GB1426873A - Methods of pressure bonding a ceramic member to another member - Google Patents
Methods of pressure bonding a ceramic member to another memberInfo
- Publication number
- GB1426873A GB1426873A GB2068772A GB2068772A GB1426873A GB 1426873 A GB1426873 A GB 1426873A GB 2068772 A GB2068772 A GB 2068772A GB 2068772 A GB2068772 A GB 2068772A GB 1426873 A GB1426873 A GB 1426873A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- gold
- silver
- tons
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 title abstract 8
- 238000000034 method Methods 0.000 title abstract 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 9
- 229910052737 gold Inorganic materials 0.000 abstract 9
- 239000010931 gold Substances 0.000 abstract 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 8
- 229910052751 metal Inorganic materials 0.000 abstract 6
- 239000002184 metal Substances 0.000 abstract 6
- 229910000679 solder Inorganic materials 0.000 abstract 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 5
- 229910052709 silver Inorganic materials 0.000 abstract 5
- 239000004332 silver Substances 0.000 abstract 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 4
- 229910052763 palladium Inorganic materials 0.000 abstract 4
- 239000011888 foil Substances 0.000 abstract 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052793 cadmium Inorganic materials 0.000 abstract 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910052738 indium Inorganic materials 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 239000010959 steel Substances 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- CSBHIHQQSASAFO-UHFFFAOYSA-N [Cd].[Sn] Chemical compound [Cd].[Sn] CSBHIHQQSASAFO-UHFFFAOYSA-N 0.000 abstract 1
- 239000006096 absorbing agent Substances 0.000 abstract 1
- 239000010425 asbestos Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 229910052895 riebeckite Inorganic materials 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/122—Metallic interlayers based on refractory metals
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/405—Iron metal group, e.g. Co or Ni
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/59—Aspects relating to the structure of the interlayer
- C04B2237/592—Aspects relating to the structure of the interlayer whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/82—Two substrates not completely covering each other, e.g. two plates in a staggered position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2068772A GB1426873A (en) | 1972-05-03 | 1972-05-03 | Methods of pressure bonding a ceramic member to another member |
DE19732318727 DE2318727C3 (de) | 1972-05-03 | 1973-04-13 | Verfahren zum Verbinden eines kermaischen Körpers mit einem anderen Körper |
NL7305890A NL7305890A (de) | 1972-05-03 | 1973-04-27 | |
IT6820273A IT984490B (it) | 1972-05-03 | 1973-04-30 | Procedimento di unione a pressio ne particolarmente di elemento ceramico ad un altro elemento me tallico o ceramico |
JP4766473A JPS4948707A (de) | 1972-05-03 | 1973-05-01 | |
FR7315883A FR2183213B1 (de) | 1972-05-03 | 1973-05-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2068772A GB1426873A (en) | 1972-05-03 | 1972-05-03 | Methods of pressure bonding a ceramic member to another member |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1426873A true GB1426873A (en) | 1976-03-03 |
Family
ID=10150010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2068772A Expired GB1426873A (en) | 1972-05-03 | 1972-05-03 | Methods of pressure bonding a ceramic member to another member |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS4948707A (de) |
DE (1) | DE2318727C3 (de) |
FR (1) | FR2183213B1 (de) |
GB (1) | GB1426873A (de) |
IT (1) | IT984490B (de) |
NL (1) | NL7305890A (de) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2502722A1 (fr) * | 1981-03-26 | 1982-10-01 | Sperry Ltd | Procede de realisation d'un joint hermetique pour gyroscope a laser, joint realise et gyroscope ainsi equipe |
GB2132601A (en) * | 1982-12-23 | 1984-07-11 | Ferranti Plc | Joining articles of materials of different expansion coefficients |
US4785988A (en) * | 1986-11-20 | 1988-11-22 | Methode Electronics, Inc. | Attachment of lead to elongated conductor |
WO1994008539A1 (en) * | 1992-10-20 | 1994-04-28 | Cochlear Pty. Ltd. | Package and method of construction |
US6730848B1 (en) | 2001-06-29 | 2004-05-04 | Antaya Technologies Corporation | Techniques for connecting a lead to a conductor |
WO2004079762A3 (en) * | 2003-03-03 | 2005-01-13 | Koninkl Philips Electronics Nv | X-ray tube cathode assembly and interface reaction joining process |
US8644935B2 (en) | 2007-04-23 | 2014-02-04 | Cochlear Limited | Methods of forming sealed devices containing heat sensitive components |
CN105364284A (zh) * | 2015-12-04 | 2016-03-02 | 西北工业大学 | 一种氧化锆或氧化锆基复合材料的低温快速焊接方法 |
US10752557B2 (en) | 2014-01-24 | 2020-08-25 | Raytheon Technologies Corporation | Method of bonding a metallic component to a non-metallic component using a compliant material |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2333358A1 (fr) * | 1975-11-28 | 1977-06-24 | Comp Generale Electricite | Generateur electrochimique du type soufre-sodium |
GB1574804A (en) * | 1976-05-20 | 1980-09-10 | Chloride Silent Power Ltd | Metal-to-ceramic seals |
US4262300A (en) * | 1978-11-03 | 1981-04-14 | Isotronics, Inc. | Microcircuit package formed of multi-components |
JPS5713024A (en) * | 1980-06-30 | 1982-01-23 | Nanbu Denki Seisakusho:Kk | Grip releasing device in article grip conveyor |
JPS58135783A (ja) * | 1982-02-05 | 1983-08-12 | Shin Meiwa Ind Co Ltd | 拡散接合方法 |
ZA831948B (en) * | 1982-03-31 | 1983-11-30 | De Beers Ind Diamond | Abrasive bodies |
JPS58181771A (ja) * | 1982-04-16 | 1983-10-24 | 新明和工業株式会社 | 拡散接合方法およびこの方法による複合体 |
JPS58190880A (ja) * | 1982-04-30 | 1983-11-07 | 昭和アルミニウム株式会社 | アルミニウム材とセラミツクス材との接合方法 |
JPS58219977A (ja) * | 1982-06-14 | 1983-12-21 | アンリツ株式会社 | 仕分け装置 |
JPS58219976A (ja) * | 1982-06-14 | 1983-12-21 | アンリツ株式会社 | 仕分け装置 |
JPS5916282A (ja) * | 1982-07-19 | 1984-01-27 | Yuasa Battery Co Ltd | ナトリウム−硫黄電池の製造法 |
DE3233022A1 (de) * | 1982-09-06 | 1984-03-08 | BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau | Verfahren zum direkten verbinden eines koerpers mit einem keramischen substrat |
JPS5957972A (ja) * | 1982-09-27 | 1984-04-03 | 新明和工業株式会社 | 拡散接合方法 |
JPS59217683A (ja) * | 1983-05-25 | 1984-12-07 | 新明和工業株式会社 | 拡散接合方法 |
NL8303109A (nl) * | 1983-09-08 | 1985-04-01 | Philips Nv | Werkwijze voor het aan elkaar bevestigen van twee delen. |
DE3340424A1 (de) * | 1983-11-09 | 1985-05-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | Elektrochemische speicherzelle |
FR2559474B1 (fr) * | 1984-02-15 | 1988-12-23 | Quantel Sa | Procede de scellement etanche et etuvable d'objets metalliques sur un corps en materiau vitroceramique |
JPS60197516A (ja) * | 1984-03-15 | 1985-10-07 | Kaindo Uea:Kk | 布地ハンガ−の解除装置及び布地回収装置 |
DE3608559A1 (de) * | 1986-03-14 | 1987-09-17 | Kernforschungsanlage Juelich | Verfahren zum verbinden von formteilen aus sic mit keramik oder metall und zur oberflaechenbehandlung von sisic sowie eine zum verbinden brauchbare legierung |
US4895291A (en) * | 1989-05-04 | 1990-01-23 | Eastman Kodak Company | Method of making a hermetic seal in a solid-state device |
JPH0349834A (ja) * | 1989-07-14 | 1991-03-04 | Sumitomo Electric Ind Ltd | 金を接合材とする工具及びその製造方法 |
EP0435423B1 (de) * | 1989-12-20 | 1995-03-29 | Sumitomo Electric Industries, Ltd. | Verbindungswerkzeug |
-
1972
- 1972-05-03 GB GB2068772A patent/GB1426873A/en not_active Expired
-
1973
- 1973-04-13 DE DE19732318727 patent/DE2318727C3/de not_active Expired
- 1973-04-27 NL NL7305890A patent/NL7305890A/xx unknown
- 1973-04-30 IT IT6820273A patent/IT984490B/it active
- 1973-05-01 JP JP4766473A patent/JPS4948707A/ja active Pending
- 1973-05-03 FR FR7315883A patent/FR2183213B1/fr not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2502722A1 (fr) * | 1981-03-26 | 1982-10-01 | Sperry Ltd | Procede de realisation d'un joint hermetique pour gyroscope a laser, joint realise et gyroscope ainsi equipe |
GB2132601A (en) * | 1982-12-23 | 1984-07-11 | Ferranti Plc | Joining articles of materials of different expansion coefficients |
US4930676A (en) * | 1982-12-23 | 1990-06-05 | Ferranti International Plc | Joint between articles of materials of different coefficients of thermal expansion |
US4785988A (en) * | 1986-11-20 | 1988-11-22 | Methode Electronics, Inc. | Attachment of lead to elongated conductor |
WO1994008539A1 (en) * | 1992-10-20 | 1994-04-28 | Cochlear Pty. Ltd. | Package and method of construction |
US5562716A (en) * | 1992-10-20 | 1996-10-08 | Cochlear Limited | Package and method of construction |
US6730848B1 (en) | 2001-06-29 | 2004-05-04 | Antaya Technologies Corporation | Techniques for connecting a lead to a conductor |
WO2004079762A3 (en) * | 2003-03-03 | 2005-01-13 | Koninkl Philips Electronics Nv | X-ray tube cathode assembly and interface reaction joining process |
US7209544B2 (en) | 2003-03-03 | 2007-04-24 | Koninklijke Philips Electronics, N.V. | X-ray tube cathode assembly and interface reaction joining process |
US8644935B2 (en) | 2007-04-23 | 2014-02-04 | Cochlear Limited | Methods of forming sealed devices containing heat sensitive components |
US10752557B2 (en) | 2014-01-24 | 2020-08-25 | Raytheon Technologies Corporation | Method of bonding a metallic component to a non-metallic component using a compliant material |
CN105364284A (zh) * | 2015-12-04 | 2016-03-02 | 西北工业大学 | 一种氧化锆或氧化锆基复合材料的低温快速焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2183213A1 (de) | 1973-12-14 |
FR2183213B1 (de) | 1976-07-23 |
DE2318727A1 (de) | 1973-11-15 |
NL7305890A (de) | 1973-11-06 |
IT984490B (it) | 1974-11-20 |
DE2318727C3 (de) | 1982-04-29 |
JPS4948707A (de) | 1974-05-11 |
DE2318727B2 (de) | 1981-06-19 |
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Legal Events
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PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |