GB1425298A - Electroless deposition of copper - Google Patents

Electroless deposition of copper

Info

Publication number
GB1425298A
GB1425298A GB1480474A GB1480474A GB1425298A GB 1425298 A GB1425298 A GB 1425298A GB 1480474 A GB1480474 A GB 1480474A GB 1480474 A GB1480474 A GB 1480474A GB 1425298 A GB1425298 A GB 1425298A
Authority
GB
United Kingdom
Prior art keywords
alkyl
compound
aralkyl
april
aryl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1480474A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1425298A publication Critical patent/GB1425298A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
GB1480474A 1973-04-04 1974-04-03 Electroless deposition of copper Expired GB1425298A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (zh) 1973-04-04 1973-04-04

Publications (1)

Publication Number Publication Date
GB1425298A true GB1425298A (en) 1976-02-18

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1480474A Expired GB1425298A (en) 1973-04-04 1974-04-03 Electroless deposition of copper

Country Status (11)

Country Link
JP (1) JPS5334102B2 (zh)
AT (1) AT326970B (zh)
BE (1) BE813195A (zh)
CA (1) CA1021103A (zh)
CH (1) CH606473A5 (zh)
DE (1) DE2414650C3 (zh)
FR (1) FR2224555B1 (zh)
GB (1) GB1425298A (zh)
IT (1) IT1010903B (zh)
NL (1) NL7304650A (zh)
SE (1) SE392737B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
WO2003085167A1 (de) * 2002-04-04 2003-10-16 Chemetall Gmbh Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür
US20130295294A1 (en) * 2012-05-07 2013-11-07 C. Uyemura & Co., Ltd. Electroless copper plating bath and electroless copper plating method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (nl) * 1974-02-22 1975-08-26 Philips Nv Universele verkoperingsoplossing.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
WO2003085167A1 (de) * 2002-04-04 2003-10-16 Chemetall Gmbh Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür
US7282088B2 (en) 2002-04-04 2007-10-16 Chemetall Gmbh Method for copper-plating or bronze-plating an object and liquid mixtures therefor
CN100365163C (zh) * 2002-04-04 2008-01-30 坎梅陶尔股份有限公司 对物体镀铜或镀青铜的方法和用于该方法的液态混合物
US20130295294A1 (en) * 2012-05-07 2013-11-07 C. Uyemura & Co., Ltd. Electroless copper plating bath and electroless copper plating method
CN103388138A (zh) * 2012-05-07 2013-11-13 上村工业株式会社 非电解镀铜浴和非电解镀铜方法
CN103388138B (zh) * 2012-05-07 2018-07-24 上村工业株式会社 非电解镀铜浴和非电解镀铜方法

Also Published As

Publication number Publication date
FR2224555B1 (zh) 1976-12-17
AT326970B (de) 1976-01-12
JPS49129638A (zh) 1974-12-12
DE2414650B2 (de) 1978-03-16
NL7304650A (zh) 1974-10-08
FR2224555A1 (zh) 1974-10-31
DE2414650A1 (de) 1974-10-17
SE392737B (sv) 1977-04-18
CA1021103A (en) 1977-11-22
DE2414650C3 (de) 1978-11-16
BE813195A (fr) 1974-10-02
ATA266674A (de) 1975-03-15
IT1010903B (it) 1977-01-20
JPS5334102B2 (zh) 1978-09-19
CH606473A5 (zh) 1978-10-31

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee