB31056/76A 1975-09-01 1976-07-26 Polishing semiconductor surfaces Expired GB1493905A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752538855 DE2538855A1 (de) 1975-09-01 1975-09-01 Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid

Publications (1)

Publication Number Publication Date
GB1493905A true GB1493905A (en) 1977-11-30

Family

ID=5955334

Family Applications (1)

Application Number Title Priority Date Filing Date
GB31056/76A Expired GB1493905A (en) 1975-09-01 1976-07-26 Polishing semiconductor surfaces

Country Status (6)

Country Link
US (1) US4064660A (enExample)
JP (1) JPS5230159A (enExample)
DE (1) DE2538855A1 (enExample)
FR (1) FR2322456A1 (enExample)
GB (1) GB1493905A (enExample)
NL (1) NL7608325A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184908A (en) * 1978-10-05 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Method for polishing cadmium sulfide semiconductors
JPS55113700A (en) * 1979-02-19 1980-09-02 Fujimi Kenmazai Kogyo Kk Polishing method for gadolinium gallium garnet single crystal
US4663890A (en) * 1982-05-18 1987-05-12 Gmn Georg Muller Nurnberg Gmbh Method for machining workpieces of brittle hard material into wafers
US4570071A (en) * 1983-12-27 1986-02-11 General Electric Company Ionization detector
US4613314A (en) * 1983-12-27 1986-09-23 General Electric Company Ionization detector
US4613313A (en) * 1983-12-27 1986-09-23 General Electric Company Ionization detector
JPS60139336A (ja) * 1983-12-27 1985-07-24 Otsuka Chem Co Ltd 飲料液の濾過方法
DE3517665A1 (de) * 1985-05-15 1986-11-20 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum polieren von siliciumscheiben
DE3735158A1 (de) * 1987-10-16 1989-05-03 Wacker Chemitronic Verfahren zum schleierfreien polieren von halbleiterscheiben
DE4311484A1 (de) * 1992-04-09 1993-10-14 Micron Technology Inc Verfahren zur Bildung einer leitfähigen Struktur auf der Oberfläche eines Substrats
DE69306049T2 (de) * 1992-06-19 1997-03-13 Rikagaku Kenkyusho Vorrichtung zum Schleifen von Spiegeloberfläche
JP3507628B2 (ja) * 1996-08-06 2004-03-15 昭和電工株式会社 化学的機械研磨用研磨組成物
JP4435391B2 (ja) * 2000-08-04 2010-03-17 扶桑化学工業株式会社 コロイド状シリカスラリー
US6756308B2 (en) * 2001-02-13 2004-06-29 Ekc Technology, Inc. Chemical-mechanical planarization using ozone
US7601643B1 (en) * 2001-08-30 2009-10-13 Lsi Logic Corporation Arrangement and method for fabricating a semiconductor wafer
US7485241B2 (en) * 2003-09-11 2009-02-03 Cabot Microelectronics Corporation Chemical-mechanical polishing composition and method for using the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997827A (en) * 1958-07-30 1961-08-29 Corning Glass Works Precision grinding
US3429080A (en) * 1966-05-02 1969-02-25 Tizon Chem Corp Composition for polishing crystalline silicon and germanium and process
US3527028A (en) * 1967-09-26 1970-09-08 Bell Telephone Labor Inc Preparation of semiconductor surfaces
DE1752163A1 (de) * 1968-04-11 1971-05-13 Wacker Chemie Gmbh Verfahren zum Polieren von Halbleiteroberflaechen
DE2247067C3 (de) * 1972-09-26 1979-08-09 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen
DE2305188A1 (de) * 1973-02-02 1974-08-08 Wacker Chemitronic Verfahren zur herstellung von polierten halbleiteroberflaechen

Also Published As

Publication number Publication date
NL7608325A (nl) 1977-03-03
DE2538855A1 (de) 1977-03-10
JPS5230159A (en) 1977-03-07
US4064660A (en) 1977-12-27
JPS5410824B2 (enExample) 1979-05-10
FR2322456A1 (fr) 1977-03-25
FR2322456B1 (enExample) 1978-06-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee